Carl V. Thompson
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American engineer
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Carl V. Thompsonengineering Degrees
Engineering
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Mechanical Engineering
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Applied Physics
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Engineering
Carl V. Thompson's Degrees
- Masters Mechanical Engineering Stanford University
- Bachelors Mechanical Engineering Stanford University
Why Is Carl V. Thompson Influential?
(Suggest an Edit or Addition)According to Wikipedia, Carl V. Thompson is an American engineer currently the Stavros Salapatas Professor of Materials Science and Engineering at Massachusetts Institute of Technology. Education SB, Materials Science and Engineering, MIT, 1976SM, Applied Physics, Harvard University, 1977PhD, Applied Physics, Harvard University, 1982
Carl V. Thompson's Published Works
Published Works
- Solid-State Dewetting of Thin Films (2012) (867)
- Structure Evolution During Processing of Polycrystalline Films (2000) (746)
- Grain Growth in Thin Films (1990) (585)
- All-carbon-nanofiber electrodes for high-energy rechargeable Li–O2 batteries (2011) (516)
- Stress and grain growth in thin films (1996) (457)
- Transient nucleation in condensed systems (1983) (396)
- Influence of Li2O2 morphology on oxygen reduction and evolution kinetics in Li–O2 batteries (2013) (370)
- On the approximation of the free energy change on crystallization (1979) (369)
- Chemical and Morphological Changes of Li–O2 Battery Electrodes upon Cycling (2012) (347)
- Condensation on superhydrophobic surfaces: the role of local energy barriers and structure length scale. (2012) (334)
- Matching Glass-Forming Ability with the Density of the Amorphous Phase (2008) (302)
- The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films (2001) (301)
- Texture development in polycrystalline thin films (1995) (275)
- Mechanisms of Morphological Evolution of Li2O2 Particles during Electrochemical Growth. (2013) (262)
- Secondary grain growth in thin films of semiconductors: Theoretical aspects (1985) (258)
- Homogeneous crystal nucleation in binary metallic melts (1983) (238)
- Tuning of vertically-aligned carbon nanotube diameter and areal density through catalyst pre-treatment. (2008) (233)
- Synthesis of silicon nanowires and nanofin arrays using interference lithography and catalytic etching. (2008) (219)
- The yield stress of polycrystalline thin films (1993) (212)
- Nucleation and growth during reactions in multilayer Al/Ni films: The early stage of Al3Ni formation (1991) (207)
- Solid-state dewetting for ordered arrays of crystallographically oriented metal particles (2005) (206)
- In situ transmission electron microscopy observations of electrochemical oxidation of Li2O2. (2013) (205)
- Densely Packed Arrays of Ultra‐High‐Aspect‐Ratio Silicon Nanowires Fabricated using Block‐Copolymer Lithography and Metal‐Assisted Etching (2009) (200)
- Crack-like grain-boundary diffusion wedges in thin metal films (1999) (198)
- Chemical Instability of Dimethyl Sulfoxide in Lithium-Air Batteries. (2014) (192)
- Capillary instabilities in thin, continuous films (1992) (185)
- Self‐propagating explosive reactions in Al/Ni multilayer thin films (1990) (185)
- Grain size dependence of electromigration‐induced failures in narrow interconnects (1989) (183)
- The relative rates of secondary and normal grain growth (1987) (177)
- The role of electric field in pore formation during aluminum anodization (2011) (174)
- A two-dimensional computer simulation of capillarity-driven grain growth: Preliminary results (1988) (169)
- Tensile stress evolution during deposition of Volmer–Weber thin films (2000) (168)
- Evolution of structural defects associated with electrical degradation in AlGaN/GaN high electron mobility transistors (2010) (163)
- Simulation of thin film grain structures—I. Grain growth stagnation (1990) (151)
- Grain growth and grain size distributions in thin germanium films (1987) (139)
- Low temperature synthesis of vertically aligned carbon nanotubes with electrical contact to metallic substrates enabled by thermal decomposition of the carbon feedstock. (2009) (138)
- Solid-state dewetting of patterned thin films (2009) (134)
- The effect of nucleation conditions on the topology and geometry of two-dimensional grain structures (1987) (130)
- Templated Solid‐State Dewetting to Controllably Produce Complex Patterns (2011) (127)
- Computer simulation of strain energy effects vs surface and interface energy effects on grain growth in thin films (1996) (126)
- Crystal nucleation in amorphous (Au/100-y/Cu/y/)77Si9Ge14 alloys (1983) (122)
- Experimental evidence for nucleation during thin‐film reactions (1989) (121)
- Electromigration in Cu interconnects with very different grain structures (2001) (121)
- Ion‐bombardment‐enhanced grain growth in germanium, silicon, and gold thin films (1988) (117)
- Surface‐energy‐driven secondary grain growth in thin Au films (1986) (116)
- Surface‐energy‐driven secondary grain growth in ultrathin (<100 nm) films of silicon (1984) (111)
- Reaction kinetics of nickel/silicon multilayer films (1988) (110)
- Reversible stress relaxation during precoalescence interruptions of volmer-weber thin film growth. (2002) (110)
- Simulation of thin film grain structures—II. Abnormal grain growth (1992) (109)
- Nucleation‐limited phase selection during reactions in nickel/amorphous‐silicon multilayer thin films (1990) (106)
- Modeling electromigration‐induced stress evolution in confined metal lines (1995) (103)
- Electromigration and IC Interconnects (1993) (101)
