Bahgat G. Sammakia
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Bahgat G. Sammakiaengineering Degrees
Engineering
#2223
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#3097
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#758
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Mechanical Engineering
#280
World Rank
#318
Historical Rank
#65
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Applied Physics
#2894
World Rank
#2952
Historical Rank
#277
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Engineering
Bahgat G. Sammakia's Degrees
- PhD Mechanical Engineering University at Buffalo
- Masters Mechanical Engineering University at Buffalo
Why Is Bahgat G. Sammakia Influential?
(Suggest an Edit or Addition)According to Wikipedia, Bahgat G. Sammakia is an educator and academic administrator who currently serves as Vice President for Research at Binghamton University. He was previously the Interim President of the SUNY Polytechnic Institute. He is also a professor of mechanical engineering and director of the Small Scale Systems Packaging Center at Binghamton University in Binghamton, New York. Sammakia has published over 200 technical papers in refereed journals and conference proceedings, holds 21 U.S. patents and 12 IBM technical disclosures. He has also contributed to three books.
Bahgat G. Sammakia's Published Works
Number of citations in a given year to any of this author's works
Total number of citations to an author for the works they published in a given year. This highlights publication of the most important work(s) by the author
Published Works
- Buoyancy-Induced Flows and Transport (1988) (1128)
- Bending Fatigue Study of Sputtered ITO on Flexible Substrate (2011) (169)
- A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages (1998) (90)
- A Brief Overview of Recent Developments in Thermal Management in Data Centers (2015) (87)
- Comparative Analysis of Different Data Center Airflow Management Configurations (2005) (79)
- Thermal challenges in next generation electronic systems - summary of panel presentations and discussions (2002) (77)
- Optimization of data center room layout to minimize rack inlet air temperature (2006) (69)
- Flexible chemiresistor sensors: thin film assemblies of nanoparticles on a polyethylene terephthalate substrate (2010) (64)
- Experimental-Numerical Comparison for a High-Density Data Center: Hot Spot Heat Fluxes in Excess of 500 W/FT2 (2006) (57)
- Estimating thermal conductivity of amorphous silica nanoparticles and nanowires using molecular dynamics simulations. (2007) (53)
- A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems (2011) (50)
- An Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials (2008) (50)
- Chemical vapor-deposited carbon nanofibers on carbon fabric for supercapacitor electrode applications (2012) (47)
- Catalytic Reduction of Hexavalent Chromium Using Flexible Nanostructured Poly(amic acids) (2011) (46)
- Experimental and numerical dynamic investigation of an energy efficient liquid cooled chiller-less data center test facility (2015) (44)
- Airflow and temperature distribution optimization in data centers using artificial neural networks (2013) (40)
- A dynamic compact thermal model for data center analysis and control using the zonal method and artificial neural networks (2014) (39)
- Multiscale modeling of thermoelectric generators for the optimized conversion performance (2013) (36)
- Experimental-Numerical Comparison for a High-Density Data Center: Hot Spot Heat Fluxes in Excess of 500 W/ft $^{2}$ (2009) (35)
- IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES BOARD OF GOVERNORS (Continued on back cover) (2005) (34)
- Chip to Facility Ramifications of Containment Solution on IT Airflow and Uptime (2016) (33)
- Thermal Characterization of Non-Raised Floor Air Cooled Data Centers Using Numerical Modeling (2005) (32)
- Three-objective shape optimization and parametric study of a micro-channel heat sink with discrete non-uniform heat flux boundary conditions (2019) (32)
- Effect of isolating cold aisles on rack inlet temperature (2008) (31)
- A numerical study of the thermal performance of an impingement heat sink-fin shape optimization (2002) (29)
- Experimental and Numerical Characterization of a Raised Floor Data Center Using Rapid Operational Flow Curves Model (2015) (28)
- Effect of Under Floor Blockages on Data Center Performance (2006) (27)
- Flexible poly(amic acid) conducting polymers: effect of chemical composition on structural, electrochemical, and mechanical properties. (2010) (27)
