Alfred Grill

Alfred Grill's AcademicInfluence.com Rankings

Alfred Grill

Engineering

#5078

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#6317

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Applied Physics

#1385

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#1414

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Electrical Engineering

#1358

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#1449

Historical Rank

engineering Degrees

Alfred Grill

Physics

#5837

World Rank

#7716

Historical Rank

physics Degrees

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Engineering
Physics

Alfred Grill's Degrees

Masters Physics University of Oxford
Bachelors Physics University of Oxford

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Alfred Grill's Published Works

Number of citations in a given year to any of this author's works

Total number of citations to an author for the works they published in a given year. This highlights publication of the most important work(s) by the author

Published Works

100-GHz Transistors from Wafer-Scale Epitaxial Graphene (2010) (2355)
Diamond-like carbon: state of the art (1999) (894)
Wafer-Scale Graphene Integrated Circuit (2011) (824)
Structure of low dielectric constant to extreme low dielectric constant SiCOH films: Fourier transform infrared spectroscopy characterization (2003) (561)
Diamond-like carbon coatings as biocompatible materials—an overview (2003) (438)
Tribology of diamondlike carbon and related materials: an updated review (1997) (434)
Cold Plasma in Materials Fabrication: From Fundamentals to Applications (1994) (306)
Review of the tribology of diamond-like carbon (1993) (293)
Cold Plasma Materials Fabrication (1994) (278)
Friction control of diamond-like carbon coatings (1997) (233)
Electrical and optical properties of diamond-like carbon (1999) (216)
Plasma enhanced chemical vapor deposited SiCOH dielectrics: from low-k to extreme low-k interconnect materials (2003) (214)
Ultralow-k dielectrics prepared by plasma-enhanced chemical vapor deposition (2001) (210)
Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art (2014) (203)
Tribochemistry between hydrogen and diamond-like carbon films (2001) (190)
Picosecond optical studies of amorphous diamond and diamondlike carbon: Thermal conductivity and longitudinal sound velocity (1994) (189)
The role of hydrogen on the friction mechanism of diamond-like carbon films (2001) (182)
Porous pSiCOH Ultralow-k Dielectrics for Chip Interconnects Prepared by PECVD (2009) (163)
Tribochemistry of diamond-like carbon coatings in various environments (1994) (157)
LOW DIELECTRIC CONSTANT FILMS PREPARED BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION FROM TETRAMETHYLSILANE (1999) (157)
Characterization of diamondlike carbon by infrared spectroscopy (1992) (155)
High-speed Germanium-on-SOI lateral PIN photodiodes (2004) (147)
Strained Si NMOSFETs for high performance CMOS technology (2001) (143)
Fundamentals of Plasma (1994) (127)
The respective role of oxygen and water vapor on the tribology of hydrogenated diamond-like carbon coatings (1998) (127)
High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography (2006) (123)
Optical and tribological properties of heat-treated diamond-like carbon (1990) (116)
Inhomogeneous carbon bonding in hydrogenated amorphous carbon films (1987) (115)
Wafer-scale epitaxial graphene growth on the Si-face of hexagonal SiC (0001) for high frequency transistors (2010) (102)
How to restore superlow friction of DLC: the healing effect of hydrogen gas (2004) (94)
Heat flow, gap formation and break-outs in the continuous casting of steel slabs (1976) (90)
