Cemal Basaran
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Professor of engineering
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Cemal Basaranengineering Degrees
Engineering
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#5852
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Mechanical Engineering
#773
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#828
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Applied Physics
#2679
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#2721
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Engineering
Why Is Cemal Basaran Influential?
(Suggest an Edit or Addition)According to Wikipedia, Cemalettin Basaran is a Turkish-born American engineer who is currently a professor in the department of civil, structural and environmental engineering at the University at Buffalo, State University of New York.
Cemal Basaran's Published Works
Number of citations in a given year to any of this author's works
Total number of citations to an author for the works they published in a given year. This highlights publication of the most important work(s) by the author
Published Works
- Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing (2003) (225)
- A Thermodynamic Framework for Damage Mechanics of Solder Joints (1998) (212)
- An Irreversible Thermodynamics Theory for Damage Mechanics of Solids (2004) (188)
- Failure modes and FEM analysis of power electronic packaging (2002) (156)
- A thermodynamic model for electrical current induced damage (2003) (116)
- Moiré interferogram phase extraction: a ridge detection algorithm for continuous wavelet transforms. (2004) (106)
- A micromechanical model for effective elastic properties of particulate composites with imperfect interfacial bonds (2005) (89)
- Thermomechanical behavior of micron scale solder joints under dynamic loads (2000) (83)
- Damage mechanics of electromigration induced failure (2008) (75)
- A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints (2003) (74)
- An Analytical Model for Thermal Stress Analysis of Multi-layered Microelectronic Packaging (2004) (72)
- Joule heating in single-walled carbon nanotubes (2009) (69)
- The size effect in mechanical properties of finite-sized graphene nanoribbon (2014) (68)
- Measuring intrinsic elastic modulus of Pb/Sn solder alloys (2002) (66)
- Damage mechanics of microelectronics solder joints under high current densities (2003) (65)
- Mechanics of Pb40/Sn60 near-eutectic solder alloys subjected to vibrations (1998) (64)
- Computational damage mechanics of electromigration and thermomigration (2013) (60)
- A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects (2005) (60)
- Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm (2006) (59)
- Mechanical degradation of microelectronics solder joints under current stressing (2003) (58)
- Electromigration induced stress analysis using fully coupled mechanical-diffusion equations with nonlinear material properties (2005) (58)
- A thermodynamics based damage mechanics model for particulate composites (2007) (57)
- Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronics Packaging (2002) (54)
- A computational damage mechanics model for thermomigration (2009) (51)
- Failure Modes of Flip Chip Solder Joints Under High Electric Current Density (2005) (48)
- Numerical simulation of stress evolution during electromigration in IC interconnect lines (2003) (48)
- Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading (2002) (46)
- Experimental damage mechanics of microelectronic solder joints under fatigue loading (2004) (45)
- Experimental Damage Mechanics of Microelectronics Solder Joints under Concurrent Vibration and Thermal Loading (2001) (45)
- Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties (2009) (45)
- Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1—Theory and Formulation (1998) (44)
- Numerical algorithms and mesh dependence in the disturbed state concept (1997) (43)
- Lattice Strain Due to an Atomic Vacancy (2009) (42)
- Atomistic modeling of β-Sn surface energies and adatom diffusivity (2010) (42)
- Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing (2004) (42)
- Thermomigration induced degradation in solder alloys (2008) (41)
- Electromigration analysis of solder joints under ac load: A mean time to failure model (2012) (40)
- Experimental verification of thermodynamic fatigue life prediction model using entropy as damage metric (2015) (39)