- Cobalt nanoparticle arrays made by templated solid-state dewetting. (2009) (101)
- Grain growth and complex stress evolution during Volmer–Weber growth of polycrystalline thin films (2014) (100)
- Abnormal grain growth in aluminum alloy thin films (1991) (99)
- A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon. (2008) (99)
- Experimental and Computational Analysis of the Solvent-Dependent O2/Li(+)-O2(-) Redox Couple: Standard Potentials, Coupling Strength, and Implications for Lithium-Oxygen Batteries. (2016) (99)
- Epitaxial grain growth in thin metal films (1990) (97)
- Reversible stress changes at all stages of Volmer–Weber film growth (2004) (97)
- Rate-Dependent Nucleation and Growth of NaO2 in Na-O2 Batteries. (2015) (97)
- Simulations of stress evolution and the current density scaling of electromigration-induced failure times in pure and alloyed interconnects (1999) (95)
- Solidification‐Front Modulation to Entrain Subboundaries in Zone‐Melting Recrystallization of Si on SiO2 (1983) (91)
- Steady-state grain-size distributions resulting from grain growth in two dimensions (1999) (91)
- Computer simulation of microstructural evolution in thin films (1988) (89)
- Amorphization of silicon by femtosecond laser pulses (2004) (86)
- In situ transmission electron microscope studies of the kinetics of abnormal grain growth in electroplated copper films (2000) (82)
- On the role of diffusion in phase selection during reactions at interfaces (1992) (81)
- Phase field approach for simulating solid-state dewetting problems (2012) (80)
- Silicon-on-insulator by graphoepitaxy and zone-melting recrystallization of patterned films (1983) (79)
- Anisotropic edge retraction and hole growth during solid-state dewetting of single crystal nickel thin films (2011) (79)
- Controlling Solution-Mediated Reaction Mechanisms of Oxygen Reduction Using Potential and Solvent for Aprotic Lithium-Oxygen Batteries. (2016) (78)
- Activation volume for inelastic deformation in polycrystalline Ag thin films (2000) (77)
- Explosive silicidation in nickel/amorphous‐silicon multilayer thin films (1990) (77)
- Coarsening of particles on a planar substrate: Interface energy anisotropy and application to grain growth in thin films (1988) (75)
- Fabrication of silicon nanopillar-based nanocapacitor arrays (2010) (74)
- Role of oxygen in the OFF-state degradation of AlGaN/GaN high electron mobility transistors (2011) (74)
- Precursor gas chemistry determines the crystallinity of carbon nanotubes synthesized at low temperature (2011) (73)
- COMPETITION BETWEEN STRAIN AND INTERFACE ENERGY DURING EPITAXIAL GRAIN GROWTH IN AG FILMS ON NI(001) (1994) (72)
- Effect of current direction on the lifetime of different levels of Cu dual-damascene metallization (2001) (69)
- Simulation of the effects of grain structure and grain growth on electromigration and the reliability of interconnects (1997) (69)
- The Effects of the Mechanical Properties of the Confinement Material on Electromigration in Metallic Interconnects (2000) (67)
- Texture evolution during grain growth in polycrystalline films (1993) (66)
- Electromigration-induced transgranular failure mechanisms in single-crystal aluminum interconnects (1997) (66)
- Silicide precipitation and silicon crystallization in nickel implanted amorphous silicon thin films (1990) (66)
- The role of the ion‐solid interaction in ion‐beam‐induced deposition of gold (1991) (65)
- Evolution of thin-film and surface microstructure (1991) (64)
- The thickness dependence of the flow stress of capped and uncapped polycrystalline Ag thin films (1998) (63)
- Metal‐Catalyzed Etching of Vertically Aligned Polysilicon and Amorphous Silicon Nanowire Arrays by Etching Direction Confinement (2010) (63)
- Vertical etching with isolated catalysts in metal-assisted chemical etching of silicon. (2012) (62)
- Regular pattern formation through the retraction and pinch-off of edges during solid-state dewetting of patterned single crystal films (2010) (60)
- The effect of water on discharge product growth and chemistry in Li-O2 batteries. (2016) (60)
- Growth of single crystal ZnO nanorods on GaN using an aqueous solution method (2005) (60)
- Synthesis of tall carpets of vertically aligned carbon nanotubes by in situ generation of water vapor through preheating of added oxygen (2012) (59)
- Oxygen Reduction Reaction in Highly Concentrated Electrolyte Solutions of Lithium Bis(trifluoromethanesulfonyl)amide/Dimethyl Sulfoxide (2017) (58)
- Grain growth and evolution of other cellular structures (2001) (58)
- The effects of dopants on surface‐energy‐driven secondary grain growth in silicon films (1990) (58)
- Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees (2003) (56)
- Experimental characterization and modeling of the reliability of interconnect trees (2001) (56)
- Development of near‐bamboo and bamboo microstructures in thin‐film strips (1992) (55)
- Focused ion beam induced deposition of low‐resistivity gold films (1989) (55)
- Mechanisms of complex morphological evolution during solid-state dewetting of single-crystal nickel thin films (2010) (54)
- Impact of Water-Assisted Electrochemical Reactions on the OFF-State Degradation of AlGaN/GaN HEMTs (2014) (54)
- Direct evidence for effects of grain structure on reversible compressive deposition stresses in polycrystalline gold films. (2009) (53)
- Focused‐ion beam induced deposition of copper (1993) (53)
- Mechanics of Catalyst Motion during Metal Assisted Chemical Etching of Silicon (2013) (52)
- Evolution of stresses in passivated and unpassivated metal interconnects (1998) (51)
- Tensile stress generation during island coalescence for variable island-substrate contact angle (2003) (51)