Plasma-deposited diamondlike carbon and related materials (1999) (90)
Porosity in plasma enhanced chemical vapor deposited SiCOH dielectrics: A comparative study (2003) (84)
In situ X-ray Diffraction Study of Graphitic Carbon Formed During Heating and Cooling of Amorphous-C/Ni bilayers (2010) (83)
Base electrodes for high dielectric constant oxide materials in silicon technology (1992) (83)
Preparation and structure of porous dielectrics by plasma enhanced chemical vapor deposition (2007) (80)
Amorphous carbon based materials as the interconnect dielectric in ULSI chips (2001) (78)
Stresses in diamond-like carbon films (1993) (78)
Tribological properties of diamond-like carbon and related materials (1993) (77)
Wear-resistant fluorinated diamondlike carbon films (1997) (76)
Magnetic ordering in rare earth iron silicides and germanides of the RFe2X2 type (1975) (73)
Diamondlike carbon films by rf plasma-assisted chemical vapor deposition from acetylene (1990) (72)
EELS analysis of hydrogenated diamond-like carbon films (1998) (70)
Superlow Friction of Diamond-Like Carbon Films: A Relation to Viscoplastic Properties (2004) (69)
Epitaxial graphene nanoribbon array fabrication using BCP-assisted nanolithography. (2012) (64)
Solid state 13C and 1H nuclear magnetic resonance investigations of hydrogenated amorphous carbon (1999) (61)
Interface modifications for improving the adhesion of a -C:H films to metals (1988) (60)
Tribological behavior of diamond-like carbon: effects of preparation conditions and annealing (1991) (60)
Novel Low k Dielectrics Based on Diamondlike Carbon Materials (1998) (59)
Frequency response of top-gated carbon nanotube field-effect transistors (2004) (56)
Tribological and mechanical properties of diamond-like carbon prepared by high-density plasma (2001) (54)
Structural characterization of porous low-k thin films prepared by different techniques using x-ray porosimetry (2004) (52)
Adjusting the Skeleton and Pore Structure of Porous SiCOH Dielectrics (2009) (49)
PECVD low and ultralow dielectric constant materials: From invention and research to products (2016) (44)
Property modifications of nanoporous pSiCOH dielectrics to enhance resistance to plasma-induced damage (2008) (44)
Diamond-like carbon prepared by high density plasma (2000) (42)
RF performance of short channel graphene field-effect transistor (2010) (42)
Electrical resistivities of diamond-like carbon (1994) (41)
Multi-carrier Transport in Epitaxial Multi-layer Graphene (2010) (39)
Effect of SiC wafer miscut angle on the morphology and Hall mobility of epitaxially grown graphene (2011) (38)
Low Dielectric Constant Sicoh Films As Potential Candidates for Interconnect Dielectrics (1999) (37)
Effects of bias and inert gas on properties of diamond-like carbon deposited by d.c. PACVD (1994) (36)
Boron nitride coatings of steel and graphite produced with a low pressure r.f. plasma (1980) (35)
Temperature and Bias Effects on the Physical and Tribological Properties of Diamond‐Like Carbon (1991) (35)
Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps (2008) (35)
The Effect of Plasma Chemistry on the Damage Induced to Porous SiCOH Dielectrics (2006) (34)
R.f.-sputtered silicon and hafnium nitrides: Properties and adhesion to 440C stainless steel (1983) (32)
The gallium-rich side of the Nd-Ga and Ce-Ga systems (1980) (31)
Effect of arc vibration and current pulses on microstructure and mechanical properties of TIG tantalum welds (1978) (30)
MICROSTRUCTURE AND COMPOSITION OF PLASMA-NITRIDED Ti—6Al-4V LAYERS (1989) (29)
Hydrogen plasma effects on ultralow-k porous SiCOH dielectrics (2005) (28)