- Nanoindentation of Pb/Sn solder alloys; experimental and finite element simulation results (2006) (39)
- Influence of Microstructure Coarsening on Thermomechanical Fatigue Behavior of Pb/Sn Eutectic Solder Joints (2001) (38)
- The effect of Stone-Wales defects on the mechanical behavior of graphene nano-ribbons (2016) (37)
- A Damage-Mechanics-Based Constitutive Model for Solder Joints (2005) (36)
- Deformation of solder joint under current stressing and numerical simulation--II (2004) (36)
- Using finite element analysis for simulation of reliability tests on solder joints in microelectronic packaging (2000) (36)
- Thermomigration Versus Electromigration in Microelectronics Solder Joints (2009) (35)
- Measurement of high electrical current density effects in solder joints (2003) (34)
- βSn grain boundary structure and self-diffusivity via molecular dynamics simulation (2010) (34)
- Electromigration induced strain field simulations for nanoelectronics lead-free solder joints (2007) (34)
- Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging (2001) (32)
- A Creep Model for Solder Alloys (2011) (32)
- Finite element simulation of the temperature cycling tests (1997) (31)
- Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation (1999) (31)
- Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses (2006) (30)
- A framework for stress computation in single-walled carbon nanotubes under uniaxial tension (2009) (29)
- Influence of vacancy defects on the damage mechanics of graphene nanoribbons (2017) (29)
- Damage mechanics of electromigration in microelectronics copper interconnects (2007) (29)
- Sensitivity improvement in phase-shifted moiré interferometry using 1-D continuous wavelet transform image processing (2003) (26)
- Damage Mechanics of Low Temperature Electromigration and Thermomigration (2009) (26)
- Influence of Interfacial Bond Strength on Fatigue Life and Thermo-Mechanical Behavior of a Particulate Composite: An Experimental Study (2008) (25)
- Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronic Packaging (2002) (25)
- Temperature Dependence of Joule heating in Zigzag Graphene Nanoribbon (2014) (25)
- Low Cycle Fatigue Life Prediction Using Unified Mechanics Theory in Ti-6Al-4V Alloys (2019) (25)
- Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 2—Verification and Application (1998) (24)
- Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading (1999) (24)
- Impact of geometry on transport properties of armchair graphene nanoribbon heterojunction (2017) (23)
- Damage characterization in non-isothermal stretching of acrylics. Part II: Experimental validation (2011) (23)
- Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model (2013) (23)
- Thermomechanical analysis in electronic packaging with unified constitutive model for materials and joints (1998) (23)
- Influence of filler content and interphase properties on large deformation micromechanics of particle filled acrylics (2013) (23)
- Electromigration time to failure of SnAgCuNi solder joints (2009) (22)
- Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory (1999) (22)
- Damage characterization in non-isothermal stretching of acrylics. Part I: Theory (2011) (22)
- Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging (2003) (22)
- Inelastic behavior of microelectronics solder joints under concurrent vibration and thermal cycling (2000) (22)
- Impact of temperature cycle profile on fatigue life of solder joints (2002) (21)
- Effect of Cu and Ag solute segregation on βSn grain boundary diffusivity (2011) (21)
- Mechanical Properties of Hydrogen Edge–Passivated Chiral Graphene Nanoribbons (2015) (21)
- Comparison of fracture behavior of defective armchair and zigzag graphene nanoribbons (2019) (21)
- Stress Whitening Quantification of Thermoformed Mineral Filled Acrylics (2010) (21)
- Effective diffusivity of lead free solder alloys (2009) (20)
- Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study (2014) (20)
- Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing (2005) (20)
- Introduction to Unified Mechanics Theory with Applications (2021) (20)
- Automatic Full Strain Field Moiré Interferometry Measurement with Nano-scale Resolution (2008) (19)
- Unraveling mechanics of armchair and zigzag graphene nanoribbons (2017) (19)
- Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging (2006) (19)
- Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys (2007) (18)
- Time Dependent Behavior of a Particle Filled Composite PMMA/ATH at Elevated Temperatures (2008) (18)
- Simulating Damage Mechanics of Electromigration and Thermomigration (2008) (18)
- Mechanical and electronic properties of graphene nanomesh heterojunctions (2018) (18)
- Micro-deformation mechanisms in thermoformed alumina trihydrate reinforced poly(methyl methacrylate) (2009) (17)
- Mechanical Implications of High Current Densities in Flip-chip Solder Joints (2004) (17)
- The effects of vacancy defect on the fracture behaviors of zigzag graphene nanoribbons (2017) (17)
- Thermomigration in lead-free solder joints (2008) (17)
- Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part II—Applications (1999) (17)
- Experimental verification of improvement of phase shifting moire´ interferometry using wavelet-based image processing (2004) (17)
- Parity conservation in electron-phonon scattering in zigzag graphene nanoribbon (2014) (16)
- High-temperature, high-density packaging of a 60kW converter for >200°C embedded operation (2006) (16)
- A multiscale modeling technique for bridging molecular dynamics with finite element method (2013) (16)
- Semi-classical transport for predicting joule heating in carbon nanotubes (2010) (15)
- Low temperature electromigration and thermomigration in lead-free solder joints (2008) (15)
- Statistical phase-shifting step estimation algorithm based on the continuous wavelet transform for high-resolution interferometry metrology. (2011) (15)
- Failure Mechanisms in PMMA/ATH Acrylic Casting Dispersion (2006) (15)
- High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation (2006) (15)
- Application of Moire/spl acute/ interferometry to determine strain fields and debonding of solder joints in BGA packages (2004) (14)
- A Review of Damage, Void Evolution, and Fatigue Life Prediction Models (2021) (14)
- A cyclic two-surface thermoplastic damage model with application to metallic plate dampers (2013) (13)
- Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation (2003) (13)
- Aspect ratio effect on shear modulus and ultimate shear strength of graphene nanoribbons (2017) (13)
- Experiment study on reliability of solder joints under electrical stressing: Nano-indentation, atomic flux measurement (2002) (12)
- Hot phonons contribution to Joule heating in single-walled carbon nanotubes (2012) (12)
- Thermodynamics Theory for Damage Evolution in Solids (2014) (12)
- Closed form vs. finite element analysis of laminated stacks (1999) (12)
- Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging (2006) (11)
- Anisotropy of Graphene Nanoflake Diamond Interface Frictional Properties (2019) (11)
- Modeling ultrasonic vibration fatigue with unified mechanics theory (2021) (11)
- The prediction of the effective charge number in single-walled carbon nanotubes using Monte Carlo simulation (2011) (11)
- Effect of Ni solute on grain boundary diffusivity and structure of βSn (2014) (10)
- Solute Effects on β-Sn Grain Boundary Energy and Shear Stress (2011) (10)
- Impact of electrostatic doping level on the dissipative transport in graphene nanoribbons tunnel field-effect transistors (2019) (10)
- Finite element thermomechanical analysis of electronic packaging problems using disturbed state constitutive models. (1994) (10)
- Electrostatic Doping-Based All GNR Tunnel FET: An Energy-Efficient Design for Power Electronics (2019) (10)
- Thermomechanical behavior of BGA solder joints under vibrations: an experimental observation (2000) (10)
- Strained phonon–phonon scattering in carbon nanotubes (2016) (10)
- A unified mechanics theory-based model for temperature and strain rate dependent proportionality limit stress of mild steel (2021) (10)
- SELECTING A TEMPERATURE TIME HISTORY FOR PREDICTING FATIGUE LIFE OF MICROELECTRONICS SOLDER JOINTS (2001) (10)
- Reduced impedance and superconductivity of SnAgCu solder alloy at high frequency (2012) (10)
- An accelerated algorithm for full band electron-phonon scattering rate computation (2014) (9)
- Phonon dispersion and quantization tuning of strained carbon nanotubes for flexible electronics (2014) (9)
- Computer simulations of solder joint reliability tests (2001) (9)
- Predicting high cycle fatigue life with unified mechanics theory (2021) (9)
- Computational implementation of Cosserat continuum (2009) (9)
