Avram Bar‐cohen

Avram Bar‐cohen's AcademicInfluence.com Rankings

Avram Bar‐cohen

Engineering

#5325

World Rank

#6575

Historical Rank

Mechanical Engineering

#465

World Rank

#509

Historical Rank

Applied Physics

#1517

World Rank

#1549

Historical Rank

engineering Degrees

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Engineering

Avram Bar‐cohen's Degrees

PhD Mechanical Engineering University of California, Berkeley
Masters Mechanical Engineering University of California, Berkeley
Bachelors Mechanical Engineering University of California, Berkeley

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Avram Bar‐cohen's Published Works

Number of citations in a given year to any of this author's works

Total number of citations to an author for the works they published in a given year. This highlights publication of the most important work(s) by the author

Published Works

Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates (1984) (524)
Thermal Analysis and Control of Electronic Equipment (1983) (347)
Direct Liquid Cooling of High Flux Micro and Nano Electronic Components (2006) (196)
Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1 (1988) (173)
Design of Optimum Plate-Fin Natural Convective Heat Sinks (2003) (161)
Design and analysis of heat sinks (1995) (159)
Thermal Management of On-Chip Hot Spot (2012) (135)
Thermal management of electronic components with dielectric liquids (1993) (132)
Superlattice-based thin-film thermoelectric modules with high cooling fluxes (2016) (128)
Effusivity-based correlation of surface property effects in pool boiling CHF of dielectric liquids (2003) (124)
Evaporation and flow dynamics of thin, shear-driven liquid films in microgap channels (2011) (118)
Enhancement of pool boiling critical heat flux in dielectric liquids by microporous coatings (2007) (102)
Contact angle effects on boiling incipience of highly-wetting liquids (1990) (97)
Polymer Heat Exchangers—History, Opportunities, and Challenges (2012) (93)
Nanothermal Interface Materials: Technology Review and Recent Results (2015) (92)
Theta /sub JC/ characterization of chip packages-justification, limitations, and future (1989) (91)
Modeling and Prediction of Two-Phase Microgap Channel Heat Transfer Characteristics (2009) (90)
Thermal Management of Air- and Liquid-Cooled Multichip Modules (1987) (90)
Coffin-Manson fatigue model of underfilled flip-chips (1997) (86)
A technique for enhancing boiling heat transfer with application to cooling of electronic equipment (1992) (79)
Experimental investigation of nucleate boiling incipience with a highly-wetting dielectric fluid (R-113) (1990) (77)
Thermal challenges in next generation electronic systems - summary of panel presentations and discussions (2002) (77)
Design and optimization of air-cooled heat sinks for sustainable development (2002) (75)
State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment (1992) (73)
On-chip hot spot cooling using silicon thermoelectric microcoolers (2007) (72)
Fin Thickness for an Optimized Natural Convection Array of Rectangular Fins (1979) (72)
wall Superheat Excursions in the Boiling incipience of Dielectric Fluids (1988) (68)
Thermal design and optimization of natural convection polymer pin fin heat sinks (2005) (67)
High heat from a small package (1986) (65)
Gas-assisted evaporative cooling of high density electronic modules (1994) (64)
Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module (2013) (64)
Analytical modeling of silicon thermoelectric microcooler (2006) (63)
Thermal management of high heat flux nanoelectronic chips (2007) (62)
DARPA’s Intra/Interchip Enhanced Cooling (ICECool) Program (2013) (61)
Orthotropic thermal conductivity effect on cylindrical pin fin heat transfer (2007) (60)
Gen-3 Thermal Management Technology: Role of Microchannels and Nanostructures in an Embedded Cooling Paradigm (2013) (59)
Design for manufacturability of SISE parallel plate forced convection heat sinks (2000) (58)
Two-Phase Thermal Ground Planes: Technology Development and Parametric Results (2015) (58)
High quality flow boiling heat transfer and pressure drop in microgap pin fin arrays (2014) (57)