- Monodomain High‐Aspect‐Ratio 2D and 3D Ordered Porous Alumina Structures with Independently Controlled Pore Spacing and Diameter (2007) (48)
- Selective Barrier Perforation in Porous Alumina Anodized on Substrates (2008) (47)
- A model for solid-state dewetting of a fully-faceted thin film (2013) (47)
- On the grain size and coalescence stress resulting from nucleation and growth processes during formation of polycrystalline thin films (1999) (47)
- In situ tensile and creep testing of lithiated silicon nanowires (2013) (47)
- MECHANISM OF ION BEAM INDUCED DEPOSITION OF GOLD (1994) (46)
- The Critical Role of the Underlayer Material and Thickness in Growing Vertically Aligned Carbon Nanotubes and Nanofibers on Metallic Substrates by Chemical Vapor Deposition (2010) (45)
- A new electromigration testing technique for rapid statistical evaluation of interconnect technology (1986) (44)
- Diffusional creep in damascene Cu lines (2001) (44)
- Correlation of stress and atomic-scale surface roughness evolution during intermittent homoepitaxial growth of (111)-oriented Ag and Cu. (2004) (43)
- Quantitative analysis of anisotropic edge retraction by solid-state dewetting of thin single crystal films (2013) (43)
- Templated assembly of Co-Pt nanoparticles via thermal and laser-induced dewetting of bilayer metal films. (2013) (43)
- Kinetic Modeling of Grain Growth in Polycrystalline Silicon Films Doped with Phosphorus or Boron (1988) (42)
- Growth of giant grains in silver thin films (1999) (42)
- Requirements for graphoepitaxial alignment through solid-state dewetting of Au films (2011) (42)
- Computer simulation of grain growth (1996) (40)
- The effects of the stress dependence of atomic diffusivity on stress evolution due to electromigration (1997) (40)
- Structural analysis of metalorganic chemical vapor deposited AIN nucleation layers on Si (1 1 1) (2004) (39)
- Analytic model for the grain structures of near‐bamboo interconnects (1994) (39)
- Impact of deposition conditions on the crystallization kinetics of amorphous GeTe films (2015) (38)
- Dependence of the electromigration flux on the crystallographic orientations of different grains in polycrystalline copper interconnects (2007) (38)
- Grain Growth and Texture Evolution in Thin Films (1996) (38)
- Circuit level reliability analysis of Cu interconnects (2004) (38)
- Graphoepitaxy of Ge on SiO2 by solid‐state surface‐energy‐driven grain growth (1984) (37)
- Impact of Moisture and Fluorocarbon Passivation on the Current Collapse of AlGaN/GaN HEMTs (2012) (37)
- Initial sequence and kinetics of silicide formation in cobalt/amorphous‐silicon multilayer thin films (1991) (37)
- Revealing instability and irreversibility in nonaqueous sodium-O2 battery chemistry. (2016) (36)
- Simulation of the influence of particles on grain structure evolution in two-dimensional systems and thin films (1999) (36)
- Calorimetric studies of reactions in thin films and multilayers (1989) (36)
- Effect of surface energy anisotropy on Rayleigh-like solid-state dewetting and nanowire stability (2015) (36)
- Grain Growth in Polycrystalline Thin Films of Semiconductors (1998) (36)
- Wafer-level ordered arrays of aligned carbon nanotubes with controlled size and spacing on silicon (2005) (35)
- Electromigration-induced extrusion failures in Cu/low-k interconnects (2008) (35)
- Mechanisms of thin film evolution (1994) (35)
- The Mechanism of Orientation in Si Graphoepitaxy by Laser or Strip Heater Recrystallization (1983) (35)
- Formation of Cu–Cu interfaces with ideal adhesive strengths via room temperature pressure bonding in ultrahigh vacuum (2007) (33)
- Compensation of grain growth enhancement in doped silicon films (1986) (32)
- Mechanical stresses and morphology evolution in germanium thin film electrodes during lithiation and delithiation (2015) (32)
- Experimental study of electromigration in bicrystal aluminum lines (1992) (31)
- Activation energy and prefactor for surface electromigration and void drift in Cu interconnects (2007) (31)
- Grain Growth in Polycrystalline Thin Films (1994) (31)
- Abnormal Anodic Aluminum Oxide Formation in Confined Structures for Lateral Pore Arrays (2008) (31)
- Growth and properties of (001)-oriented Pb(Zr0.52Ti0.48)O3/LaNiO3 films on Si(001) substrates with TiN buffer layers (2004) (31)
- Modeling of texture evolution in copper interconnects annealed in trenches (1999) (31)
- Correlation of shape changes of grain surfaces and reversible stress evolution during interruptions of polycrystalline film growth (2014) (30)
- Effect of As4 overpressure on initial growth of gallium arsenide on silicon by molecular beam epitaxy (1989) (30)
- Metal assisted anodic etching of silicon. (2015) (30)
- NiSi2 precipitation in nickel‐implanted silicon films (1987) (30)
- The effects of microstructural transitions at width transitions on interconnect reliability (2000) (30)
- Quantitative investigation of titanium/amorphous-silicon multilayer thin film reactions (1990) (30)
- High-performance solid-state on-chip supercapacitors based on Si nanowires coated with ruthenium oxide via atomic layer deposition (2017) (30)
- Nanoheteroepitaxial lateral overgrowth of GaN on nanoporous Si(111) (2006) (29)
- A comprehensive layout methodology and layout-specific circuit analyses for three-dimensional integrated circuits (2002) (29)
- Circuit-level reliability requirements for Cu metallization (2005) (29)
- Mixed-mode interface toughness of wafer-level Cu–Cu bonds using asymmetric chevron test (2008) (28)
- Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations (2007) (28)
- Field emission from a large area of vertically-aligned carbon nanofibers with nanoscale tips and controlled spatial geometry (2010) (28)