- A Roll-to-Roll Photolithography Process for Establishing Accurate Multilayer Registration on Large Area Flexible Films (2010) (27)
- Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment (2015) (27)
- Heat Conduction in Multilayered Rectangular Domains (2007) (26)
- UNSTEADY NATURAL CONVECTION GENERATED BY A HEATED SURFACE WITHIN AN ENCLOSURE (1986) (26)
- TRANSIENT AND STEADY-STATE NUMERICAL SOLUTIONS IN NATURAL CONVECTION (1978) (26)
- Innovative approaches of experimentally guided CFD modeling for data centers (2015) (26)
- Experimental and Analytical Studies on the High Cycle Fatigue of Thin Film Metal on PET Substrate for Flexible Electronics Applications (2011) (26)
- Modeling of boiling flow in microchannels for nucleation characteristics and performance optimization (2013) (25)
- Performance Analysis of a Combination System of Concentrating Photovoltaic/Thermal Collector and Thermoelectric Generators (2014) (25)
- An experimental and numerical investigation of novel solution for energy management enhancement in data centers using underfloor plenum porous obstructions (2021) (25)
- Chip to Chiller Experimental Cooling Failure Analysis of Data Centers: The Interaction Between IT and Facility (2016) (24)
- A novel alternate approach for multiscale thermal transport using diffusion in the Boltzmann Transport Equation (2011) (24)
- Electrochemical measurements of biofilm development using polypyrrole enhanced flexible sensors (2013) (23)
- Dynamic response and control analysis of cross flow heat exchangers under variable temperature and flow rate conditions (2015) (23)
- Performance and Reliability Analysis of Hybrid Concentrating Photovoltaic/Thermal Collectors With Tree-Shaped Channel Nets' Cooling System (2013) (22)
- Measurements and Calculations of Transient Natural Convection in Water (1982) (22)
- An Analytical Study of the Optimized Performance of an Impingement Heat Sink (2004) (21)
- Dynamic Analysis of Cross Flow Heat Exchangers in Data Centers Using Transient Effectiveness Method (2014) (21)
- Numerical modeling approach to dynamic data center cooling (2010) (21)
- Effect of Transient Boundary Conditions and Detailed Thermal Modeling of Data Center Rooms (2012) (20)
- A Compact Thermal Model for Data Center Analysis using the Zonal Method (2013) (20)
- Thermal mass characterization of a server at different fan speeds (2012) (20)
- Estimating Kapitza Resistance Between ${\rm Si}\hbox{-}{\rm SiO}_{2}$ Interface Using Molecular Dynamics Simulations (2011) (20)
- Simulations of Damage, Crack Initiation, and Propagation in Interlayer Dielectric Structures: Understanding Assembly-Induced Fracture in Dies (2012) (20)
- Multiscale thermal device modeling using diffusion in the Boltzmann Transport Equation (2013) (20)
- Thermal management roadmap: Cooling electronic products from hand-held dvices to supercomputers (2003) (20)
- Numerical modeling of data center with transient boundary conditions (2010) (19)
- Factor Effect Study for the High Cyclic Bending Fatigue of Thin Films on PET Substrate for Flexible Displays Applications (2011) (19)
- Data Center Cooling Prediction Using Artificial Neural Network (2007) (19)
- Transport near a vertical ice surface melting in water of various salinity levels (1983) (18)
- Thermal modeling of hybrid concentrating PV/T collectors with tree-shaped channel networks cooling system (2012) (18)
- A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package (2000) (18)
- Impact of Cold Aisle Containment on Thermal Performance of Data Center (2013) (17)
- Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles (2018) (17)
- Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet (2015) (17)
- Numerical investigation of inter-zonal boundary conditions for data center thermal analysis (2014) (17)
- Performance analysis and shape optimization of a water-cooled impingement micro-channel heat sink including manifolds (2020) (17)
- Multiscale modeling of Thermoelectric Generators for conversion performance enhancement (2015) (16)
- Early detection of Candida albicans biofilms at porous electrodes. (2013) (16)
- Optimization of Cold Aisle Isolation Designs for a Data Center With Roofs and Doors Using Slits (2009) (16)
- Cross Flow Heat Exchanger Modeling of Transient Temperature Input Conditions (2014) (16)
- Nonuniform temperature boundary condition effects on data center cross flow heat exchanger dynamic performance (2014) (16)
- Prediction of Cold Aisle End Airflow Boundary Conditions Using Regression Modeling (2007) (15)
