Alain E. Kaloyeros
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Convicted felon and physicist
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Why Is Alain E. Kaloyeros Influential?
(Suggest an Edit or Addition)According to Wikipedia, Alain E. Kaloyeros is an American physicist and was the founding president and chief executive officer of the SUNY Polytechnic Institute in Utica, New York. Early life and education Kaloyeros was born in Beirut to a Lebanese mother and Greek father. His family is Greek Orthodox Christian. He attended Lebanese University and graduated with a License D’Enseignement in Mathematics and Physics with honors and left Lebanon in 1980 for graduate school in Florida at the University of Miami, and he transferred to the University of Illinois, Urbana-Champaign. Kaloyeros graduated from The University of Illinois, Urbana-Champaign with a doctorate in Experimental Condensed Matter Physics in 1987 with a perfect grade point average of 5.000/5.000. Kaloyeros has authored and co-authored over 200 scientific articles in technical journals and contributed to 8 books on topics pertaining to the science and technology of nanotechnology, nanoelectronics, nano-optoelectronics, nano-medicine, and green energy. His technical focus was in ultrathin film materials and structures, atomic layer vapor phase deposition processes, and nanoscale x-ray, electron, and photon-based characterization and metrology. He advised more than 36 Ph.D. and over 100 Masters students. His work has been referenced in over 4,700 citations by his peers in scientific and technical publications. He was awarded 14 U.S. and international patents.
Alain E. Kaloyeros's Published Works
Number of citations in a given year to any of this author's works
Total number of citations to an author for the works they published in a given year. This highlights publication of the most important work(s) by the author
Published Works
- Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization (2000) (322)
- Advanced multilayer metallization schemes with copper as interconnection metal (1993) (219)
- Review—Silicon Nitride and Silicon Nitride-Rich Thin Film Technologies: Trends in Deposition Techniques and Related Applications (2017) (86)
- Tantalum Nitride Films Grown by Inorganic Low Temperature Thermal Chemical Vapor Deposition Diffusion Barrier Properties in Copper Metallization (1999) (79)
- Organometallic Route to the Chemical Vapor Deposition of Titanium Carbide Films at Exceptionally Low Temperatures (1987) (69)
- White light emission from amorphous silicon oxycarbide (a-SiCxOy) thin films: Role of composition and postdeposition annealing (2010) (62)
- Development of antifouling surfaces to reduce bacterial attachment (2013) (58)
- Comparative study of the effects of thermal treatment on the optical properties of hydrogenated amorphous silicon-oxycarbide (2007) (47)
- Chemical Vapor Deposition of Copper for Multilevel Metallization (1993) (45)
- The Effects of Processing Parameters in the Chemical Vapor Deposition of Cobalt from Cobalt Tricarbonyl Nitrosyl (1999) (44)
- Low temperature metal-organic chemical vapor deposition of tungsten nitride as diffusion barrier for copper metallization (1999) (43)
- Device‐quality copper using chemical vapor deposition of β‐diketonate source precursors in liquid solution (1992) (42)
- Bilayer fibril formation by genetically engineered polypeptides: preparation and characterization. (2006) (41)
- Metalorganic chemical vapor deposition of titanium oxide for microelectronics applications (2001) (39)
- The origin of white luminescence from silicon oxycarbide thin films (2014) (39)
- Efficient energy transfer from silicon oxycarbide matrix to Er ions via indirect excitation mechanisms (2007) (37)
- Review—Silicon Nitride and Silicon Nitride-Rich Thin Film Technologies: State-of-the-Art Processing Technologies, Properties, and Applications (2020) (36)