- Electromigration saturation in a simple interconnect tree (2000) (28)
- Effects of surface defects on surface stress of Cu(001) and Cu(111) (2006) (28)
- Spatial distribution of structural degradation under high-power stress in AlGaN/GaN high electron mobility transistors (2012) (27)
- Salt rejection in flow-between capacitive deionization devices (2018) (27)
- Fast and slow stress evolution mechanisms during interruptions of Volmer-Weber growth (2014) (27)
- Nucleation of an intermetallic at thin-film interfaces: VSi 2 contrasted with Al 3 Ni (1992) (26)
- Mechanisms for crystallographic orientation in the crystallization of thin silicon films from the melt (1988) (26)
- Cellular and dendritic morphologies on stationary and moving liquid‐solid interfaces in zone‐melting recrystallization (1987) (26)
- On the redox origin of surface trapping in AlGaN/GaN high electron mobility transistors (2014) (26)
- A hierarchical reliability analysis for circuit design evaluation (1998) (26)
- Nucleation controlled phase selection in vanadium/amorphous‐silicon multilayer thin films (1990) (24)
- Quantitative characterization and process optimization of low-temperature bonded copper interconnects for 3-D integrated circuits (2003) (24)
- Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects (2008) (24)
- Electromigration reliability comparison of Cu and Al interconnects (2005) (24)
- Influence of indium and phosphine on Au-catalyzed InP nanowire growth on Si substrates (2009) (24)
- Polysilicon films and interfaces (1988) (24)
- Methodology for electromigration critical threshold design rule evaluation (1999) (24)
- Electromigration resistance in a short three-contact interconnect tree (2006) (23)
- Computer Simulation of Grain Growth in Thin-film Interconnect Lines (1991) (23)
- Modeling and experimental characterization of electromigration in interconnect trees (1999) (23)
- Compositional dependence of Young’s moduli for amorphous Cu–Zr films measured using combinatorial deposition on microscale cantilever arrays (2011) (22)
- Coupled Stress Evolution in Polygranular Clusters and Bamboo Segments in Near-Bamboo Interconnects (1995) (21)
- Mechanical measurements on lithium phosphorous oxynitride coated silicon thin film electrodes for lithium-ion batteries during lithiation and delithiation (2016) (21)
- Diffusion and electromigration of copper in SiO2-passivated single-crystal aluminum interconnects (1999) (21)
- A technique for spatially-resolved contact resistance-free electrical conductivity measurements of aligned-carbon nanotube/polymer nanocomposites (2013) (21)
- Effects of patterning on the interface toughness of wafer-level Cu–Cu bonds (2008) (21)
- Application of contact theory to metal-metal bonding of silicon wafers (2007) (21)
- Orientation filtering by growth‐velocity competition in zone‐melting recrystallization of silicon on SiO2 (1983) (20)
- Numerical analysis of interface energy-driven coarsening in thin films and its connection to grain growth (1993) (19)
- Mechanism maps for electromigration-induced failure of metal and alloy interconnects (1999) (19)
- Anion adsorption induced reversal of coherency strain. (2005) (18)
- Stress development and relaxation during reactive film formation of Ni2Si (2004) (18)
- Effects of oblique-angle deposition on intrinsic stress evolution during polycrystalline film growth (2014) (18)
- Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits (2012) (18)
- Crystallization-induced stress in thin phase change films of different thicknesses (2008) (18)
- Zone-melting recrystallization of thick silicon on insulator films (1984) (18)
- Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation (2016) (18)
- Uni-, bi-, and tri-directional wetting caused by nanostructures with anisotropic surface energies. (2012) (17)
- Failure in Tungsten-Filled Via Structures (1995) (17)
- Evolution of Electromigration-Induced Voids in Single Crystalline Aluminum Lines with Different Crystallographic Orientations (1993) (17)
- Laser-assisted focused-ion-beam-induced deposition of copper (1996) (17)
- Simulation of microstructural evolution induced by scanned laser annealing of metallic interconnects (2001) (17)
- Activation energy determination for recrystallization in electroplated-copper films using differential scanning calorimetry (2003) (17)
- Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects (2007) (17)
- The mechanism of corner instabilities in single-crystal thin films during dewetting (2016) (17)
- Evolution of AlN buffer layers on silicon and effects on the properties of epitaxial GaN films (2003) (17)
- Mechanical stresses and crystallization of lithium phosphorous oxynitride-coated germanium electrodes during lithiation and delithiation (2016) (16)
- Liquid-Solid Interface Morphologies and Defect Structures in Zone-Melting-Recrystallized Silicon-On-Insulator Films (1987) (16)
- Beading instabilities in thin film lines with bamboo microstructures (1986) (16)
- The Effect of Cu Distribution on Post-Patterning Grain Growth and Reliability of Al-1%Cu Interconnects (1995) (16)
- Effects of active atomic sinks and reservoirs on the reliability of Cu∕low-k interconnects (2008) (16)
- Experimental characterization and modeling of the contact resistance of Cu–Cu bonded interconnects (2009) (16)
- Surface‐energy‐driven grain growth during rapid thermal annealing (<10 s) of thin silicon films (1987) (15)
- Materials Reliability in Microelectronics (1993) (15)
- Solidification Interface Morphologies in Zone Melting Recrystallization (1986) (15)
- Nanostructured Thin Film Silicon Anodes for Li-Ion Microbatteries. (2015) (14)
- Magnetic Anisotropy in Epitaxial Ni/Cu (100) Thin Films (1993) (14)