Diamondlike Carbon Materials as Low-k Dielectrics for Multilevel Interconnects in Ulsi (1996) (28)
Ultralow dielectric constant pSiCOH films prepared with tetramethylcyclotetrasiloxane as skeleton precursor (2008) (28)
Layered TaSiN as an oxidation resistant electrically conductive barrier (1999) (27)
R.F. plasma nitriding of Ti6A14V alloy (1990) (26)
Nitriding of AISI M2 tool steel in an inductive r.f. plasma (1983) (24)
Deposition of silicon carbide coatings on titanium alloy with a low pressure R.F. plasma (1980) (24)
Germanium-on-insulator photodetectors (2005) (24)
Computation of temperatures in thin tantalum sheet welding (1980) (23)
Novel high temperature multilayer electrode-barrier structure for high-density ferroelectric memories (1997) (23)
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL (2004) (23)
Interaction of Hydrogen Plasma with Extreme Low-k SiCOH Dielectrics (2004) (22)
Decomposition and polymerization of silicon tetrachloride in a microwave plasma. A mass-spectrometry investigation (1983) (21)
From tribological coatings to low-k dielectrics for ULSI interconnects (2001) (21)
Hardmask technology for sub-100 nm lithographic imaging (2003) (21)
MAGNETIC SUSCEPTIBILITIES OF CUBIC MIXED EUROPIUM OXIDES. (1970) (21)
A 45 nm CMOS node Cu/Low-k/ Ultra Low-k PECVD SiCOH (k=2.4) BEOL Technology (2006) (20)
Some properties of r.f.-sputtered hafnium nitride coatings (1982) (19)
Novel Low-k Dual-phase Materials Prepared by PECVD (2000) (19)
Graphene-based fast electronics and optoelectronics (2010) (19)
Diamond-like carbon as an electrical insulator of copper devices for chip cooling (1991) (19)
Mechanism and kinetics of tetrachlorosilane reactions in an argon‐hydrogen microwave plasma (1984) (19)
Effect of current pulses on the temperature distribution and microstructure in TIG tantalum welds (1981) (18)
Low and Ultralow Dielectric Constant Films Prepared by Plasma‐enhanced Chemical Vapor Deposition (2007) (18)
Nanoindentation Analysis of Mechanical Properties of Low to Ultralow Dielectric Constant SiCOH Films (2005) (18)
The neodymium-gallium system (1978) (18)
Layer structure and mechanical properties of low pressure r.f. plasma nitrided Ti-6Al-4V alloy (1990) (18)
In Situ Co/SiC(N,H) Capping Layers for Cu/Low- k Interconnects (2012) (18)
High-efficiency, Ge-on-SOI lateral PIN photodiodes with 29 GHz bandwidth (2004) (17)
Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node (2017) (16)
Macrosegregation in strand cast steel: Computation of concentration profiles with a diffusion model (1981) (16)
Multilayer epitaxial graphene formed by pyrolysis of polycrystalline silicon-carbide grown on c-plane sapphire substrates (2011) (13)
NOBLE METAL SILICIDE FORMATION IN METAL/SI STRUCTURES DURING OXYGEN ANNEALING : IMPLICATIONS FOR PEROVSKITE-BASED MEMORY DEVICES (1998) (13)
Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology (2004) (13)
Antiferromagnetic ordering of Sm3+ in SmFe0.67 Ge1.33 (1972) (13)
Effect of arc oscillations on the temperature distribution and microstructure in GTA tantalum welds (1981) (13)
Effect of low-frequency radio frequency on plasma-enhanced chemical vapor deposited ultra low-κ dielectric films for very large-scale integrated interconnects (2014) (12)
Preparation of polycrystalline silicon coatings from trichlorosilane (1982) (11)
High-speed lateral PIN photodiodes in silicon technologies (2004) (11)
Sputtered silicon nitride coatings for wear protection (1982) (11)
A comparative study of silicon deposition from SiCl4 in cold plasma using argon, H2 or Ar + H2 (1988) (11)
Advanced metal and dielectric barrier cap films for Cu low k interconnects (2014) (11)