- Properties of ultrathin platinum deposited by atomic layer deposition for nanoscale copper-metallization schemes (2007) (34)
- Atomic layer deposition of tantalum nitride for ultrathin liner applications in advanced copper metallization schemes (2004) (33)
- Interlayer Mediated Epitaxy of Cobalt Silicide on Silicon (100) from Low Temperature Chemical Vapor Deposition of Cobalt Formation Mechanisms and Associated Properties (2001) (32)
- Thermal stability of on-chip copper interconnect structures (1995) (32)
- A novel microfluidic device for the in situ optical and mechanical analysis of bacterial biofilms. (2012) (31)
- Barrier Properties of Titanium Nitride Films Grown by Low Temperature Chemical Vapor Deposition from Titanium Tetraiodide (1997) (29)
- Spiral growth in epitaxial YBa2Cu3O7−x thin films produced by high deposition rate chemical vapor deposition (1993) (29)
- A wafer-scale 3D IC technology platform using dielectric bonding glues and copper damascene patterned inter-wafer interconnects (2002) (28)
- Editors' Choice—Review—Cobalt Thin Films: Trends in Processing Technologies and Emerging Applications (2019) (27)
- Low temperature plasma-assisted chemical vapor deposition of tantalum nitride from tantalum pentabromide for copper metallization (1999) (26)
- Photoluminescence in erbium doped amorphous silicon oxycarbide thin films (2005) (26)
- Influence of defects on electrical and optical characteristics of GaN/InGaN-based light-emitting diodes (2002) (26)
- Using Sputter Deposition to Increase CO Tolerance in a Proton-Exchange Membrane Fuel Cell (2002) (26)
- Electrochemical characteristics of amorphous titanium carbide films produced by low-temperature metal-organic chemical vapor deposition (MOCVD) (1987) (25)
- Amorphous transition metal carbides (1986) (25)
- Optical and structural characterization of thermal oxidation effects of erbium thin films deposited by electron beam on silicon (2012) (25)
- Chemical vapor deposition of copper from CuI hexafluoroacetylacetonate trimethylvinylsilane for ultralarge scale integration applications (1996) (24)
- Profile simulation of conformality of chemical vapor deposited copper in subquarter-micron trench and via structures (1997) (23)
- Low temperature metalorganic chemical vapor deposition of conformal silver coatings for applications in high aspect ratio structures (2001) (23)
- Spectroellipsometric characterization of Au-Y2O3-stabilized ZrO2 nanocomposite films (2005) (22)
- On the effects of thermal treatment on the composition, structure, morphology, and optical properties of hydrogenated amorphous silicon-oxycarbide (2009) (22)
- The first metal complex containing a silylated β-diketonate ligand: bis(2,2,6,6-tetramethyl-2-sila-3,5-heptanedionato) copper(II) (2001) (18)
- Low temperature inorganic chemical vapor deposition of Ti-Si-N diffusion barrier liners for gigascale copper interconnect applications (2000) (18)
- Emerging technologies for chip-level optical interconnects (2002) (17)
- Time-resolved analysis of the white photoluminescence from chemically synthesized SiCxOy thin films and nanowires (2016) (17)
- Low-temperature chemical vapor deposition of tantalum nitride from tantalum pentabromide for integrated circuitry copper metallization applications (1999) (16)
- In situ mass spectral and IR studies of the role of auxiliary reagents in the enhancement of copper growth in the chemical vapor deposition of Cu(II) β-diketonate precursors (1995) (16)
- Strong visible light emission from silicon-oxycarbide nanowire arrays prepared by electron beam lithography and reactive ion etching (2015) (16)
- CVD of Tantalum Oxide Dielectric Thin Films for Nanoscale Device Applications (2004) (15)
- Chemical vapor deposition of ruthenium and ruthenium oxide thin films for advanced complementary metal-oxide semiconductor gate electrode applications (2004) (15)
- Silicon Oxycarbide Thin films and Nanostructures: Synthesis, Properties and Applications (2017) (15)