- Hybrid microchannel/multi-jet two-phase heat sink: A benchmark and geometry optimization study of commercial product (2021) (15)
- Optimization Study for a Parallel Plate Impingement Heat Sink (2006) (15)
- Models of Steady Heat Conduction in Multiple Cylindrical Domains (2006) (15)
- Hot spot mitigation using single-phase microchannel cooling for microprocessors (2010) (15)
- Thermal Modeling and Life Prediction of Water-Cooled Hybrid Concentrating Photovoltaic/Thermal Collectors (2013) (15)
- Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture (2010) (15)
- Performance of Temperature Controlled Perimeter and Row-Based Cooling Systems in Open and Containment Environment (2015) (15)
- Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance (2011) (14)
- Random network percolation models for particulate thermal interface materials (2006) (14)
- Guidelines on Managing Under Floor Blockages for Improved Data Center Performance (2006) (14)
- Optimization of cluster cooling performance for data centers (2008) (14)
- Multi-objective optimization of a chip-attached micro pin fin liquid cooling system (2021) (14)
- Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers (2019) (14)
- Multivariate Prediction of Airflow and Temperature Distributions Using Artificial Neural Networks (2011) (14)
- Dynamic models for server rack and CRAH in a room level CFD model of a data center (2014) (14)
- Long-term transient thermal analysis using compact models for data center applications (2014) (13)
- Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory (2013) (13)
- TRANSIENT NATURAL CONVECTION ADJACENT TO A VERTICAL FLAT SURFACE: THE THERMAL CAPACITY EFFECT (1981) (13)
- Analysis of transient and hysteresis behavior of cross-flow heat exchangers under variable fluid mass flow rate for data center cooling applications (2015) (13)
- Multi-objective optimization of temperature distributions using Artificial Neural Networks (2012) (12)
- Performance Analysis and Shape Optimization of an Impingement Microchannel Cold Plate (2020) (12)
- Effect of Cold Aisle Containment Leakage on Flow Rates and Temperatures in a Data Center (2013) (12)
- Degradation of Fan Performance in Cooling Electronics: Experimental Investigation and Evaluating Numerical Techniques (2021) (12)
- Estimating Kapitza resistance between Si-SiO2 interface using molecular dynamics simulations (2008) (12)
- Analysis of airflow imbalances in an open compute high density storage data center (2016) (12)
- A statistical prediction of cold aisle end airflow boundary conditions (2006) (12)
- A Numerical Steady State and Dynamic Study in a Data Center Using Calibrated Fan Curves for CRACs and Servers (2013) (11)
- Cooling of microelectronic and nanoelectronic equipment : advances and emerging research (2014) (11)
- Ranking and Optimization of CAC and HAC Leakage Using Pressure Controlled Models (2015) (11)
- Numerical Modeling of Data Center Clusters: Impact of Model Complexity (2006) (11)
- Experimental characterization of pressure drop in a server rack (2014) (11)
- Impact of elevated temperature on data center operation based on internal and external IT instrumentation (2017) (11)
- Modeling Heat Transport in Thermal Interface Materials Enhanced With MEMS-Based Microinterconnects (2010) (11)
- Steady-state and transient comparison of cold and hot aisle containment and chimney (2016) (11)
- Dynamic Analysis of Hybrid Cooling Data Centers Subjects to the Failure of CRAC Units (2013) (11)
- Full-Field Simulations of Particulate Thermal Interface Materials: Separating the Effects of Random Distribution from Interfacial Resistance (2006) (11)
- Comparative Thermal and Energy Analysis of a Hybrid Cooling Data Center With Rear Door Heat Exchangers (2013) (11)
- Significance Level of Factors for Different Airflow Management Configurations of Data Centers (2005) (10)
- The Effect of Polydispersivity on the Thermal Conductivity of Particulate Thermal Interface Materials (2009) (10)
- Facility Cooling Failure Analysis of Direct Liquid Cooling System in Data Centers (2017) (10)
- Utilizing practical fan curves in CFD modeling of a data center (2013) (10)
- Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications (2009) (10)
- Transient effectiveness characteristics of cross flow heat exchangers in data center cooling systems (2014) (10)
- Sub-continuum thermal transport modeling using diffusion in the Lattice Boltzmann Transport Equation (2014) (10)
- Experimental characterization of a Rear Door Heat exchanger with localized containment (2016) (10)
- Effect of Thermal Characteristics of Electronic Enclosures on Dynamic Data Center Performance (2010) (10)