Silicon films deposited from SiCl4 by an r.f. cold plasma technique: X-ray photoelectron spectroscopy and electrical conductivity studies (1984) (11)
Platinum alloys and iridium bottom electrodes for perovskite based capacitors in dram applications (1995) (10)
Boriding of steel in a cold R.F. plasma of diborane in argon (1986) (10)
Electrode Structures for Integration of Ferroelectric or High Dielectric Constant Films in Semiconductor Devices (1998) (10)
Fundamentals on the friction mechanism of diamondlike carbon films (1999) (10)
Characteristics of low-k and ultralow-k PECVD deposited SiCOH films. (2002) (9)
Advanced single precursor based pSiCOH k = 2.4 for ULSI interconnects (2017) (9)
Optimization of SiCOH dielectrics for integration in a 90nm CMOS technology (2004) (9)
A comprehensive simulation study of strained-Si/SiGe nMODFET scaling for RF applications (2002) (9)
Deposition of silicon from SiCl4 in an inductive r.f. low pressure plasma (1982) (9)
Effect of TiOx nucleation layer on crystallization of Bi4Ti3O12 films (1997) (8)
Characteristics of R.F. plasma nitrided titanium alloys (1988) (8)
Growth of mixed cation iron garnets in the ytterbium-gallium and yttrium-calcium silicate systems (1968) (8)
Tunable antireflective coatings with built-in hard mask properties facilitating thin-resist processing (2001) (8)
Fabrication of an electrical spin transport device utilizing a diazonium salt/hafnium oxide interface layer on epitaxial graphene grown on 6 H-SiC(0001) (2012) (8)
Buried, self-aligned barrier layer structures for perovskite-based memory devices comprising Pt or Ir bottom electrodes on silicon-contributing substrates (1998) (8)
Extreme-low k porous pSiCOH dielectrics prepared by PECVD (2018) (8)
Effects of precursor additives on the stability of plasma enhanced chemical vapor deposited a-GeC(O):H films (2002) (8)
Surface hardening of steel by boriding in a cold rf plasma (1985) (8)
Effect of frequency on the deposition of microcrystalline silicon from tetrachlorosilane in low-pressure r.f. plasmas (1982) (8)
SFG analysis of the molecular structures at the surfaces and buried interfaces of PECVD ultralow-dielectric constant pSiCOH (2016) (7)
Preparation of (PB, LA)TIO3 films by metal organic chemical vapor deposition with new lanthanum precursors (1997) (7)
Integration Issues for Diamond Like Carbon in a Copper Damascene Process Flow (1998) (7)
Magnetocrystalline anisotropy of rare‐earth manganites (1973) (7)
Dissociation mechanism of chlorosilane to silicon in low pressure microwave plasmas of argon and argon with hydrogen mixtures (1983) (7)
X‐ray Scattering Methods for Porosity Metrology of Low‐k Thin Films (2009) (7)
Electrical characterization of wafer-scale epitaxial graphene and its RF applications (2011) (6)
The Effect of Deposition Conditions on the Optical and Tribological Properties of Annealed Diamond-Like Carbon Films (1991) (6)
65nm Cu Integration and Interconnect Reliability in Low Stress K=2.75 SiCOH (2006) (6)
Line Resistance and Electromigration Variations Induced by Hydrogen-Based Plasma Modifications to the Silicon Carbonitride/Copper Interface (2007) (6)
A mathematical model for metal flow and heat transfer in centrifuge melt spinning (1990) (6)
Chemical solution deposition of BaSrTiO3 films (1997) (6)
Thickness dependent dielectric properties of Sol-gel prepared lead lanthanum titanate films (1995) (6)
Development and optimization of porous pSiCOH interconnect dielectrics for 45 nm and beyond (2008) (6)
The thermal loads in the finite element analysis of elasto‐plastic stresses (1979) (6)
Silicon deposition from SiCl4 in a cold r.f. plasma: The effect of doping gases on deposition rates, chlorine content and the morphology of the films (1984) (6)