Coffin-Manson based fatigue analysis of underfilled DCAs (1998) (57)
Unified mechanistic multiscale mapping of two-phase flow patterns in microchannels (2013) (57)
Thermal characterization of chip packages-evolutionary development of compact models (1997) (57)
Least-energy optimization of forced convection plate-fin heat sinks (2002) (56)
Advanced thermal management technologies for defense electronics (2012) (54)
Effects of Dissolved Gas Content on Pool Boiling of a Highly Wetting Fluid (1995) (54)
On-chip Hot Spot Remediation with Miniaturized Thermoelectric Coolers (2009) (52)
Optimum Arrays of Longitudinal, Rectangular Fins in Corrective Heat Transfer (1985) (51)
Thermoelectric-powered convective cooling of microprocessors (2005) (50)
Mini-Contact Enhanced Thermoelectric Cooling of Hot Spots in High Power Devices (2007) (50)
Least-energy optimization of air-cooled heat sinks for sustainable development (2003) (50)
Near-Junction Thermal Management for Wide Bandgap Devices (2011) (48)
Least-material optimization of vertical pin-fin, plate-fin, and triangular-fin heat sinks in natural convective heat transfer (1998) (46)
Mini-Contact Enhanced Thermoelectric Coolers for On-Chip Hot Spot Cooling (2009) (45)
Direct Submount Cooling of High-Power LEDs (2010) (45)
Optimum Cylindrical Pin Fin (1981) (45)
Two-Phase Thermal Transport in Microgap Channels—Theory, Experimental Results, and Predictive Relations (2012) (44)
Characterization and prediction of two-phase flow regimes in miniature tubes (2011) (44)
Combined pressure and subcooling effects on pool boiling from a PPGA chip package (1996) (42)
Thermal characterization of a PLCC-expanded R/sub jc/ methodology (1992) (40)
Review of Heat Exchangers Enabled by Polymer and Polymer Composite Additive Manufacturing (2018) (39)
Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs (2012) (38)
Optimal numerical design of forced convection heat sinks (2004) (38)
Integrated Measurement Technique for Curing Process-Dependent Mechanical Properties of Polymeric Materials Using Fiber Bragg Grating (2008) (37)
Effects of Temperature Cycling and Elevated Temperature/Humidity on the Thermal Performance of Thermal Interface Materials (2009) (36)
Thermoelectric Micro-Cooler for Hot-Spot Thermal Management (2005) (36)
Hybrid Solid- and Liquid-Cooling Solution for Isothermalization of Insulated Gate Bipolar Transistor Power Electronic Devices (2013) (36)
Heat driven cooling of portable electronics using thermoelectric technology (2008) (35)
Modeling and Prediction of Two-Phase Refrigerant Flow Regimes and Heat Transfer Characteristics in Microgap Channels (2007) (35)
Embedded Cooling for Wide Bandgap Power Amplifiers: A Review (2019) (34)
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES BOARD OF GOVERNORS (Continued on back cover) (2005) (34)
Confinement effects on nucleate boiling and critical heat flux in buoyancy-driven microchannels (2009) (34)
Hierarchical Life Prediction Model for Actively Cooled LED-Based Luminaire (2010) (33)
Heat transfer: a review of 2002 literature (2005) (33)
Parametric dependence of fatigue of electronic adhesives (1998) (31)
Thermal management of portable electronic equipment using thermoelectric energy conversion (2004) (30)
Hotspot remediation with anisotropic thermal interface materials (2008) (28)
Thermofluid characteristics of two-phase flow in micro-gap channels (2008) (28)
Pulsed Thermoelectric Cooling for Improved Suppression of a Germanium Hotspot (2014) (27)
Themal optimization of compact solar water heaters (1978) (27)
Energy Efficiency of Low Form Factor Cooling Devices (2007) (26)
Least-energy optimization of air-cooled heat sinks for sustainability-theory, geometry and material selection (2006) (26)
Thermosyphon Boiling in Vertical Channels (1985) (26)
Wafer-scale GaN HEMT performance enhancement by diamond substrate integration (2014) (26)
Heat transfer - A review of 2000 literature (2002) (25)
Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices (2003) (25)
Thermal Characterization of a PLCC (1992) (24)
Thermal and Hydrodynamic Phenomena in a Horizontal, Uniformly Heated Steam-Generating Pipe (1987) (23)