- Porosimetry and packing morphology of vertically aligned carbon nanotube arrays via impedance spectroscopy (2017) (14)
- Phase-Change Materials in Optically Triggered Microactuators (2008) (14)
- Comment on "Compressive stress in polycrystalline Volmer-Weber films". (2005) (14)
- The Origins of Epitaxial Orientations in thin Films (1992) (13)
- Origin of physical degradation in AlGaN/GaN on Si high electron mobility transistors under reverse bias stressing (2015) (13)
- Catalyst proximity effects on the growth rate of Si nanowires (2009) (13)
- Density change upon crystallization of amorphous Zr–Cu–Al thin films (2010) (13)
- Kinetic Study of the Initial Lithiation of Amorphous Silicon Thin Film Anodes (2018) (13)
- Void dynamics in copper-based interconnects (2011) (13)
- Crystallographic analysis of the solid-state dewetting of polycrystalline gold film using automated indexing in a transmission electron microscope (2015) (13)
- Experimental and Theoretical Aspects of Grain Growth in Thin Films (1992) (13)
- Effect of applied mechanical stress on the electromigration failure times of aluminum interconnects (1991) (12)
- Ion-induced chemical vapor deposition of high purity Cu films at room temperature using a microwave discharge H atom beam source (1997) (12)
- Length Effects on the Reliability of Dual-Damascene Cu Interconnects (2002) (12)
- Relaxation phenomena in evaporated amorphous silicon films (1989) (12)
- Parallel fabrication of polymer-protected nanogaps (2010) (12)
- Weak temperature dependence of stress relaxation in as-deposited polycrystalline gold films (2010) (12)
- Piezoresistive microcantilevers for in situ stress measurements during thin film deposition (2005) (12)
- The Effect of Variability Among Grain Boundary Energies on Grain Growth in Thin Film Strips (1994) (12)
- Layout-Specific Circuit Evaluation in 3-D Integrated Circuits (2003) (12)
- Characterization of the Young’s modulus, residual stress and fracture strength of Cu–Sn–In thin films using combinatorial deposition and micro-cantilevers (2015) (11)
- Abnormal Grain Growth in Thin Films due to Anisotropy of Free-Surface Energies (1992) (11)
- Perpendicular magnetization and surface magnetoelastic anisotropy in epitaxial Cu/Ni/Cu (001) (1996) (11)
- Simulation of the temperature and current density scaling of the electromigration-limited reliability of near-bamboo interconnects (1998) (11)
- Formation of single tiers of bridging silicon nanowires for transistor applications using vapor-liquid-solid growth from short silicon-on-insulator sidewalls. (2009) (11)
- The Effect of Solute Drag on Grain Growth in Thin Films (1993) (11)
- Microstructural evolution induced by scanned laser annealing in Al interconnects (1999) (11)
- Using line-length effects to optimize circuit-level reliability (2008) (11)
- Direct Sampling Ion Trap Mass Spectrometry (1993) (10)
- Electromigration proximity effects of two neighboring fast-diffusion segments in single-crystal aluminum lines (1999) (10)
- Joule heating-assisted electromigration failure mechanisms for dual damascene Cu/SiO/sub 2/ interconnects (2003) (10)
- Nanoheteroepitaxy of GaN on a nanopore array of Si(111) surface (2007) (10)
- Microstructure of gold grown by ion-induced deposition (1995) (10)
- Polysilicon thin films and interfaces (1990) (10)
- Electromigration Lifetimes of Single Crystal Aluminum Lines with Different Crystallographic Orientations (1994) (10)
- Grain Growth in Polycrystalline Silicon Films (1987) (10)
- Kinetic and Thermodynamic Aspects of Phase Evolution in Ti/a-Si Multilayer Films (1990) (9)
- Stress engineering using low oxygen background pressures during Volmer–Weber growth of polycrystalline nickel films (2015) (9)
- Threading dislocation movement in AlGaN/GaN-on-Si high electron mobility transistors under high temperature reverse bias stressing (2016) (9)
- Characterisation of defects generated during constant current InGaN-on-silicon LED operation (2017) (9)
- Numerical Modeling of Energy-Beam Induced Localized Melting of Thin SI Films (1989) (9)
- Grain Growth in Thin Films With Variable Grain Boundary Energy (1993) (8)
- Influence of Bonding Parameters on the Interaction Between Cu and Noneutectic Sn-In Solder Thin Films (2011) (8)
- Effect of annealing ambient on anisotropic retraction of film edges during solid-state dewetting of thin single crystal films (2016) (8)
- Microstructure of Gold Films Grown by Ion Induced Deposition (1987) (8)
- Mechanisms of the cyclic (de)lithiation of RuO2 (2020) (8)
- Contrasting failure characteristics of different levels of Cu dual-damascene metallization (2002) (8)
- Oxygen-induced giant grain growth in Ag films (2017) (8)
- Development Of Microstructure In Thin Films (1988) (8)
- Power-law scaling regimes for solid-state dewetting of thin films (2016) (8)
- Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation (2017) (8)
- Microscale oscillating crack propagation in silicon nitride thin films (2010) (7)
- Kinetics and Thermodynamics of Amorphous Silicide Formation in Metal/Amorphous-Silicon Multilayer Thin Films (1989) (7)
- Modeling the Effect of Lithium Superoxide Solvation and Surface Reduction Kinetics on Discharge Capacity in Lithium–Oxygen Batteries (2019) (7)
- Porosimetry and packing morphology of vertically-aligned carbon nanotube arrays via impedance spectroscopy. (2016) (7)
- Zone Melting Recrystallization of InSb Films on Oxidized Si Wafers (1983) (7)
- Secondary Grain Growth During Rapid Thermal Annealing of Doped Polysilicon Films (1987) (7)
- Reliability of Interconnects Exhibiting Bimodal Electromigrationinduced Failure Distributions (1992) (7)