The thermal history of a composite cylinder girth welded by TIG (1982) (6)
Al-Ta bilayer as an oxidation resistant barrier for electrode structures in high dielectric constant capacitors (1999) (5)
Optimal Filler Sizes for Thermal Interface Materials (2019) (5)
High-speed germanium-on-insulator photodetectors (2005) (5)
Bottom Electrodes for High Dielectric Oxide Compounds: Effects on Crystallization of Lead Containing Ferroelectrics (1993) (5)
Electrical conductivity of hot-pressed magnesia: Effect of the addition of LiF (1981) (5)
Graphene RF Transistor Performance (2010) (5)
Growth of bismuth titanate films by chemical vapor deposition and chemical solution deposition (1998) (5)
Stability and Oxidation Behavior of Ir Thin Film Electrodes on Si and SiO2 (1998) (4)
Characterization of titanium coatings obtained by the cold plasma technique (1983) (4)
UV cure impact on robust low-k with sub-nm pores and high carbon content for high performance Cu/low-k BEOL modules (2013) (4)
Oxygen Stoichiometry in PdO x and PdO x /Pt Electrode Layers During Processing of Ferroelectric and High-epsilon Perovskites (2000) (4)
Flux growth and magnetic characterization of calcium-silicon substituted ytterbium and yttrium iron garnets (1972) (4)
Correlations between plasma parameters and the deposition of microcrystalline silicon films by plasma of argon and hydrogen (1987) (4)
Decomposition of SiCl4 and deposition of Si in inductively coupled plasmas of H2+SiCl4 (1987) (4)
SFG analysis of the molecular structures at the surfaces and buried interfaces of PECVD ultralow-dielectric constant pSiCOH: Reactive ion etching and dielectric recovery (2017) (4)
High-quality crystalline layer transfer from a silicon-on-insulator substrate onto a sapphire substrate using wafer bonding (2003) (4)
X-ray Diffraction of Plasma Nitrided Ti-6AI-4V (1989) (4)
Electrical conductivity of hot-pressed magnesia (1980) (4)
Effect of base electrode on the crystallization and electrical properties of PLT (1997) (4)
Optimization of porous ultra low-κ dielectrics (κ ≤ 2.55) for 28nm generation (2011) (4)
Bonding, Interfacial Effects And Adhesion In DLC. (1989) (4)
STUDY OF ITINERANT FERROMAGNETISM IN Zr1-xTixZn2 AND Zr1-yHfyZn2 BY MAGNETIC RESONANCE (1971) (4)
Magnetic Properties of Diamagnetic-Substituted Ytterbium Iron Garnet Explained by the Statistical Model of the Molecular Field. I. The Spontaneous Magnetization of Si-Ca-Substituted Ytterbium Iron Garnet (1973) (3)
Property Control of Diamond-Like Carbon Coatings by Selection of Precursor, Bias, and Dilutant (1997) (3)
Ion beam nitriding of titanium and titanium alloy (1983) (3)
Strain Relaxation Mechanisms in He+-Implanted and Annealed Si1−xGex Layers on Si(001) Substrates (2001) (3)
Paramagnetic Susceptibility of a 2p Unpaired Electron in a Crystalline Field (1970) (3)
Optimizing ULK film properties to enable BEOL integration with TDDB reliability (2015) (3)
Applications of Diamond-Like Carbon in Computer Technology (1991) (3)
The Evaluation of Wrinkles in Textile Fabrics (1966) (3)
Preparation of strontium titanate films by MOCVD (1995) (3)
Tribology of Diamondlike Carbon and Related Materials (1997) (3)
Competitive and cost effective copper/low-k interconnect (BEOL) for 28nm CMOS technologies (2012) (2)
Silane Decomposition on Cu Interconnects Inhibited by Ammonia (2010) (2)
Ultrathin (5-35 nm) SiCNH Dielectrics for Damascene Cu Cap Application: Thickness Scaling and Oxidation Barrier Performance Limitation (2010) (2)
Robust Ultrathin (20-25 nm)Trilayer Dielectric Low k Cu Damascene Cap for Sub-30 nm Nanoelectric Devices (2012) (2)