Thermal Management of Time-Varying High Heat Flux Electronic Devices (2014) (23)
Thermal management of on-chip hot spots and 3D chip stacks (2009) (23)
Thermal management of microelectronics in the 21st century (1997) (23)
Thermal compact modeling of parallel plate heat sinks (2003) (23)
“Heat Shield”—An Enhancement Device for an Unshrouded, Forced Convection Heat Sink (2006) (22)
Near-Junction Microfluidic Cooling for Wide Bandgap Devices (2016) (22)
Immersion cooling of high heat flux microelectronics with dielectric liquids (1998) (22)
Considerations in the Use of the Laser Flash Method for Thermal Measurements of Thermal Interface Materials (2011) (21)
Pool boiling of perfluorocarbon mixtures on silicon surfaces (2010) (21)
Thermoelectric mini-contact cooler for hot-spot removal in high power devices (2006) (21)
Mechanistic figures of merit for die-attach materials (1996) (21)
Design of a candidate thermal control system for a cryogenically-cooled computer (1988) (21)
Heat transfer—a review of 1994 literature (1997) (21)
Thermofluid analysis of staggered and inline pin fin heat sinks (2000) (20)
Fluid Selection and Property Effects in Single- and Two-Phase Immersion Cooling (1988) (20)
Energy Efficient Polymers for Gas-Liquid Heat Exchangers (2010) (20)
Heat transfer: a review of 1999 literature. (2001) (19)
Thermofluid Design of Single-Phase Submerged-Jet Impingement Cooling for Electronic Components (1994) (19)
EXPERIMENTS ON BOILING INCIPIENCE WITH A HIGHLY-WETTING DIELECTRIC FLUID; EFFECTS OF PRESSURE, SUBCOOLING AND DISSOLVED GAS CONTENT (1990) (19)
Recent Progress in GaN-on-Diamond Device Technology (2014) (19)
Cooling the Electronic Brain (2011) (19)
Immersion Cooling of Digital Computers (1994) (18)
Coupled Thermal and Thermo-Mechanical Design Assessment of High Power Light Emitting Diode (2010) (18)
Thermally Optimum Arrays of Cards and Fins in Natural Convection (1983) (18)
Self-Cooling on Germanium Chip (2011) (18)
Near-junction microfluidic thermal management of RF power amplifiers (2015) (18)
Charaterization of chip packages, Justification, limitations and future (1989) (17)
Effect of a dimensionless length scale on the critical heat flux in saturated, pool boiling (1989) (17)
A shear based optimization of adhesive thickness for die bonding (1994) (17)
Thermal modeling and performance of high heat flux SOP packages (2004) (17)
THE IMPACT OF GaN/SUBSTRATE THERMAL BOUNDARY RESISTANCE ON A HEMT DEVICE (2011) (17)
Experimental modeling of the passive cooling limit of notebook computers (2002) (17)
Thermal Design of Immersion Cooling Modules for Electronic Components (1983) (17)
Life prediction of LED-based recess downlight cooled by synthetic jet (2012) (16)
First family planning visit in school-based clinics. (1990) (16)
Cooling Electronic Equipment (2006) (16)
Superlattice microrefrigerators fusion bonded with optoelectronic devices (2005) (16)
On-Chip Thermal Management and Hot-Spot Remediation (2021) (16)
Thermal performance and reliability characterization of bonded interface materials (BIMs) (2014) (16)
Use of superlattice thermionic emission for "hot spot" reduction in a convectively-cooled chip (2004) (16)
APPLICATION OF THERMALLY ENHANCED THERMOPLASTICS TO SEAWATER-COOLED LIQUID- LIQUID HEAT EXCHANGERS (2008) (15)
THERMAL TRANSPORT MECHANISMS IN NUCLEATE POOL BOILING OF HIGHLY-WETTING LIQUIDS (1990) (15)
Unlocking the True Potential of 3-D CPUs With Microfluidic Cooling (2016) (15)
Bypass effect in high performance heat sinks (2000) (15)
Spatial and Temporal Wall Temperature Fluctuations in Two-Phase Flow in Microgap Coolers (2010) (15)
Waves, Instabilities, and Rivulets in High Quality Microgap Two-Phase Flow (2016) (14)
Method for predicting junction temperature distribution in a high-power laser diode bar. (2016) (14)
THERMAL SCIENCE AND ENGINEERING - FROM MACRO TO NANO IN 200 YEARS (2014) (14)
Experimental Characterization of Bonded Microcoolers for Hot Spot Removal (2005) (14)
Enhanced Thermoelectric Cooler for On-Chip Hot Spot Cooling (2007) (14)
Pool Boiling Critical Heat Flux in Dielectric Liquids and Nanofluids (2011) (14)