- Comparative Analysis of Microchannel Heat Sink Configurations Subject to a Pressure Constraint (2009) (10)
- Development and verification of compact transient heat exchanger models using transient effectiveness methodologies (2015) (10)
- Thermo-Mechanical Analysis of Thru-Silicon-Via Based High Density Compliant Interconnect (2007) (10)
- Review and Analysis of Cross Flow Heat Exchanger Transient Modeling for Flow Rate and Temperature Variations (2015) (9)
- An analytical study of transport in a thermal interface material enhanced with carbon nanotubes (2004) (9)
- Hierarchical field compositions for simulations of near-percolation thermal transport in particulate materials (2009) (9)
- Stability of Interdigitated Microelectrodes of Flexible Chemiresistor Sensors (2012) (9)
- Numerical study of a novel passive micromixer design (2010) (9)
- Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density (2018) (9)
- Melting characteristics of horizontal ice surfaces in cold saline water (1983) (9)
- Multi-objective optimization of 3D printed liquid cooled heat sink with guide vanes for targeting hotspots in high heat flux electronics (2021) (9)
- Pressure drop analysis of direct liquid cooled (DLC) rack (2017) (9)
- An Experimental Apparatus for Two-phase Cooling of High Heat Flux Application using an Impinging Cold Plate and Dielectric Coolant (2020) (9)
- Measurements and calculations of transient natural convection in air (1980) (8)
- Geometric Optimization of an Impinging Cold-Plate with a Trapezoidal Groove Used for Warm Water Cooling (2018) (8)
- Experimental Characterization of Cold Plates used in Cooling Multi Chip Server Modules (MCM) (2018) (8)
- Additive Laser Metal Deposition Onto Silicon for Enhanced Microelectronics Cooling (2019) (8)
- A multiscale modeling of Thermoelectric Generators for conversion efficiency optimization (2012) (8)
- Airflow Management Using Active Air Dampers in Presence of a Dynamic Workload in Data Centers (2019) (8)
- A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes (2006) (8)
- A Design Methodology for Controlling Local Airflow Delivery in Data Centers Using Air Dampers (2019) (8)
- Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers (2015) (8)
- Transient mixed convection adjacent to a vertical flat surface (1982) (8)
- A Numerical Study for Contained Cold Aisle Data Center Using CRAC and Server Calibrated Fan Curves (2013) (7)
- Steady State and Transient Comparison of Perimeter and Row-Based Cooling Employing Controlled Cooling Curves (2015) (7)
- Micron-Sized Feature Overlay Alignment on Large Flexible Substrates for Electronic and Display Systems (2011) (7)
- Experimentally Verified Transient Models of Data Center Crossflow Heat Exchangers (2014) (7)
- Comparison and Evaluation of Different Monitoring Methods in a Data Center Environment (2017) (7)
- Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (2006) (7)
- On refining the parameters of a Random Network Model for determining the effective thermal conductivity of particulate thermal interface materials (2010) (7)
- Numerical modeling and optimization of a V-groove warm water cold-plate (2017) (6)
- Experimental investigation of direct liquid cooling of a two-die package (2018) (6)
- An Improved Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials (2009) (6)
- Development of a complete transient microchannel heat sink model (2008) (6)
- Machine learning assisted development of IT equipment compact models for data centers energy planning (2022) (6)
- The Impact of Interfacial Adhesion on PTH and Via Stress State (1997) (6)
- Data center crossflow heat exchanger study under different transient temperature boundary conditions (2014) (6)
- Experimental characterization of the rear door fans and heat exchanger of a fully-enclosed, hybrid-cooled server cabinet (2015) (6)
- Experimental characterization and modeling of a water-cooled server cabinet (2014) (6)
- Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance (2009) (6)
- The Study of the Polydispersivity Effect on the Thermal Conductivity of Particulate Thermal Interface Materials by Finite Element Method (2013) (6)
- Transient Analysis for Contained-Cold-Aisle Data Center (2012) (6)
- Design, fabrication and implementation of smart three axis compliant interconnects for ultra-thin chip stacking technology (2006) (6)
- Numerical investigation of underfloor obstructions in open-contained data center with fan curves (2014) (6)
- Journal of Electronic Packaging, Transactions of the ASME: Foreword (2004) (6)