In-situ metal/dielectric capping process for electromigration enhancement in Cu interconnects (2012) (2)
Cold Plasma Generation (1994) (2)
Ion beam reactively sputtered silicon nitride coatings (1983) (2)
Electrical conductivity of hot-pressed magnesia: Effect of heat treatment (1981) (2)
Cold Plasma Processes for Surface Modification (1994) (2)
Tailoring dielectric materials for robust BEOL reliability (2012) (2)
Chlorine incorporation in silicon films deposited by low-pressure rf discharges in gas mixtures of SiCl4+H2+Ar (1984) (2)
Magnetic Properties of Diamagnetic-Substituted Ytterbium Iron Garnet Explained by the Statistical Model of the Molecular Field. III. Curie Temperatures, Magnetic Susceptibilities, and Anisotropy of Si-Ca- and Ga-Substituted Ytterbium Iron Garnet (1973) (2)
Cerium--mischmetall (CeMM) and CeMM--cobalt analysis by x-ray fluorescence (1973) (1)
Ultrathin conformal multilayer SiNO dielectric cap for capacitance reduction in Cu/low k interconnects (2016) (1)
Effect of LiF addition on the grain growth of hot-pressed MgO (1981) (1)
Metal-catalyzed graphitization in Ni-C alloys and amorphous-C/Ni bilayers (2011) (1)
Effect of Argon and Hydrogen on Deposition of Silicon from Tetrachlorosilane in Cold Plasmas (1985) (1)
A BEOL multilevel structure with ultra low-k materials (k ≤ 2.4) (2010) (1)
Protective coatings of metal surfaces by cold plasma treatment (1985) (1)
Graphene technology for RF and THz applications (2013) (1)
Comparison of the Fracture Behavior of Brittle ILD Films used in the BEOL in Dry and Wet Environment using Nanoindentation (2006) (1)
Bottom Electrode Effects in Controlling Orientation of Lead Zirconate Titanate Films Deposited by Chemical Solution Deposition (1999) (1)
Deposition of Coatings by PECVD (1994) (1)
Oxidation of microcrystalline Si:H:Cl films (1987) (1)
Fabrication of multilayer ferroelectric films (1999) (1)
Oxygen-Induced Inhibition of Noble Metal Silicide Formation: Implications for Electrode/Barrier Structures used with Perovskite Materials (1997) (1)
Environment and Tribochemistry (1997) (1)
Electrical conductivity in microcrystalline Si:H:Cl films (1986) (1)
Diamond-like Carbon Materials for Low-k Dielectrics (2001) (1)
Quantitative Electron Energy Loss Spectroscopy (EELS) Analysis of Flowable CVD Oxide for Shallow Trench Isolation of finFET Integration (2017) (0)
And capacitor electrode structure with high dielectric constant materials (1995) (0)
1 Low and Ultralow Dielectric Constant Films Prepared by Plasma-enhanced Chemical Vapor Deposition (2007) (0)
Carrier Transport in Epitaxial Multi-layer Graphene (2011) (0)
Cerium-Mischmetal (CeMM) and CeMM-Cobalt Analysis by X-Ray Fluorescence (1973) (0)
Dielectric and Structural Properties of Barium Strontium Titanate (BST) and Bismuth Titanante (BiTi) Sol-Gel Thin Films (1997) (0)
Fluorinated diamond-like carbon protective coating for magnetic recording media devices (1998) (0)
Lightly Porous SiCOH 2.7 Dielectric Film Development for 65/45/32 nm Advanced Nanoelectronic CMOS Devices (2008) (0)
A process for making a film with extremely low dielectric constant (2004) (0)
Nitriding of Titanium and Titanium- 8-Percent-Aluminum- 1-Percent-Molybdenum- 1-Percent-Vanadium Alloy With an Ion-Beam Source (2001) (0)
Magnetic recording device and manufacture thereof (1995) (0)
Correlations between plasma variables and the deposition process of Si films from chlorosilanes in low pressure RF plasma of argon and hydrogen (1984) (0)
The role of gazeous interactions in the friction of diamond-like carbon films (2003) (0)
Characterization of Few Layer Graphene films Grown on Cu, Cu-Ni and SiC Substrates (2012) (0)