- ZERO THICKNESS DIFFUSION BARRIERS AND METALLIZATION LINERS FOR NANOSCALE DEVICE APPLICATIONS (2011) (15)
- Enhanced growth of device-quality copper by hydrogen plasma-assisted chemical vapor deposition (1992) (14)
- Chemical Vapor Deposition of ZnS:Mn for Thin-Film Electroluminescent Display Applications (2004) (14)
- In Situ Mass Spectral and Infrared Studies of the Gas‐Phase Evolution and Decomposition Pathways of Cu II ( hfac ) 2 Application in the Development of Plasma‐Assisted Chemical Vapor Deposition of Copper (1995) (14)
- Synthesis and characterization of volatile bismuth .beta.-diketonate compounds for metal-organic chemical vapor deposition of thin films (1992) (14)
- Adhesion Energy Measurements of Multilayer Low-K Dielectric Materials for ULSI Applications (1998) (13)
- SYNTHESIS AND CHARACTERIZATION OF POLYFLUORINATED β-DIKETONATE TRANSITION METAL COMPLEXES1,2 (1996) (13)
- On the effect of processing parameters in the chemical‐vapor deposition of YBa2Cu3O7−δ thin films on polycrystalline silver (1993) (13)
- Tantalum diffusion barrier grown by inorganic plasma-promoted chemical vapor deposition: Performance in copper metallization (2000) (12)
- High‐quality Y1Ba2Cu3O7−x thin films on polycrystalline MgO by temperature‐controlled chemical vapor deposition (1991) (12)
- Remote plasma chemical vapor deposition of copper for applications in microelectronics (1992) (11)
- In situ quadrupole mass spectroscopy studies of water and solvent coordination to copper(II) β-diketonate precursors: implications for the chemical vapor deposition of copper (1995) (11)
- Blue- and green-emitting SrS:Cu electroluminescent devices deposited by the atomic layer deposition technique (2003) (11)
- Low temperature plasma-promoted chemical vapor deposition of tantalum from tantalum pentabromide for copper metallization (1998) (10)
- Silicon Nitride and Silicon Nitride-Rich Thin Film Technologies : Trends in Deposition Techniques and Related Applications (2017) (10)
- Microstructural and electrical characterization of gas cluster ion beam-smoothed YBCO films (2003) (9)
- Review—Cobalt Thin Films: Trends in Processing Technologies and Emerging Applications (2019) (9)
- Material and process studies in the integration of plasma-promoted chemical-vapor deposition of aluminum with benzocyclobutene low-dielectric constant polymer (2000) (9)
- The Effects of Processing Parameters in the Low‐Temperature Chemical Vapor Deposition of Titanium Nitride from Tetraiodotitanium (1998) (9)
- Integration of PECVD Tungsten Nitride as a Barrier Layer for Copper Metallization (1999) (9)
- Study of copper-refractory metal interfaces via solid-state wetting for emerging nanoscale interconnect applications (2006) (8)
- Integrated plasma-promoted chemical vapor deposition route to aluminum interconnect and plug technologies for emerging computer chip metallization (1997) (8)
- Thermal annealing effects on photoluminescence properties of carbon-doped silicon-rich oxide thin films implanted with erbium (2011) (8)
- Photoluminescence at 1540 nm from erbium-doped amorphous silicon carbide films (2004) (8)
- In Situ Pulsed Deposition Studies of Ce ( tmhd ) 4 on SrS Surfaces for Thin Film Electroluminescent Flat Panel Display Applications (1998) (7)
- Method for the preparation of protective coatings by low‐temperature metal–organic chemical vapor deposition (MOCVD) (1988) (7)
- Metallorganic Chemical Vapor Deposition of Hafnium Silicate Thin Films Using a Dual Source Dimethyl-alkylamido Approach (2006) (7)
- The 2,2,6,6-Tetramethyl-2-Sila-3,5-Heptanedione Route to the Chemical Vapor Deposition of Copper for Gigascale Interconnect Applications (2000) (7)
- Ultra Thin Sacrificial Diffusion Barriers - Control of Diffusion Across the Cu-SiO 2 Interface (1993) (6)
- Amorphous Titanium Carbide Films Produced by Low‐Temperature Organometallic CVD (1987) (6)