- Numerical Modeling of Data Center Clusters (2012) (5)
- Neural Network Modeling in Model-Based Control of a Data Center (2015) (5)
- Hierarchical Modeling and Trade-Off Studies in Design of Thermal Interface Materials (2005) (5)
- Direct Micro-Pin Jet Impingement Cooling for High Heat Flux Applications (2020) (5)
- Simulations of damage and fracture in ULK under pad structures during Cu wirebond process (2014) (5)
- Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks (2020) (5)
- An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages (2012) (5)
- Geometric modifications to simple microchannel design for enhanced mixing (2008) (5)
- The Impact of Cold Aisle Containment Pressure Relief on IT Availability (2018) (5)
- A dynamic model of failure scenarios of the dry cooler in a liquid cooled chiller-less data center (2015) (5)
- The Thermal Capacity Effect Upon Transient Natural Convection in a Rectangular Cavity (1990) (5)
- Thermal performance of a two-phase flat thermosyphon with surface wettability modifications (2021) (5)
- Experimental Investigation of the Impact of Under Floor Blockages on Flow Distribution in a Data Center Cell (2007) (5)
- Shifting to energy efficient hybrid cooled data centers using novel embedded floor tiles heat exchangers (2021) (5)
- Precision overlay registration of micron sized features on unsupported flexible films (2009) (5)
- Measurements and calculations of transient mixed convection in air (1985) (5)
- General Guidelines for Commercialization a Small-Scale In-Row Cooled Data Center: A Case Study (2020) (5)
- Parametric analysis for thermal characterization of leakage flow in data centers (2014) (5)
- Acoustic Emission Analysis for Fatigue Prediction of Lap Solder Joints in Mode Two Shear (1999) (4)
- A novel integrated fuzzy control system toward automated local airflow management in data centers (2021) (4)
- Experimental characterization of a cold plate used in warm water cooling of data centers (2017) (4)
- Thermal enhancements for a thin film chip carrier (1992) (4)
- Impact of Fin Geometry and Surface Roughness on Performance of an Impingement Two-phase Cooling Heat Sink (2021) (4)
- Numerical Optimization Study for a Parallel Plate Impingement Heat Sink (2003) (4)
- Thermal Analysis of MEMS Actuator Performance (2007) (4)
- Management and predictions of operational changes and growth in mission critical facilities (2016) (4)
- Thermal Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages (2009) (4)
- Experimental Analysis of Different Measurement Techniques of Server-Rack Airflow Predictions Towards Proper DC Airflow Management (2020) (4)
- An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads (2020) (4)
- A study of the thermal characterization of a high — performance flip chip package (2008) (4)
- Comparisons of the Mechanical Behaviors of Poly (3, 4-ethylenedioxythiophene) (PEDOT) and ITO on Flexible Substrates (2013) (4)
- A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices (2021) (4)
- Novel Experimental Methodology for Characterizing Fan Performance in Highly Resistive Environments (2020) (4)
- Performance Analysis of a Combination System of Concentrating PV/T Collector and TEGs (2013) (3)
- Heat Conduction in a Rectangular Tube With Eccentric Hot Spots (2011) (3)
- Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product (2020) (3)
- Smart Three Axis Compliant (STAC) Interconnect: An Ultra-High Density MEMS Based Interconnect for Wafer-Level Ultra-Thin Die (2005) (3)
- Comparative Analysis of Different In Row Cooler Management Configurations in a Hybrid Cooling Data Center (2015) (3)
- Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry (1997) (3)
- An Approach for Assessing the Long-Term Reliability of Lead-Free Electronics Under In-Field Conditions (2016) (3)
- Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design (2019) (3)
- Transient power analysis to estimate the thermal time lag of a microprocessor hot spot (2015) (3)
- Analysing real time power of the microprocessor to estimate thermal time constant of the hotspot (2012) (3)
- EPTC 2021 Invited Technology Talk: Roadmap Based on Holistic Understanding of Thermo-Mechanical Challenges from Package to System to Maximize Silicon Performance (2021) (3)
- Data Center Transient Flow Analysis Using Proper Orthogonal Decomposition (2013) (3)
- Molecular Dynamics simulations of thermal conductivity in composites consisting of aluminum oxide nanoparticles surrounded by polyethylene oxide (2015) (3)
- Experimental methods to characterize the impact of cross flow orientation on jets of air after a perforated tile (2017) (3)