Microcontact-Enhanced Thermoelectric Cooling of Ultrahigh Heat Flux Hotspots (2015) (13)
POOL AND FLOW BOILING IN NARROW GAPS - APPLICATION TO 3D CHIP STACKS (2008) (13)
Circumferential wall temperature variations in horizontal boiler tubes (1983) (13)
Energy efficient cooling of notebook computers (2002) (13)
The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics (2021) (13)
Mechanical engineering in the information age (1995) (13)
MINIMUM MASS POLYMER SEAWATER HEAT EXCHANGER FOR LNG APPLICATIONS (2009) (12)
Energy Efficient Two-Phase Microcooler Design for a Concentrated Photovoltaic Triple Junction Cell (2014) (12)
Bounding relations for natural convection heat transfer from vertical printed circuit boards (1985) (12)
Experimental demonstration of thermal management using thermoelectric generation (2004) (12)
The Impact of a Thermal Spreader on the Temperature Distribution in a Plasma Display Panel (2006) (12)
Forced convection and flow boiling of a dielectric liquid in a foam-filled channel (2008) (12)
Thermo-optical modeling of polymer fiber Bragg grating illuminated by light emitting diode (2007) (12)
Flow and pressure field characteristics in the porous block compact modeling of parallel plate heat sinks (2003) (12)
Thermal performance of a polymer composite webbed-tube heat exchanger (2016) (12)
Waves and instabilities in high quality adiabatic flow in microgap channels (2016) (11)
Two-phase microgap cooling of a thermally-simulated microprocessor chip (2012) (11)
Determination of the Weighted-Average Case Temperature for a Single Chip Package (1994) (11)
Heat transfer - a review of 1993 literature (1996) (11)
Incorporating Moldability Considerations During the Design of Polymer Heat Exchangers (2011) (11)
Gen 3 “Embedded” Cooling: Key Enabler for Energy Efficient Data Centers (2017) (11)
Convective Immersion Cooling of Parallel Vertical Plates (1985) (11)
Experiments on nucleate boiling heat transfer with a highly-wetting dielectric fluid. Effects of pressure, subcooling and dissolved gas content (1990) (10)
THERMOFLUID CHARACTERISTICS OF HIGH-QUALITY FLOWIN CHIP-SCALE MICROGAP CHANNELS (2015) (10)
Thermo-structural behavior of underfilled flip-chips (1996) (10)
Thermal Characteristics of a Chip-Scale Two-Phase Microgap Cooler (2015) (10)
Challenges and opportunities in Gen3 embedded cooling with high-quality microgap flow (2018) (10)
Thermal design and optimization of staggered polymer pin fin natural convection heat sinks (2004) (10)
Modeling and Validation of a Prototype Thermally-Enhanced Polymer Heat Exchanger (2011) (9)
Thermofluid Design of Energy Efficient and Compact Heat Sinks (2003) (9)
Scanning the Special Issue on On-Chip Thermal Engineering (2006) (9)
GaN HEMT Junction Temperature Dependence on Diamond Substrate Anisotropy and Thermal Boundary Resistance (2012) (9)
Semi-empirical prediction of bubble diameter in gas fluidized beds (1981) (9)
Design Space Exploration of 3D CPUs and Micro-Fluidic Heatsinks With Thermo-Electrical-Physical Co-Optimization (2015) (9)
Parametric Dependence of Annular Flow Heat Transfer in Microgaps (2010) (9)
Heat transfer - A review of 1996 literature (2000) (9)
Heat transfer - a review of 1997 literature (2000) (9)
Review of Most Recent Progress on Development of Polymer Heat Exchangers for Thermal Management Applications (2015) (9)
Superlattice $\mu {\rm TEC}$ Hot Spot Cooling (2010) (8)
THERMO-ELECTRICAL CO-DESIGN OF THREE-DIMENSIONAL INTEGRATED CIRCUITS: CHALLENGES AND OPPORTUNITIES (2013) (8)
Design and Optimization of Forced Convection Heat Sinks for Sustainable Development (2002) (8)
Fluid selection and property effects in single and two-phase immersion cooling (electronic components) (1988) (8)
Thermo-Optic Effects in Polymer Bragg Gratings (2007) (8)
Surface Effects on Confinement-Driven Pool Boiling Enhancement in Vertical Parallel-Plate Channels (2005) (8)
TOWARDS EMBEDDED COOLING - GEN 3 THERMAL PACKAGING TECHNOLOGY (2014) (8)
Passive Immersion Cooling of 3-D Stacked Dies (2009) (8)
Liquid Film Wave Patterns and Dryout in Microgap Channel Annular Flow (2014) (8)
Reduced incipient superheats in boiling of fluids which hold dissolved gas (1991) (8)