- Modeling of the effects of crystallographic orientation on electromigration-limited reliability of interconnects with bamboo grain structures (2001) (7)
- Carbon nanotubes as interconnects: Emerging technology and potential reliability issues (2008) (7)
- Point defect enhanced grain growth in silicon thin films: The role of ion bombardment and dopants (1988) (7)
- Computer Simulation of Strain Energy and Surface- and Interface-Energy on Grain Growth in Thin Films (1994) (7)
- Summary Abstract: Ion induced deposition of gold films (1988) (7)
- A Statistical Characterization of Electromigration-Induced Open Failures in 2-Level Metal Structures (1991) (7)
- The effect of Al3Ti capping layers on electromigration in single-crystal aluminum interconnects (1998) (7)
- Three-dimensional graphoepitaxial alignment resulting from solid-state dewetting of Au films on surfaces with monoperiodic topography (2012) (7)
- Kinetics of Void Drift in Copper Interconnects (2006) (7)
- A Tungsten Interlayer Process for Fabrication of Through-Pore AAO Scaffolds on Gold Substrates (2011) (7)
- Experiments and models for circuit-level assessment of the reliability of Cu metallization (2004) (7)
- Fabrication of high aspect ratio AFM probes with different materials inspired by TEM “lift-out” method (2016) (7)
- Use of scanned laser annealing to control the bamboo grain length of Cu interconnects (2000) (7)
- Multi-cell thermogalvanic systems for harvesting energy from cyclic temperature changes (2018) (6)
- Use of Magneto-Optic Kerr Effect Measurements to Study Strain and Misfit Accommodation in Thin Films of Ni/Cu (100) (1993) (6)
- Fatal Void Size Comparisons in Via-Below and Via-Above Cu Dual-Damascene Interconnects (2004) (6)
- Perpendicular magnetic anisotropy in epitaxial Cu/Ni/Cu/Si (001) (1996) (6)
- Electromigration-induced bond improvement for three-dimensional integrated circuits (2009) (6)
- Modeling of the Structure and Reliability of Near-Bamboo Interconnects (1995) (6)
- High-performance polycrystalline RuOx cathodes for thin film Li-ion batteries (2018) (6)
- Kinetic Modeling of Grain Growth in Polycrystalline Silicon Films Doped with Phosphorus and Boron (1987) (6)
- Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees (2002) (6)
- Converting carbon nanofibers to carbon nanoneedles: catalyst splitting and reverse motion. (2010) (5)
- The Effect of Layer Thickness on the Reaction Kinetics of Nickel/Silicon Multilayer Films (1987) (5)
- The Effect of Thermal History On Interconnect Reliability (1993) (5)
- Graphoepitaxy and zone-melting recrystallization of patterned films (1983) (5)
- Thermal aware cell-based full-chip electromigration reliability analysis (2005) (5)
- Secondary Grain Growth in Thin Films (1985) (5)
- Effect of bonding and aging temperatures on bond strengths of Cu with 75Sn25In solders (2009) (5)
- Texture Maps for Orientation Evolution During Grain Growth in Thin Films (1995) (5)
- Analytic model for the development of bamboo microstructures in thin film strips undergoing normal grain growth (2000) (5)
- Modelling of Grain Growth in Thin Film Strips (1992) (5)
- Role of Electrochemical Reactions in the Degradation Mechanisms of AlGaN / GaN HEMTs (2014) (4)
- Effects of side reservoirs on the electromigration lifetime of copper interconnects (2011) (4)
- Circuit and System Level Tools for Thermal-Aware Reliability Assessments of IC Designs Project (2005) (4)
- Templated Formation of Ordered Metallic Nano-Particle Arrays (2004) (4)
- Kinetic Study of Lithiation-Induced Phase Transitions in Amorphous Germanium Thin Films (2020) (4)
- The role of point defects in ion-bombardment-enhanced and dopant-enhanced grain growth in silicon thin films (1989) (4)
- Electromigration in Bicrystal Al Lines (1992) (4)
- Mechanical stress and morphology evolution in RuO2 thin film electrodes during lithiation and delithiation (2022) (4)
- Charge-trapping effects caused by ammonia in carbon nanotubes. (2007) (4)
- Synthesis and magnetic properties of large-area ferromagnetic cylindrical nanoshell and nanocup arrays (2013) (4)
- Very Large Grained Aluminum Alloy Thin Films for Interconnects (1986) (4)
- Modeling Electromigration-Induced Stress Buildup Due to Nonuniform Temperature (1994) (4)
- Screening volatile organics by direct sampling ion trap and glow discharge mass spectrometry (1991) (3)
- First-order amorphous-to-amorphous phase transitions during lithiation of silicon thin films (2020) (3)
- The Microstructure of Gold Films Written by Focused Ion Beam Induced Deposition (1988) (3)
- Enhancement of Grain Growth In Ultra-Thin Germanium Films By Ion Bombardment (1985) (3)
- Templated fingering during solid state dewetting (2021) (3)
- Solid Phase Processes for Semiconductor-On-Insulator (1984) (3)
- Laser ablation forward deposition of metal lines for electrical interconnect repair (1995) (3)
- Submicron and Nanometer Structures Technology and Research (1991) (3)
- Electrochemically Controlled Reversible Formation of Organized Channel Arrays in Nanoscale-Thick RuO2 Films: Implications for Mechanically Stable Thin Films and Microfluidic Devices (2021) (2)
- Evolution of AlN buffer layers on Silicon and the effect on the property of the expitaxial GaN film (2003) (2)
- Magnetic anisotropy in epitaxial Ni/Cu(001) thin films: Effects of misfit strain on perpendicular magnetic anisotropy (abstract) (1994) (2)
- Patterning: Templated Solid-State Dewetting to Controllably Produce Complex Patterns (Adv. Mater. 13/2011) (2011) (2)
- Mechanics Aspects of Wafer Thermocompression Bonding by Konstantinos Stamoulis (2)
- Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors (2018) (2)
- The Kinetics and Product Characteristics of Oxygen Reduction and Evolution in LiO2 Batteries (2014) (2)