- IN-SITU Analysis Of The Microstructure of Thermally Treated Thin Copper Films (1993) (6)
- Integration of chemical vapor deposition Al interconnects in a benzocyclobutene low dielectric constant polymer matrix: A feasibility study (2000) (6)
- Blanket and Selective Copper CVD from Cu (Fod) 2 For Multilevel Metallization (1990) (6)
- Wheel Abrasion Experiment Metals Selection for Mars Pathfinder Mission (1996) (6)
- Nucleotide-driven packaging of a singlet oxygen generating porphyrin in an icosahedral virus (2012) (6)
- Copper Metallization Manufacturing Issues for Future ICs (1994) (5)
- Metallorganic Chemical Vapor Deposition of SrS:Ce for Thin Film Electroluminescent Device Applications (2000) (5)
- Conformational Molecular Switches for Post-CMOS Nanoelectronics (2007) (5)
- Thermal Chemical Vapor Deposition of Silicon Carbide Films as Protective Coatings for Microfluidic Structures (2002) (4)
- The Effect of Grain Boundaries and Substrate Interactions with Hydrogen on the CVD Growth of Device-Quality Copper. (1991) (4)
- Application of molecular (static) secondary ion mass spectroscopy to detection of organic molecules in amorphous titanium carbide (1987) (4)
- Microstructure and Optical Properties of Au–Y 2 O 3 -stabilized ZrO 2 Nanocomposite Films (2005) (4)
- Characterization of Ruthenium and Ruthenium Oxide Thin Films deposited by Chemical Vapor Deposition for CMOS Gate Electrode Applications (2002) (4)
- Mocvd SrS:Ce for Applications in Electroluminescent Devices (1997) (4)
- Study by Extended X‐ray Absorption Fine Structure Technique and Microscopy of the Amorphous State of Titanium Diboride Thin Films (1988) (4)
- Low-temperature metalorganic chemical vapor deposition of Al2O3 for advanced complementary metal-oxide semiconductors gate dielectric applications (2003) (4)
- Barrier Properties of Titanium Nitride Films Grown by Low Temperature Chemical Vapor Deposition from Titanium Tetraiodide. (1997) (4)
- Atomic layer deposition (ALD) of tantalum-based materials for zero thickness copper barrier applications (2001) (4)
- Exploiting nanotechnology for Terahertz Interconnects (2003) (4)
- Platinum Liner Deposited by Atomic Layer Deposition for Cu Interconnect Application (2006) (3)
- ChemInform Abstract: Interlayer Mediated Epitaxy of Cobalt Silicide on Silicon (100) from Low Temperature Chemical Vapor Deposition of Cobalt. (2001) (3)
- Defect- and H-Free Stoichiometric Silicon Carbide by Thermal CVD from the Single Source Precursor Trisilacyclohexane (2022) (3)
- Electrical Properties of Ultrathin Al 2 O 3 Films Grown by Metalorganic Chemical Vapor Deposition for Advanced Complementary Metal-oxide Semiconductor Gate Dielectric Applications (2005) (3)
- Hydridosilane Modification of Metals: An Exploratory Study (2011) (3)
- Emerging Molecular and Atomic Level Techniques for Nanoscale Applications (2019) (3)
- Observation of Reduced Oxidation Rates for Plasmaassisted CVD Copper Films (1993) (3)
- Synthesis and Exploratory Deposition Studies of Isotetrasilane and Reactive Intermediates for Epitaxial Silicon. (2019) (3)
- Controlling Interfacial Adhesion of Self-Assembled Polypeptide Fibrils for Novel Nanoelectromechanical System (NEMS) Applications (2011) (3)
- Chemical Vapor Deposition Route to the Fabrication of thin Films of High Temperature Oxide Superconductors (1989) (2)
- A study of ruthenium ultrathin film nucleation on pretreated SiO 2 and Hf–silicate dielectric surfaces (2007) (2)
- Application of characteristic secondary ion mass spectroscopy to phase identification in amorphous titanium carbide (1986) (2)
- Near-Room-Temperature Soft Plasma Pulsed Deposition of SiCxNy from 1,3,5-tri(isopropyl)cyclotrisilazane (2020) (2)
- Thin-film Deposition of Silicon Nitrides and Oxides from Trihydridosilanes (2014) (2)
- Silicon Nitride Films Deposited by Atmospheric Pressure Chemical Vapor Deposition (1997) (2)
- Strong photoluminescence at 1540 nm from Er-doped amorphous silicon oxycarbide: a novel silicon material for photonic applications (2008) (2)