Fundamentals of Nucleate Pool Boiling of Highly-Wetting Dielectric Liquids (1994) (7)
Development of CAD Model for MEMS Micropumps (1999) (7)
Trends in the Packaging of Computer Systems (1994) (7)
Superlattice µTEC Hot Spot Cooling (2010) (7)
Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics (2011) (7)
Theoretical aspects of nucleate pool boiling with dielectric liquids (1992) (7)
Near-junction “hot spot” suppression with integral SiC microcontact TEC (2017) (7)
Analysis and Design of a Least Material Orthotropic Pin Fin Heat Sinks (2006) (7)
Thermal Isolation within High-Power 2.5D Heterogenously Integrated Electronic Packages (2016) (7)
NAVIER-STOKES STUDY OF NATURAL CONVECTION AND HEAT TRANSFER IN VERTICAL SYMMETRICALLY HEATED PLATE-FIN HEAT SINKS (1996) (7)
Synthetic jet enhancement of natural convection and pool boiling in a dielectric liquid (2002) (7)
Gen3 embedded cooling for high power RF components (2017) (7)
Design, Fabrication and Experimental-Numerical Study of PZT Sensors (2000) (7)
Sustainability Assessment of Aluminum Heat Sink Design (2003) (7)
Developing a New Thermal Paradigm for Gallium Nitride (GaN) Device Technology (2016) (7)
Heat transfer — a review of 1989 literature (1990) (7)
An Addendum and Correction to "Thermal Management of Air- and Liquid-Cooled Multichip Modules" (1988) (7)
Thermal Management of Electronics (1997) (7)
Narrowing the gap in flip chips (1998) (6)
Analytical Modeling of On-Chip Hotspot Cooling Using Silicon Thermoelectric Microcoolers (2006) (6)
Immersion cooling module for military COTS applications (2004) (6)
Heat transfer—a review of 1995 literature (1999) (6)
Design, fabrication, and characterization of thin film PZT membranes for high flux electronics cooling applications (2005) (6)
Boiling and condensation in a liquid-filled enclosure, (1971) (6)
Development and validation of boundaries for circumferential isothermality in horizontal boiler tubes (1986) (6)
High vapor quality two phase heat transfer in staggered and inline micro pin fin arrays (2014) (6)
Flow regimes and evaporative heat transfer coefficients for flow boiling in smooth and internally-grooved tubes (2016) (6)
Influence of chip/encapsulant delamination on the thermo-structural behavior of a thermally-pulsed plastic IC package (1993) (6)
Fiber Bragg Grating Sensor to Characterize Curing Process-dependent Mechanical Properties of Polymeric Materials (2007) (6)
Two-phase Fluid Selection for High-temperature Automotive Platforms (2012) (6)
Impact of integrated superlattice μtec structures on hot spot remediation (2008) (6)
Mechanical stress reduction in heat sink bond layers-a numerical feasibility study (1999) (6)
Thermal Performance of a Passive Immersion-Cooling Multichip Module (1995) (6)
Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit (2013) (6)
Energy Efficient Two-Phase Micro-Cooler Design for a Concentrated Photovoltaic Triple Junction Cell (2012) (6)
Evaluation of Two-Phase Cold Plate for Cooling Electric Vehicle Power Electronics (2011) (6)
Heat transfer - a review of 1992 literature (1994) (6)
Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program (2015) (6)
Optimization of the thermal design of a cryogenically-cooled computer (1992) (5)
Internet based instruction for thermal design of electronic products-making a global impact (1999) (5)
Prediction of thermal performance degradation of air-cooled fine-pitch fin array heat sinks due to fouling (2006) (5)
Finite element simulation of strain/stress fields in delaminated plastic IC packages (1995) (5)
Modeling Thermal Microspreading Resistance in Via Arrays (2016) (5)
Heat Transfer and Two-Phase Flow Regimes in Manifolded Microgaps - R245fa Empirical Results (2019) (5)
Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface (1997) (5)
Direct liquid thermal management of 3D chip stacks (2009) (5)
Modeling Thermal Spreading Resistance in Via Arrays (2015) (5)
Thermofluid Characteristics of Two-Phase Microgap Coolers (2007) (5)
Encyclopedia of Thermal Packaging (2018) (5)
Characterization of Die-Attach Thermal Interface of High-Power Light-Emitting Diodes: An Inverse Approach (2015) (5)