- Comprehensive Experimental and Computational Analysis of a Fully Contained Hybrid Server Cabinet (2017) (3)
- A new technique for calibrating piezoresistive stress sensor chips (2008) (3)
- Single-phase liquid cooling of a quad-core processor (2011) (3)
- Special section on components and packaging technologies with contributions from ITherm 2002 thermal management track (2003) (3)
- Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid (2021) (3)
- Transient Effectiveness Methods for the Dynamic Characterization of Heat Exchangers (2017) (3)
- Implementing rack thermal capacity in a room level CFD model of a data center (2014) (3)
- Experimental Failure Analysis of a Rear Door Heat Exchanger With Localized Containment (2017) (3)
- An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials (2013) (3)
- Transactions on Components and Packaging Technologies Editors CPMT Transactions Editor-in-Chief (2009) (3)
- Establishing Thermal Air-cooled Limit for High Performance Electronics Devices (2020) (3)
- Multiphysics Approach to Modeling Supercapacitors for Improving Performance (2011) (3)
- An Experimental Analysis of Hot Aisle Containment Systems (2018) (3)
- Quasi-steady modeling of data center heat exchanger under dynamic conditions (2017) (3)
- Molecular Dynamics Simulations of Nanotube-Polymer Composites for Use as Thermal Interface Material (2003) (3)
- Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles (2017) (3)
- Molecular dynamics study of the influence of aggregation and percolation in Al2O3/polyethylene oxide nanofluids on the effective thermal conductivity (2020) (3)
- Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation (2018) (2)
- Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly with Sn3.9Ag0.6Cu SAC Alloy (2005) (2)
- Numerical Investigation of Novel Underfloor Air-Directors Effect on Data Center Performance (2019) (2)
- Computational Study of Air Cooled Data Centers Assisted With Locally Distributed Water to Air Heat Exchangers (2013) (2)
- Perimeter Cooling Unit and Localized Row-Based Cooling Unit Transient Air Flow Effects Modeling and Characterization in Data Centers (2015) (2)
- Improving the Performance of an Impingement Heat Sink by Modifying the Fin Shapes (2009) (2)
- The study of the polydispersivity effect on the thermal conductivity of particulate Thermal Interface Materials to refine the Random Network Model (2012) (2)
- Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits (2020) (2)
- Thermal conductivity of amorphous silica using non-equilibrium molecular dynamics simulations (2006) (2)
- Characterization of cu free air ball constitutive behavior using microscale compression test (2014) (2)
- Simulations of Deformation and Stress During Copper Wirebond on ULK Chips (2013) (2)
- Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study (2018) (2)
- Mixing Enhancement in Two-Component Microchannel Flow: Geometric and Pulsed Flow Effects (2007) (2)
- Characterization of a Server Thermal Mass Using Experimental Measurements (2011) (2)
- On reliability and uptime of IT in contained solution (2016) (2)
- Thermal Design Criteria for Extraordinary Performance of Devices Cooled by Microchannel Heat Sink (2010) (2)
- Microstructural characteristics influencing the effective thermal conductivity of particulate thermal interface materials (2008) (2)
- Transport adjacent to ice surfaces melting in saline water: visualization experiments (1984) (2)
- Enhancement of the Power-Conversion Efficiency for Thermoelectric Generators (2013) (2)
- Modeling racks and servers heat capacity in a physics based dynamic CFD model of data centers (2013) (2)
- Optimization study of Supercapacitor electrode material composition and thickness for enhanced performance of the Supercapacitor (2011) (2)
- Performance Analysis of Impinging Chip-Attached Micro Pin Fin Direct Liquid Cooling Package for Hotspot Targeted Applications (2021) (2)
- Squeezing Flow of a Power Law Fluid Between Grooved Plates (2009) (2)
- Thermal Modeling and Heat Management of Supercapacitor Modules by High Velocity Impinging Fan Flow (2011) (2)
- Selective laser melting of metal structures onto graphite substrates via a low melting point interlayer alloy (2022) (2)
- Effect of lamination on the bending fatigue life of copper coated PET substrate (2011) (2)
- Solving Thermal Issues in a Three-Dimensional-Stacked-Quad-Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through-Silicon-Vias (2013) (2)
- Prediction of Hot Aisle Partition Airflow Boundary Conditions (2013) (2)