- Low Temperature Thermal Chemical Vapor Deposition of Silicon Nitride Thin Films for Microelectronics Applications (1999) (2)
- Thermal and electrical barrier performance testing of ultrathin atomic layer deposition tantalum-based materials for nanoscale copper metallization (2002) (2)
- Atomic Layer Deposition of Tantalum Nitride on Organosilicate and Organic Polymerbased Low Dielectric Constant Materials (2004) (2)
- Deposition of barrier layer and CVD copper under no exposed wafer conditions: adhesion performance and process integration (1997) (2)
- Room-temperature Photoluminescence at 1540 nm from Amorphous Silicon Carbide Films Implanted with Erbium (2004) (2)
- Metallization of a genetically engineered polypeptide. (2012) (2)
- High-performance interconnects for on-chip device integration (1997) (2)
- MS2 bacteriophage as a delivery vessel of porphyrins for photodynamic therapy (2011) (2)
- In Situ Studies of the Nucleation Mechanisms of Tris(cyclopentadienyl)Cerium as Cerium Dopant Source in SrS:Ce Thin Films for Electroluminescent Displays (2001) (2)
- Metal‐organic chemical vapor deposition (MOCVD) of high temperature superconductors with enhanced critical current (2008) (1)
- Design, fabrication, and characterization of polymeric bioMEMS for the detection of feline immunodeficiency virus (FIV) (2007) (1)
- Copper Electroplating on Zero-Thickness ALD Platinum for Nanoscale Computer Chip Interconnects (2006) (1)
- Low Temperature Metal Organic Chemical Vapor Deposition (LTMOCVD) of Electronic Materials (1989) (1)
- Fabrication of biaxially-textured thick firm Y-Ba-Cu-Ok superconductor by MOCVD on cube-textured metal substrates (1996) (1)
- The Distribution of Phosphorus in Romano-British Ironwork (1990) (1)
- Vapor phase processing of HTS films for technological application (2008) (1)
- Low Temperature Metal Organic Chemical Vapor Deposition of Aluminum Oxide Thin Films for Advanced CMOS Gate Dielectric Applications (2002) (1)
- Synthesis and Spectroellipsometric Characterization of Y 2 O 3 -stabilized ZrO 2 -Au Nanocomposite Films for Smart Sensor Applications (2004) (1)
- Self-Assembled Quantum Dots: Atomic Scale Engineering (2014) (1)
- Long-Chain Organofunctional Silanes: Synthesis and Surface Derivatization (2011) (1)
- The low-temperature remote-plasma-activated pulsed chemical vapor deposition route to SiNx from 1,3,5-tri(isopropyl)cyclotrisilazane (2020) (1)
- Chaotic behavior of channeling particles. (1994) (1)
- High Tc conductors by MOCVD on silver substrates (2008) (1)
- (Invited) Atomic Level Precision in Near-Zero Thickness Thin Film Deposition Through Chemistry and Process Innovation (2021) (0)
- High quality Y1Ba2Cu3O7−δ ultrathin films produced in situ by high growth rate chemical vapor deposition (1993) (0)
- MOCVD ZnS: Mn films: Crystal structure and defect microstructure as a function of the growth parameters (2001) (0)
- TANTALUM AMIDE PRECURSORS FOR (2017) (0)
- A process for the production of thin films on silicon-nitrogen-based (1998) (0)
- Optimization of Ultrathin ALD Tantalum Nitride Films for Zero-Thickness Liner Applications (2002) (0)
- ALD: Emerging Materials, Processes, and Nanoscale Technology Applications (2006) (0)
- Influence of carbon content on photoluminescence properties of erbium-doped silicon oxycarbide thin films (2008) (0)
- Physical Properties and Diffusion Characteristics of CVD-Grown TiSiN Films (2001) (0)
- Erratum: “Low temperature metalorganic chemical vapor deposition of tungsten nitride as diffusion barrier for copper metallization” [J. Vac. Sci. Technol. B 17, 1101 (1999)] (1999) (0)
- Ion beam radiation effects on InAs semiconductor quantum dots (2000) (0)
- A Study of Amorphous Hydrogenated Titanium-Carbide Films: Structure, Stability, and Role of Hydrogen Doping (1987) (0)
- Integrated circuitry (2003) (0)
- Silicon-based layers formed of iodosilane precursor and methods to achieve selbiges (1998) (0)