Modified Model for Improved Flow Regime Prediction in Internally-Grooved Tubes (2013) (5)
Thermal Modeling of Plastic Ic Packages (1991) (5)
Effect of Thermal Contact Resistance on Optimum Mini-Contact TEC Cooling of On-Chip Hot Spots (2009) (5)
Enhanced Hot Spot Cooling Using Bonded Superlattice Microcoolers With a Trench Structure (2008) (5)
Preventing cervical cancer. (1994) (5)
Characterization and Modeling of Anisotropic Thermal Conductivity in Polymer Composites (2006) (5)
Thermo-optical modeling of an intrinsically heated polymer fiber Bragg grating. (2007) (5)
TWO-PHASE FLOW REGIMES AND EVAPORATIVE HEAT TRANSFER IN INTERNALLY-GROOVED TUBES (2014) (5)
Thermal performance limits of polymer composite pin fin heat sinks (2005) (5)
Experimental investigation of transient natural convection heat transfer in vertical enclosures (constant heating) (1977) (5)
Heat transfer—a review of 1990 literature (1991) (5)
Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap Channel (2017) (5)
IR Based Inverse Calculation of Two-Phase Heat Transfer Coefficients in Microgap Channels (2011) (4)
The Pilon Tibial Fracture: Classification, Surgical Techniques, Results (1992) (4)
Integration of micro-contact enhanced thermoelectric cooler with a FEEDS manifold-microchannel system for cooling of high flux electronics (2017) (4)
THE ROLE OF THICKNESS AND THERMAL EFFUSIVITY IN POOL BOILING CHF IN HIGHLY-WETTING LIQUIDS (1994) (4)
Heat transfer - a review of 1991 literature (1992) (4)
BUBBLE-PUMPED AUGMENTED NATURAL CONVECTION IN SUBMERGED CONDENSER SYSTEMS (1978) (4)
Passive Cooling Limits for Ventilated Notebook Computers (2002) (4)
Power electronics thermal packaging and reliability (2013) (4)
Thermal Anisotropy in Injection Molded Polymer Composite Fins (2010) (4)
Simultaneous measurements of effective chemical shrinkage and modulus evolution during polymerization (2008) (4)
IEEE COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY SOCIETY (2010) (4)
Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces (2008) (3)
Nonintrusive Optical Validation of Two-Phase Flow Regimes in a Small-Diameter Tube (2016) (3)
Thermal and optical performance of cryogenically cooled laser diode bars mounted on pin-finned microcoolers (2021) (3)
Dielectric liquid cooling of immersed components (2013) (3)
Superlattice microrefrigerators flip-chip bonded with optoelectronic devices (2004) (3)
Transactions on Components and Packaging Technologies Editors CPMT Transactions Editor-in-Chief (2009) (3)
ON-CHIP HOTSPOT THERMAL MANAGEMENT WITH AN EMBEDDED ARRAY OF SILICON THERMOELECTRIC MICROCOOLERS (2006) (3)
Heat transfer: a review of 1998 literature (2001) (3)
Two-phase flow regimes in a U-shaped diabatic manifolded-microgap channel (2017) (3)
Modeling and Analysis of Heat Driven Forced Convection Cooling (2002) (3)
Non-Intrusive Optical Validation of Two-Phase Flow Regimes in a Small Diameter Tube (2014) (3)
"Heat shield"-an enhancement device for an unshrouded, forced convection heat sink (2004) (3)
Numerical and experimental investigations of boiling enhancement in buoyancy-driven microchannels (2008) (3)
Transient thermoelectric self-cooling of a germanium hotspot (2012) (3)
Thin Thermally Efficient ICECool Defense Semiconductor Power Amplifiers (2017) (3)
Major parametric effects on isothermality in horizontal steam-generating tubes at low- and moderate-steam qualities (1987) (3)
On the Application of Macro-Pipe Two-Phase Heat Transfer Correlations and Flow Regime Maps to Mini-Channels (2006) (3)
An example of the application of the bounding dryout criteria in horizontal steam-generating tubes for the case of circumferentially nonuniform heat flux (1986) (3)
Estimation of Major Correlations for Frictional Pressure Drop in Gas-Liquid Two-Phase Flow in Horizontal Pipes using Predicted Flow Regime Information (2023) (3)
Thermal Performance Measurements of Thermal Interface Materials Using the Laser Flash Method (2007) (3)
Non-contact method for characterization of small size thermoelectric modules. (2015) (2)
Nocturnal heat rejection by skyward radiation (1976) (2)
Gravity effects in microgap flow boiling (2017) (2)