- Redox Couple: Standard Potentials, Coupling Strength, and Implications for Lithium–Oxygen Batteries (2016) (2)
- Interconnect Failure Mechanism Maps for Different Metallization Materials and Processes (1999) (2)
- Effects of Applied Loads, Effective Contact Area and Surface Roughness on the Dicing Yield of 3D Cu Bonded Interconnects (2006) (2)
- Grain Structure Statistics in As-Patterned and Annealed Interconnects (1998) (2)
- Model studies of electromigration using indented single-crystal aluminum lines (1999) (2)
- A Calorimetric Study of the Kinetics of Al 3 Ni Nucleation and Growth During Reactions in Al/Ni Thin Films (1990) (2)
- Initial Evolution of Cobalt Silicides in The Cobalt/Amorphous-Silicon Thin Film System (1991) (2)
- A Study on Morphology Control of ZnO Electrodeposited on Au Surface (2009) (2)
- Epitaxial Grain Growth and Orientation Metastability in Heteroepitaxial Thin Films (1990) (2)
- Diffusion and Electromigration of Cu in Single Crystal Al Interconnects (1998) (2)
- Activation Volume for Inelastic Deformation in Polycrystalline Ag Films at Low Temperatures (1999) (2)
- Impact of Non-blocking Vias on Electromigration and Circuit-level Reliability Assessments of Cu Interconnects (2004) (2)
- Observation of Joule Heating-Assisted Electromigration Failure Mechanisms for Dual Damascene Cu/SiO₂ Interconnects (2003) (2)
- Polysilicon films and interfaces : symposium held December 1-3, 1987, Boston, Massachusetts, U.S.A. (1988) (2)
- Kinetic Modeling of Grain Growth in Polycrystalline Silicon Films Doped with Phosphorus or Boron. (1988) (2)
- Absence of electrical activity at high‐angle grain boundaries in zone‐melt‐recrystallized silicon‐on‐insulator films (1992) (2)
- Response to “Comment on ‘Correlation of shape changes of grain surfaces and reversible stress evolution during interruptions of polycrystalline film growth’” [Appl. Phys. Lett. 105, 246101 (2014)] (2014) (2)
- Designing circuits and processes to optimize performance and reliability: metallurgy meets TCAD (1996) (2)
- Focused Ion Beam Fabrication (1987) (2)
- Dopant and Ion Beam Enhanced Grain Growth in Polycrystalline Silicon Films (1991) (1)
- Erratum: “In situ tensile and creep testing of lithiated silicon nanowires” [Appl. Phys. Lett. 103, 263906 (2013)] (2014) (1)
- Experimental and Computational Analysis of the Solvent-Dependent O[subscript 2]/Li+-O[subscript 2][superpscript −] Redox Couple: Standard Potentials, Coupling Strength, and Implications for Lithium-Oxygen Batteries (2016) (1)
- Diffusion-bonded CNT carpets for fundamental CDI studies (2012) (1)
- Mean field analysis of orientation selective grain growth driven by interface-energy anisotropy (1994) (1)
- Modelling of Thin Film Grain Structures and Grain Growth (1985) (1)
- ynthesis of tall carpets of vertically aligned carbon nanotubes y in situ generation of water vapor through preheating f added oxygen (2012) (1)
- Characterization and Modeling of Stress Evolution During Nickel Silicides Formation (2003) (1)
- Misfit Strain Relief Beyond the Critical Thickness Using Curvature Measurements and in Situ Characterization of the Magneto-Optic Kerr Effect (1994) (1)
- Hole opening from growing interfacial voids: A possible mechanism of solid state dewetting (2022) (1)
- Surface-Energy-Driven Graphoepitaxy in Ultrathin Films of Ge (1984) (1)
- Correction: Revealing instability and irreversibility in nonaqueous sodium-O2 battery chemistry. (2016) (1)
- The Effect of Periodic Silane Burst on the Properties of GaN on Si (111) Substrates (2004) (1)
- Manipulation of Wetting Directions Using Nanostructures with Asymmetric Surface Energies (2014) (1)
- Metallic Cluster Coalescence: Molecular Dynamics Simulations of Boundary Formation (2003) (1)
- Energy Minimization During Epitaxial Grain Growth: Strain VS. Interfacial Energy (1993) (1)
- Microstructural Evolution in Thin Films of Electronic Materials (1988) (1)
- Growth and Characteristics of ZnO Nanotube Arrays on Si Substrate by Atomic Layer Deposition in Anodic Aluminum Oxide (2008) (1)
- Zone Melting Recrystallization of Patterned Films and Low-Temperature Graphoepitaxy (1983) (1)
- Evolution of thin-film and surface microstructure : symposium held November 26-December 1, 1990, Boston, Massachusetts, U.S.A. (1991) (1)
- Retraction: “Growth of single crystal ZnO nanorods on GaN using an aqueous solution method” [Appl. Phys. Lett. 87, 101908 (2005)] (2010) (1)
- 5678 - STRESS EVOLUTION DURING VOLMER-WEBER GROWTH OF THIN FILMS (2013) (1)
- Mortality Dependence of Cu Dual Damascene Interconnects on Adjacent Segments (2004) (1)
- Rapid characterization and monitoring by direct sampling ion trap mass spectrometry (1992) (1)
- Reliability of Multi-Terminal Copper Dual-Damascene Interconnect Trees (2003) (1)
- Experimental and Computational Study of the Orientation Dependence of Single-Crystal Ruthenium Nanowire Stability. (2022) (1)
- Metallic Island Coalescence: Molecular Dynamics Simulations of Boundary Formation and Tensile Strain in Polycrystalline Thin Films (2003) (1)
- Crystalline Films on Amorphous Substrates by Zone Melting and Surface-Energy-Driven Grain Growth in Conjunction with Patferning (1985) (1)
- Rate-Dependent Nucleation and Growth of NaO[subscript 2] in Na-O[subscript 2] Batteries (2015) (1)
- Growth of (001)-oriented PZT thin films on amorphous SiO2 by pulsed laser deposition (2002) (1)
- Electrochemical Degradation Mechanisms in AlGaN / GaN HEMTs (2013) (1)
- Dislocation pile-ups as sites for formation of electromigration-induced transgranular slit-like voids in al interconnects (1999) (0)
- Nano-particle Formation via Solid-state Dewetting (2009) (0)
- The Influence of Adjacent Segment on the Reliability of Cu Dual Damascene Interconnects (2005) (0)