- Phonon–phonon scattering rates in single walled carbon nanotubes (2015) (9)
- Measurement and effects of high electrical current stress in solder joints (2002) (9)
- Far-field modeling of Moiré interferometry using scalar diffraction theory (2012) (8)
- Influence of hot phonons on wind forces in metallic single walled carbon nanotubes (2013) (8)
- Entropy Based Fatigue, Fracture, Failure Prediction and Structural Health Monitoring (2020) (8)
- The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations (2011) (8)
- Measuring Joule heating and strain induced by electrical current with Moiré interferometry (2011) (8)
- Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study (2013) (8)
- An analytical model for thermal stress analysis of multi-layered microelectronics packaging (2004) (8)
- Grain growth in eutectic Pb/Sn ball grid array solder joints (2002) (8)
- Analysis of Multilayered Microelectronic Packaging Under Thermal Gradient Loading (2006) (8)
- Molecular dynamics of viscoplasticity in β-tin lattice and grain boundary (2013) (7)
- A quantum mechanical formulation of electron transport induced wind forces in metallic single-walled carbon nanotubes (2010) (7)
- Shear Strength of Square Graphene Nanoribbons beyond Wrinkling (2018) (6)
- Electric pulse induced impedance and material degradation in IC chip packaging (2013) (6)
- Solving large-scale problems in mechanics: The development and application of computational solution methods (1994) (5)
- Influence of defects on dissipative transport in graphene nanoribbons tunnel field-effect transistor (2019) (5)
- Review of Joule heating in graphene nano-ribbon (2012) (5)
- A Viscoplasticity Model for Solder Alloys (2010) (4)
- Experimental characterization of material degradation of solder joint under fatigue loading (2002) (4)
- Computational simulation of electromigration induced damage in copper interconnects (2007) (4)
- Analysis of multi-layered microelectronic packaging under uniformly distributed loading (2003) (4)
- IEEE COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY SOCIETY (2010) (4)
- Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints (2006) (3)
- Mean time to failure of SnAgCuNi solder joints under DC (2012) (3)
- Modeling fatigue of pre-corroded body-centered cubic metals with unified mechanics theory (2022) (3)
- Damage Coupled Viscoplastic Modeling of Particulate Composites With Imperfect Interphase (2012) (3)
- Unified Disturbed State Concept For Metals and Alloys (1999) (3)
- Electron-phonon scattering and Joule heating in copper at extreme cold temperatures (2018) (3)
- Damage of SAC405 solder joint under PDC (2012) (3)
- High current density electron wind forces in metallic graphene nanoribbons (2020) (2)
- Damage Mechanics Unified Constitutive Modeling for Polymers (2014) (2)
- Reliability of solder joints under electrical stressing - strain evolution of solder joints (2002) (2)
- Dynamic Equilibrium Equations in Unified Mechanics Theory (2021) (2)
- Damage Mechanics of Solder Joints under High Current Density (2007) (2)
- Aluminum-Based High-Temperature (>200°C) Packaging for SiC Power Converters * (2006) (2)
- Introduction for JEP Special Issue on Carbon Nanotubes (2011) (2)
- Fatigue Life Prediction Using Unified Mechanics Theory in Ti-6Al-4V Alloys (2019) (2)
- Moiré Interferometry for Microelectronics Packaging Interface Fatigue Reliability (2002) (2)
- Experimental study of failure mechanisms in particle filled acrylic composites (2002) (1)
- Unified constitutive modelling of interfaces and materials in semiconductor devices (1993) (1)
- Failure modes of flip chip solder joints under high electric current stressing (2003) (1)
- Historical Kestanbol Hot Springs: “The water that resurrects”- Tarihi Kestanbol Kaplıcaları: “Ölü Dirilten Su” (2018) (1)
- Publisher’s Note: “Electromigration analysis of solder joints under ac load: A mean time to failure model” [J. Appl. Phys. 111, 063703 (2012)] (2012) (1)
- Computer simulation of the temperature cycling tests (1995) (1)
- Solder joint grain boundary structure and diffusivity via molecular dynamics simulations (2012) (1)
- Near field modeling of the Moiré interferometer for nanoscale strain measurement (2012) (1)
- Predicting elastic modulus of particle filled composites (2013) (1)
- Modeling Joule heating in carbon nanotubes with Monte Carlo simulations (2012) (1)