Anticipatory Thermoelectric Cooling of a Transient Germanium Hotspot (2013) (2)
Pool boiling heat transfer with an array of flush-mounted, square heaters (1992) (2)
LEAST-ENERGY OPTIMIZATION OF AIR-COOLED HEAT SINKS FOR SUSTAINABILITY THEORY, GEOMETRY, and MATERIAL SELECTION (2004) (2)
A national course on thermal design of electronic products: recent experiences and a proposal (1998) (2)
Professor Arthur E. Bergles on his 60th birthday (1996) (2)
Theoretical bounding relations for void fraction in bubbling fluidized beds (1980) (2)
Least-Energy Optimization of Air Cooled Heat Sinks (2002) (2)
Reducing thermal coupling using fluid cooled low-k interposers (2017) (2)
Thermoelectric Self-Cooling on Germanium Chip (2010) (2)
Polymer Heat Exchangers: An Enabling Technology for Water and Energy Savings (2011) (2)
Analysis and Prevention of Thermally Induced Failures in Electronic Equipment (1994) (2)
Corrections to "Mini-contact enhanced thermoelectric cooling of hot spots in high power devices" (2007) (2)
Thermal Imaging of Two-Phase Coooled Microgap Channel Wall (2009) (2)
Cooling Electric Equipment (2015) (2)
In Memoriam: Professor Arthur E. Bergles (1935–2014), the Pioneering Advocate of Enhanced Heat Transfer and Energy Conservation (2014) (2)
The Classroom of the Future: An Internet‐Delivered National Course on Thermal Management of Electronics (2000) (2)
Minimum Energy Design for Manufacturability of Air Cooled Heat Sinks (2009) (2)
Silicon Hot Spot Remediation With a Germanium Self Cooling Layer (2011) (2)
Isothermalization of an IGBT Power Electronic Chip (2010) (2)
Numerical modeling and simulation of laser diode diamond microcoolers (2014) (2)
Development of a new technique for DNA single base pair mismatch analysis (2003) (1)
Two-Phase Flow Regimes and Heat Transfer Coefficients With R245fa in Manifolded-Microgap Channels (2021) (1)
IR Thermography of Two-Phase Microgap Cooler (2011) (1)
Pin fin two-phase micro gap coolers for concentrating photovoltaic arrays (2015) (1)
Two-Phase Thermal Transport in Microgap Channels—Theory, Experimental Results, and Predictive Relations (2011) (1)
Advances in GaN technology and design for active arrays (2013) (1)
An Integrated Approach to Design of Enhanced Polymer Heat Exchangers (2011) (1)
Heat Transfer and Two-Phase Flow Regimes in Manifolded Microgaps: Performance Comparison Between R245fa and FC-72 (2020) (1)
Microgap cooling of via-enhanced glass interposers (2017) (1)
Editorial For a Brighter Future: Solid State Lighting (2010) (1)
Thermo-Optical Behavior of Passively-Cooled Polymer Waveguides (2003) (1)
Distance learning paradigms in electronics packaging: a national course on thermal design of electronic products (1997) (1)
In celebration of the 75th birthday of professor Arthur E. Bergles (2010) (1)
THERMAL PERFORMANCE MAPPING OF DIRECT LIQUID COOLED 3D CHIP STACKS (2014) (1)
Distance learning in thermal design of electronic systems - the IEEE/NSF project (2000) (1)
Orientation Effects in Two-Phase Microgap Flow (2018) (1)
Quantum-Well Si/SiC Self-Cooling for Thermal Management of High Heat Flux GaN HEMT Semiconductor Devices (2012) (1)
Simplified Thermal Model of Silicon Thermoelectric Microcooler for On-Chip Hot Spot Remediation (2007) (1)
Nocturnal water cooling by skyward radiation in Israel (1974) (1)
Thin film evaporative cooling in microgap channels (2012) (1)
Advances in electronic packaging 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii (1995) (1)
Modified coupled-mode model for thermally chirped polymer Bragg gratings. (2010) (1)
Encyclopedia of Packaging Materials, Processes, and Mechanics (2019) (1)
Cooling technique based on evaporation of thin liquid films in microgap channels, ECI (2009) (1)
Flow boiling performance in smooth and internally-grooved tube U-bend cold plates (2017) (1)
Limits of Thin Film Cooling in Microgap Channels (2008) (1)
Compact thermal models of electronic components (2015) (1)
Thermal management of high-power microelectronic components: state of the art and future challenges (1993) (1)
THERMOFLUID/ELECTRICAL CO-DESIGN OF EMERGING ELECTRONIC COMPONENTS − CHALLENGES AND OPPORTUNITIES (2012) (1)