Spectroscopic Ellipsometry of Porous Low‐κ Dielectric Thin Films (2009) (0)
Structural evolution of nanoporous ultra-low k dielectrics under voltage stress (2013) (0)
Enhanced Cracking Resistance of Plasma Deposited Low-k SiCOH Films with Nano Imbedded Layers Insertion (2007) (0)
Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects (2014) (0)
Induced e-beam charge impact on spatial orientation of gate-all-around silicon wires device fabricated on boron nitride substrate (2015) (0)
Characterization of low-k to extreme low-k SiCOH dielectrics (2003) (0)
Dielectric relaxation studies of ion diffusion into low-k dielectrics (2014) (0)
Frequency kesponse of top-gated carbon nanotube field-effect transistors (2013) (0)
RF sputtered silicon and hafnium nitrides as applied to 440C steel (1984) (0)
Graphene nanoribbons and made of SiC fins or nanowire templates carbon nanotubes (2012) (0)
THE STRUCTURE OF LOW-k TO EXTREME LOW-k SiCOH DIELECTRICS – FTIR CHARACTERIZATION (2003) (0)
Multi-Layer Epitaxial Graphene Formed from Poly-Crystalline Silicon Carbide Grown on C-Plane Sapphire (2011) (0)
Electrical Detection of Spin Transport in Epitaxial Graphene Grown on the Si-face of Hexagonal SiC(0001) (2011) (0)
Temperature and Bias Effects on the Physical and Tribological Properties of Diamond-Like Carbon. (1991) (0)
Low-K and Ultralow-K Dielectrics for VLSI Interconnects: State of the Art (2011) (0)
High-Dielectric Constant Insulators and the AMLCD Process: Is Amorphous BST a Candidate? (1999) (0)
Method for storing data, and optical storage device (1993) (0)
Low-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes (2005) (0)
STATISTICAL CONTRIBUTION OF THE TETRAHEDRAL IRON TO THE EXCHANGE INTERACTION IN MIXED YTTERBIUM GALLIUM GARNETS (1971) (0)
RF Sputtered Silicon and Hafnium Nitrides : Properties and Adhesion to 440 C Stainless (2008) (0)
A process for producing a hydrogenated and oxidized silziumkarbidschicht (1999) (0)
Magnetic head and its manufacturing method (1991) (0)
Static frequency divider circuit using 0.15 μm gate length Si0.2Ge0.8/Si0.7Ge0.3 p-MODFETs (2003) (0)
R . F Sputtered Silicon and Hafnium Nitrides as Applied to 440 C (2009) (0)
Chemical bonding in microcrystalline Si:H:Cl films studied by ion-induced Auger Electron Spectroscopy (1989) (0)
Microstructure of low temperature RF plasma nitrided titanium alloy (1988) (0)
Deposition of reactively ion beam sputtered silicon nitride coatings (1982) (0)
Novel Low k Dielectrics Based on Diamondlike Carbon Materials. (1998) (0)
Properties and Applications of Thin Films of Lead Lanthanum Titanate (PLT) and Barium Strontium Titanate (BST) (1996) (0)
IBM Research Report Interface Engineering for High Interfacial Strength between SiCOH and pSiCOH ILDs and Diffusion Caps (2007) (0)
Spin transport in epitaxial graphene on SiC (0001) (2012) (0)
Designing porous ultra low-κ dielectrics to meet scaling challenges (2011) (0)
Selective manganese deposition for CU_low k nano device interconnect (2015) (0)
CD-SEM metrology evaluation of gate-all-around Si nanowire MOSFET with improved control of nanowire suspension by using a buried boron nitride etch-stop layer (2014) (0)
Plasma Deposition and Development of Ultralow-k Bilayer SiCNx/SiCNy Dielectric Cu Cap for 32 nm CMOS Devices (2009) (0)
Feram cell with internal oxygen source layer and method for outputting oxygen (2000) (0)
Post porosity plasma protection integration at 48 nm pitch (2016) (0)
Plasma Assisted Etching (1994) (0)
Structure and process for the production of a CMOS-compatible high speed ge-on-insulator-photo detector (2005) (0)

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