- A porous elastic model for bacterial biofilms: application to the simulation of deformation of bacterial biofilms under microfluidic jet impingement. (2012) (2)
- Establishing the Single-Phase Cooling Limit for Liquid-Cooled High Performance Electronic Devices (2020) (1)
- Thermal-Aware Power Migration in Many-Core Processors (2010) (1)
- An Assessment of Risk of Fracture During Wirebond Over Active Circuits on ULK Dies (2016) (1)
- A Transient Technique to Measure the Temperature Coefficient of Resistance for Thin Film Resistors (1989) (1)
- Single-Phase Microchannel Cooling for Stacked Single Core Chip and DRAM (2011) (1)
- Transient Mixed-Convection With Applications to Cooling of Biomaterials (2005) (1)
- Assembly of Copper Column Interconnect Flip Chip (2007) (1)
- An Adaptive Approach for Dealing with Flow Disruption in Virtualized Water-Cooled Data Centers (2019) (1)
- Latency-Aware Dynamic Server and Cooling Capacity Provisioner for Data Centers (2021) (1)
- Design and Thermal Analysis of a 3-D Printed Impingement Pin Fin Cold Plate for Heterogeneous Integration Application (2022) (1)
- An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient IT Load (2019) (1)
- Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks (2015) (1)
- Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems (2015) (1)
- Optimal Arrangement of Multiple Heat Sources in Vertically Stacked Two-Layer 3-D IC Using Genetic Algorithm (2019) (1)
- Characterization of Liquid Cooled Cold Plates for a Multi Chip Module (MCM) and their Impact on Data Center Chiller Operation (2019) (1)
- Fin-shape optimization of an impingement-parallel plate heat sink (2010) (1)
- Comparative Analysis of Microchannel Cooling Schemes Subject to a Pressure Constraint (2007) (1)
- Liquid cooling of a stacked quad-core processor and DRAM using laminar flow in microchannels (2011) (1)
- Encyclopedia of Packaging Materials, Processes, and Mechanics (2019) (1)
- Thermal Management of Electronics During Continuous and Intermittent Operation Mode Employing Phase Change Material-Based Heat Sinks—Numerical Study (2021) (1)
- Empirical analysis of blower cooling failure in containment: Effects on IT performance (2016) (1)
- Neural Network Modeling of Parallel-Plain Fin Heat Sink (2013) (1)
- Modeling of Two-Phase Micro-Channel Flow for Thermal Management of Electronic Systems (2010) (1)
- Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment (2012) (1)
- Moisture Concentration and Temperature Dependence of the Coefficient of Hygroscopic Swelling (CHS) (2009) (1)
- Transient Thermal Performance of Rear Door Heat Exchanger in Local Contained Environment During Water Side Failure (2017) (1)
- Best Engineering Practices to Establish Cooling Limit for 375W Add-in PCI-e Center Accelerator Card with Active Optical (2019) (1)
- Integrated Circuit Packaging (2003) (1)
- Improved Zonal Model for Data Center Analysis (2013) (1)
- Application of Split Flow Design Technique to Simple Microchannel Geometries for Enhanced Mixing (2008) (1)
- Thermal management of a micro-display engine assembly (2004) (1)
- Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward Crah Technology (2022) (1)
- Nanocomposite pastes for thermal and mechanical bonding (2014) (1)
- Numerical and experimental study of the effect of thermocouple wire attachment on thermal characterization of a high performance flipchip package (2010) (1)
- Foreword Special Section on ITherm 2004 Mechanics Track (2005) (0)
- Impact of Fans Location on the Cooling Efficiency of IT Servers (2019) (0)
- Heat Conduction in Three Dimensional Stacked Packages (2005) (0)
- Foreword contributions from the 1998 intersociety conference on thermal and thermomechanical phenomena in electronic packages (1999) (0)
- A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification (2022) (0)
- An Integrated Nano-Structured Heat Spreader for High Heat Flux Electronic Systems (2010) (0)
- Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging CNC Manufactured Liquid Cooling Cold Plate (2022) (0)
- Flip-Chip Technology In Organic Chip Carriers (0)
- Special Issue With Contributions From ITherm 2004 (2006) (0)
- Cabinet level prediction of IT deployment in operational condition changes (2016) (0)
- Effects of Different Coolants on the Cooling Performance of an Impingement Microchannel Cold Plate (2021) (0)
- Erratum: “Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks” [J. Vac. Sci. Technol. B 24, 1780 (2006)] (2007) (0)
- Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques (1999) (0)
- Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling (2020) (0)