Thermal Performance of Cryogenic Micro-Pin Fin Coolers with Two-Phase Liquid Nitrogen Flows (2021) (1)
Abstract of "BYPASS EFFECT IN HIGH PERFORMANCE HEAT SINKS" (2000) (1)
Thermal Packaging Challenges and Opportunities at the Micro and Nano Scales (2006) (1)
Optimization of doping concentration for three-dimensional bulk silicon microrefrigerators (2006) (1)
Thermal Control for Cryogenically Cooled Computer Systems (1994) (1)
Compact Modeling of Unshrouded Plate Fin Heat Sinks (2003) (1)
Future Opportunities and Challenges in Heat Transfer— An Industrial Perspective (1986) (1)
Thermal Analysis and Design of Electronic Systems (2003) (1)
FRONT MATTER (2019) (0)
Application of Thermally-Enhanced Thermoplastics to Seawater-Cooled Heat Exchangers (2008) (0)
Focus on Emerging Technologies (1991) (0)
Hierarchical Reliability Model for Life Prediction of Actively Cooled LED-Based Luminaire (2011) (0)
USING THE LASER FLASH METHOD (2007) (0)
HEAT TRANSFER TO MODERATELY INCLINED PIPES IN BUBBLING LARGE PARTICLE, AIR FLUIDIZED BEDS (1982) (0)
Boiling 2000 - Phenomena & emerging applications - Volume 1 - Proceedings held at Westin Alyeska Prince resort and conference centre, Anchorage, Alaska, April 30-May 5, 2000 (2000) (0)
Thermal Modeling and Luminosity Characterization of a Plasma Display Panel (2007) (0)
Dr. Prof. Wataru Nakayama on his 80th birthday (2017) (0)
THERMOELECTRIC MICROCOOLERS−ACTIVE THERMAL CONTROL MODULES (2015) (0)
Adhesion strength and inversely-determined nonlinear Young's moduli for die-attach adhesives (1993) (0)
Thermally-Optimum Design of GaN-on-SiC HEMT (2015) (0)
Heat transfer in electronic equipment, 1986 : presented at the AIAA/ASME 4th Thermophysics and Heat Transfer Conference, Boston, Massachusetts, June 2-4, 1986 (1986) (0)
Thermally-informed design of microelectronic components (2015) (0)
Thermal-structural modeling of polymer Bragg grating waveguides illuminated by a light emitting diode. (2012) (0)
Gas-Assisted Evaporative Cooling in a Narrow Channel (2019) (0)
A Uniform Temperature Heat Sink for Cooling of High Concentrator Photo-Voltaic Systems (2014) (0)
Editorial/Conference Focus (1978) (0)
Tests for thermal efficiency of dwellings. Final report (1979) (0)
Thermal management of electronics: Energy conversion issues (2003) (0)
Inverse approach to characterize die-attach thermal interface of light emitting diodes (2016) (0)
Review Heat transfer—a review of 2002 literature (2005) (0)
Vice President (Conferences) Vice President (Publications) Vice President (Education) (2004) (0)
International Trends in Engineering Design Education—A Partial View (1979) (0)
Bio Sketches July 2000 (2000) (0)
Experimental Demonstration of Pressure-Driven Flash Boiling for Transient Two-Phase Cooling (2021) (0)
Breast cancer screening in Minnesota. The role of physicians. (1996) (0)
Exponentially varying internal heat generation in fully-developed, laminar, rectangular channel flow (1981) (0)
Thermal Stress In Convectively-Cooled Plastic-Encapsulated Chip Packages (1994) (0)
Professor Warren M. Rohsenow (1921–2011) (2012) (0)
Voidage and expansion in oil-shale ash fluidized beds with non-uniform particle size distribution (1988) (0)
1. Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration (2009) (0)
Thermal packaging - the moving frontier (2006) (0)
Energy optimization and thermal management of data centers (2015) (0)
PREFACE: DROPS, BUBBLES, AND THIN FILMS, SPECIAL ISSUE HONORING PROFESSOR OLEG KABOV (2016) (0)
Cooling the ElectronicBrain (2011) (0)
Electronic Packaging S&T — The New Frontier (2019) (0)
Embedded Fluid Cooling of Close-Packed Via Arrays in Glass (2018) (0)
Drops; bubbles; and thin films – Preface of special issue honoring Professor Oleg Kabov (2018) (0)
Flow Regime Transition in Inner Grooved Minichannel Cold Plates for Cooling Hybrid Electric Power Electronics (2013) (0)
Heat transfer in electronic equipment, 1983 : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Boston, Massachusetts, November 13-18, 1983 (1983) (0)
Gravitational effects in an evaporative cooling technique with shear-driven liquid films (2010) (0)

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