- Ion-induced chemical vapor deposition of copper films with nanocellular microstructures (2003) (0)
- Structural Transitions in Titanium/Amorphous-Silicon Multilayers (1989) (0)
- Carbon Nanotube Growth Using Ni Catalyst in Different Layouts (2005) (0)
- Study of the Effect of Electrolyte Concentration on Li-Air Battery Performance (2016) (0)
- Chapter 2. Computer-Integrated Design and Manufacture of Integrated Circuits (1995) (0)
- Direct-sampling MS measurement of volatiles in environmental samples (1991) (0)
- Post-Nucleation Heteroepitaxy in Poorly Lattice Matched Systems (1990) (0)
- Kinetic Phenomena in Thin Film Electronic Materials (1987) (0)
- Invited Presentation: The Effect of Solvation on Li-O2 Redox Reactions (2014) (0)
- The Study of Porous Geometry Design for Capacitive Deionization Devices through Vertically-Aligned Carbon Nanotube Electrodes (2016) (0)
- Research on Polycrystalline Films for Micro- and Nano-Systems (2003) (0)
- Modeling of microstructures and their effect on interconnect reliability (2008) (0)
- Atomistic Simulations of Metallic Cluster Coalescence (2002) (0)
- The effect of solute on the homogeneous crystal nucleation frequency in metallic melts (1981) (0)
- Submicron Structures and Various Technology (1990) (0)
- Submicron Structures Technology and Research (1987) (0)
- Tensile and Compressive Failures of Cu/low-k Interconnect Trees (2008) (0)
- Experimental Studies of the Reliability of Interconnect Trees (2000) (0)
- EFFECT OF DOPANTS ON GRAIN BOUNDARY MOBILITY IN SILICON. (1986) (0)
- Nanorod Solar Cell (2008) (0)
- Problem Solving Processes in the Development of Three Dimensional Printing by Gurumurthi Ravishankar (2007) (0)
- Tens of micro-scale wavy crack propagation in silicon nitride films (2010) (0)
- The Effects of Pre-existing Voids on Electromigration Lifetime Scaling (2010) (0)
- Perspectives on Experiments, Modeling and Simu1lations of Grain Growth (2005) (0)
- Fabrication of square arrays of inverted pyramids using ABC triblock terpolymer (2012) (0)
- The Morphology Control and Defect Study of Electrodeposited ZnO Nanostructures (2009) (0)
- CRYSTAL NUCLEATION IN AMORPHOUS (Au,, _ ,,Cu,,),,Si,Ge,, ALLOYS (2002) (0)
- The Effect of Annealing on the Structure of Epitaxial CaF2 Films on Si(100) (1989) (0)
- Materials reliability in microelectronics II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A. (1992) (0)
- Evaluation of Potential Applications for Templated Arrays of Heterostructural Semiconductor Nanowires as Light Emitting Devices (2007) (0)
- Heterostructures for Optical Devices (1988) (0)
- Structure of Li2O2 Discharge Products on Free-Standing Aligned Carbon Nanotube Electrodes for Li-Air Batteries (2012) (0)
- In Situ Electrochemical Porosimetry of Vertically-Aligned Carbon Nanotube Carpets through Impedance Spectroscopy (2015) (0)
- Computer-Assisted Prototyping of Advanced Microsystems (1997) (0)
- Mechanical property characterization of cu-Sn-In intermetallic thin films using microcantilevers (2011) (0)
- Kinetics and Thermodynamics of Amorphous Silicide Formation in Metal/ Amorphous‐Silicon Multilayer Thin Films (1991) (0)
- Templated solid-state dewetting of thin films (2012) (0)
- Lawrence Berkeley National Laboratory Recent Work Title Impact of deposition conditions on the crystallization kinetics of amorphous GeTe films Permalink (2015) (0)
- Dominant inelastic mechanisms in FCC metallic thin films and lines (2002) (0)
- Processing, Structure, Properties, and Reliability of Metals for Microsystems (2002) (0)
- The Effects of Dopants on Surface-Energy-Driven Secondary Grain Growth in Ultrathin Si Films (1985) (0)
- Magnetostatics and magnetodynamics in single crystal Ni on MgO (2012) (0)
- Polycrystalline Silicon: Structure and Processing (1992) (0)
- Preview: 1991 MRS Spring Meeting (1991) (0)
- Growth of ZnO Nanorods on GaN Using Aqueous Solution Method (2005) (0)
- Analysis of GaN Grown on Vertically Standing Fractal-Like Si Nanostructures (2012) (0)
- Anisotropy in Epitaxial Films. (1997) (0)
- Chapter 3. Computer-Assisted Prototyping of Advanced (1997) (0)
- Electrochemical Oxidation in AlGaN/GaN-on-Si High Electron Mobility Transistors (2019) (0)
- Effects of Nanometer-Scale Surface Roughness and Applied Load on the Bond Strength and Contact Resistance of Cu-Cu Bonded 3D ICs (2007) (0)
- Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect trees (2003) (0)
- Characterization of ZnO Nanorods Grown on GaN Using Aqueous Solution Method (2005) (0)
- Microstructure of cobalt nanocluster arrays fabricated by solid-state dewetting (2008) (0)
- Thinly spread (1992) (0)
- Limiting Conditions for Giant Grains in Silver Thin Films (1998) (0)
- Conductance preservation of carbene-functionalized metallic single-walled carbon nanotubes. (2011) (0)
- Investigation of the Fundamental Reliability Unit for Cu Dual-Damascene Metallization (2002) (0)
- Preliminary Characterisation of Low-Temperature Bonded Copper Interconnects for 3-D Integrated Circuits (2005) (0)
- Investigation of materials in solid state thin film lithium ion batteries (2014) (0)
- Submicron Structures Fabrication and Research (1981) (0)
- The Effects of Width Transitions on the Reliability of Interconnects (2000) (0)
- Circuit-Level and Layout-Specific Interconnect Reliability Assessments (2000) (0)
- Modeling of Grain Structure Evolution and its Impact on the Reliability of Al(Cu) Thin Film Interconnects (1997) (0)
- Direct TEM observation of amorphous Si created by femtosecond laser irradiation (2004) (0)
- Effects of Mechanical Properties on the Circuit‐Level Reliability of Cu/low‐k Metallization (2006) (0)
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