- MS2 Bacteriophage as a Biotemplate for Semiconductor Nanoparticle Synthesis (2009) (0)
- Interface Quality and Electrical Performance of Low-Temperature Metal Organic Chemical Vapor Deposition Aluminum Oxide Thin Films for Advanced CMOS Gate Dielectric Applications (2002) (0)
- Thermal coefficient of resistivity of ultrathin Ag films deposited on Cu for applications in emerging interconnect systems (2014) (0)
- ChemInform Abstract: Organometallic Route to the Chemical Vapor Deposition of Titanium Carbide Films at Exceptionally Low Temperatures. (1987) (0)
- A comparative study of a-SiCxOyHz thin films grown via chemical vapor deposition for silicon photonics (2008) (0)
- DEPOSITION OF COPPER-BASED FILMS AND COPPER SOURCE PRECURSORS FOR THE SAME (2017) (0)
- Study of the effects of structural properties on the photoluminescence behavior of erbium thin films (2012) (0)
- Electrochemical Characteristics of Amorphous Titanium Carbide Films Produced by Low-Temperature Metal-Organic Chemical Vapor Deposition (MOCVD). (1988) (0)
- A Novel Silicon-Carbon Precursor for Oligomer Chemical Vapor Deposition of Silicon Carbide for Harsh Environmental Applications (2001) (0)
- Carbon Nanotube Interconnects (2014) (0)
- Simplified CVD route to near-zero thickness silicon nitride films (2022) (0)
- Erratum: “In Situ Pulsed Deposition Studies of Ce ( tmhd ) 4 on SrS Surfaces for Thin Film Electroluminescent Flat Panel Display Applications” [ J. Electrochem. Soc., (145), 4271] (1999) (0)
- Solar Smarter Faster (2011) (0)
- Intense blue-white luminescence from amorphous silicon oxycarbide (a-SiCxOy) thin films (2011) (0)
- Method for chemical vapor deposition of films on copper base and Kupferquellenprecursor for this (1999) (0)
- Films on silicon-nitrogen base and method of making same (1998) (0)
- A process for vapor deposition of titanium-silicon-nitrogen film (2001) (0)
- Metal-Organic Chemical Vapor Epitaxy of GaN on Si(111) for Optoelectronic Applications (1998) (0)
- MOCVD ZnS:Mn Films: Grain Size Distribution and Crystal Structure as a Function of the Growth Parameters (2001) (0)
- MOCVD of Yttria Stabilized Zirconia on Co-Cr (1994) (0)
- Metal CVD Technology for ULSI Applications: The Aluminum Route (1996) (0)
- Synthesis and characterization of a new copper(II) complex for chemical vapor deposition (1993) (0)
- Investigations of Substrate-Selective Covalent Attachment for Genetically-Engineered Molecular Interconnects (2002) (0)
- Emerging Nanoscale Interconnect Processing Technologies: Fundamental and Practice (2009) (0)
- Enhancement of Copper Wetting via Surfactant-Based Post-Treatment of Ultra-Thin Atomic Layer Deposited Tantalum Nitride Liners (2003) (0)
- CVD deposition of tungsten nitride (2000) (0)
- Heteroepitaxial Si-ZrO2-Si by MOCVD (1993) (0)
- A Comparative Study of Interconnect Circuit Techniques for Energy Efficient On-Chip Interconnects (2016) (0)
- Low Temperature Metal-Organic Chemical Vapor Deposition (LTMOCVD) Route to the Fabrication of Thin Films of High Temperature Oxide Superconductors (1990) (0)
- Sputtered Fitas of Amorphous Hydrogenated Silicon Carbide (1987) (0)
- Study by Extended X‐Ray Absorption Fine Structure Technique and Microscopy of the Amorphous State of Titanium Diboride Thin Films. (1989) (0)
- Erbium-doped Amorphous- Si-C-O Matrix (a-SiC x O y :Er) - A Novel Silicon-based Material for Near-infrared Optoelectronic Applications (2005) (0)
- Low Temperature CVD Route to Binary and Ternary Diffusion Barrier Nitrides for Cu Metallization (1998) (0)
- Deposition of barrier layer and CVD copper under no exposed wafer conditions : adhesion performance and process integration (1998) (0)
- Microstructural Effects in the Thermochromic Behavior of VO 2 /Al/Si Thin Film Heterostructures (2000) (0)
- Molecular interconnects : A bottom-up paradigm for signal propagation (2005) (0)
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