- Design Improvement of a Commercial Impingement Two-Phase Cold Plate Used for High Heat Flux Applications (2022) (0)
- Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink (2022) (0)
- Energy optimization and thermal management of data centers (2015) (0)
- Transient natural convection near a uniform flux surface with appreciable heat capacity (1988) (0)
- An Inverse Procedure for Estimating the Anand Viscoplastic Constitutive Model Parameters for Copper Free-Air Ball (2015) (0)
- Professor Issam Mudawar on his 60th birthday (2015) (0)
- Die Stress Analysis in Stacked Die Chip Scale Packages (SCSP) (2005) (0)
- Selection of Method for Fatigue Life Prediction Under Random Loading (2001) (0)
- Liquid to Air Cooling for High Heat Density Liquid Cooled Data Centers (2022) (0)
- Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package (1998) (0)
- FRONT MATTER (2019) (0)
- Welcome to ITHERM 2006 (2006) (0)
- Nature of Package-Induced Deformation and the Risk of Fracture in Low-k Dielectric Stacks (2011) (0)
- Comparative Numerical Analysis of Angled Branching Microchannel Heat Sink (2013) (0)
- A Holistic Thermal Overview of the Integrated Data Center (2017) (0)
- Performance Study of a GaAs Based Laser Diode Chip in a Condensing Environment (2009) (0)
- A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Applications (2023) (0)
- Electronic circuit package assembly and radiating device which can be inserted into edge-type connector (1991) (0)
- A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages (2006) (0)
- Flow Disruptions and Mitigation in Virtualized Water-Cooled Data Centers (2019) (0)
- Experimental Measurements of Temperature Distribution in Three Dimensional Stacked Package (2007) (0)
- A Lamination Studv of a ComDosite LCD Flat Panel DisDlav (2002) (0)
- An electronic apparatus with heat distribution body. (1989) (0)
- Spatial Thermal Conductivity Variation of Particulate-Filled Thermal Interface Materials (2022) (0)
- ITherm 2004 Organizing Committee (2004) (0)
- HIR Challenges and Opportunity (2021) (0)
- Compact Modeling of Fractal Tree-Shaped Microchannel Liquid Cooling Systems (2011) (0)
- Genetic Algorithm based Predictive model for COVID 19 – Theoretical Model based on an evolutionary approach (2021) (0)
- Some Transport Issues in the Development, Qualification, and Manufacture of Electronic Packages (2001) (0)
- Impingement heat sink optimization for microprocessors with significant hot spots (2010) (0)
- Supervised Machine-Learning Approach for the Optimal Arrangement of Active Hotspots in 3-D Integrated Circuits (2021) (0)
- UNSTEADY BUOYANCY INDUCED FLOW IN AN ENCLOSURE. (1987) (0)
- Process and Reliability of Copper Column Flexible Flip Chip Connection (F2C2) (2008) (0)
- Inclined Cavity Effects With Application to Cooling of Biomaterials (2005) (0)
- Two-phase Impingement Cooling using a Trapezoidal Groove Microchannel Heat Sink and Dielectric Coolant HFE 7000 (2021) (0)
- Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure (2011) (0)
- Predictive model for COVID 19 curve - An evolutionary approach (2020) (0)
- Non-Destructive Evaluation of Thermal Interface Materials using Modulated Heating of Selective Cores (2022) (0)
- Thermal Characterization of Non-Isolated DC to DC Convertor (2011) (0)
- Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection (2011) (0)
- Effective Thermal Conductivity of Phase Change Material-Based Composites for Electronic Cooling (2021) (0)
- BACK MATTER (2019) (0)
- A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction (2016) (0)
- Effect of Relocation of Functional Units of a Non-Uniformly Powered Microprocessor on Thermal and Device Clock Performance (2009) (0)
- Development of a Microfluidic Based Electrochemical Cell for Analyzing Bacterial Biofilms (2016) (0)
- Analytical Model of Heat Conduction in a Tubular Geometry With Application to a Nano-Structured Thermal Interface (2005) (0)
- Hierarchical Synthesis of Particulate Thermal Interface Materials (2006) (0)
- Assessment of the performance of dielectric fluids in microchannel heat sinks (2008) (0)
- Publication Guidelines: Final Manuscript Preparation (2008) (0)
- Liquid Cooling Utilizing a Hybrid Micro-Channel/multi-Jet Heat Sink: A Component Level Study of Commercial Product (2021) (0)
- Foreword Special Issue of Components and Packaging Technologies With Contributions From ITherm 2004 Thermal Management Track (2005) (0)
- Modeling heat transport in thermal interface materials enhanced with MEMS based microinterconnects (2008) (0)
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