- Disturbed State Modelling of Materials and Interfaces, and Computer Implementation (1995) (1)
- Thermomigration induced strain field simulation for microelectronic lead free solder joints (2006) (1)
- Atomic-Level Shear Stress-Strain Behavior of β-Sn (2013) (1)
- Electromigration time to failure (2010) (1)
- Unified Mechanics of Thermo-mechanical Analysis (2021) (0)
- Unified Mechanics Theory (2021) (0)
- Irreversible Thermodynamics for Damage Mechanics of Solid Materials (2002) (0)
- Modeling fatigue life and hydrogen embrittlement of bcc steel with unified mechanics theory (2023) (0)
- Thanks to our reviewers (2018) (0)
- Author ' s personal copy A computational damage mechanics model for thermomigration (2009) (0)
- Statistical phase shifting step estimation based on continuous wavelet transform for high resolution interferometry metrology (2010) (0)
- On the development of tribo-fatigue as the new section of mechanics (2021) (0)
- Computational Implementation of Cosserat Based Strain Gradient Plasticity Theories (2006) (0)
- A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading (1997) (0)
- Damage Mechanics of Carbon Nano Tubes Under Uniaxial Tension (2009) (0)
- Unified Mechanics of Metals under High Electrical Current Density: Electromigration and Thermomigration (2021) (0)
- Special Issue on Nanomechanics of Solids and Interfaces with Molecular Dynamic Simulations (2011) (0)
- icro-deformation mechanisms in thermoformed alumina trihydrate einforced poly ( methyl methacrylate ) (2009) (0)
- Low cycle fatigue analysis of microelectronics solder joints incorporating damage and size effects using a thermodynamics based rate dependent constitutive model (2005) (0)
- Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moiré Interferometry in Microscopic Scale (2009) (0)
- BIOLOGICAL ENGINEERING 1. IN SILICO SIMULATION OF GENOME-SCALE INTRACELLULAR FLUX MODELS FOR ENGINEERING PHENYLPROPANOID BIOSYNTHESIS IN ESCHERICHIA COLI (2006) (0)
- Senior Engineer Analog Devices, Boston, MA (2008) (0)
- A semi-infinite edge dislocation model for the proportionality limit stress of metals under high strain rate (2021) (0)
- Stress computation in a single-walled carbon nanotube under uniaxial tension (2009) (0)
- Corrigendum to: “Effect of Ni solute on grain boundary diffusivity and structure of βSn” [Comput. Mater. Sci. 92 (2014) 1–7] (2015) (0)
- Corrigendum to “Molecular dynamics of viscoplasticity in β-tin lattice and grain boundary” [Comput. Mater. Sci. 68 (2013) 290–296] (2013) (0)
- Unification of Newtonian Mechanics and Thermodynamics (2016) (0)
- Unified Micromechanics of Particulate Composites (2021) (0)
- Unified Micromechanics of Finite Deformations (2021) (0)
- A semi-infinite edge dislocation model for the proportionality limit stress of metals under high strain rate (2021) (0)
- Hybrid-simulation of degradation in high density power electronics packaging (2008) (0)
- Effects of Rock Layering on Dynamic Response of a Gravity Dam (2019) (0)
- Impact of Electrostatic Doping Level On Dissipative Carrier Transport In GNR TFET Devices (2019) (0)
- Corrigendum to ‘A quantum mechanical formulation of electron transport induced wind forces in metallic single walled carbon nanotubes’ (2010) (0)
- Electromigration Damage Mechanics of Interconnects (2009) (0)
- Entropy as a damage metric for fatigue life predictions (1998) (0)
- Stress and Strain in Continuum (2021) (0)
- Modeling and simulating thermomigration in power electronics (2009) (0)
- Simulating electromigration and thermomigration in power electronics packaging (2008) (0)
- Strain energy change due to an atomic defect in solder alloy lattice (2007) (0)
- Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moiré Interferometry With Phase Shifting (2009) (0)
- Hot Phonons Contribution to scattering rates in Single-Walled Carbon Nanotubes (2013) (0)
- A velocity averaging method for bridging molecular dynamics with finite element analysis (2012) (0)
- Author ' s personal copy A framework for stress computation in single-walled carbon nanotubes under uniaxial tension (2009) (0)
- Elastic Modulus of Pb/Sn Solder Joints in Microelectronics (2002) (0)
- Using Entropy to Unify Mechanics and Thermodynamics (2017) (0)
- Length Scale in Solder Joints Materials (2006) (0)
- Author's personal copy A quantum mechanical formulation of electron transport induced wind forces in metallic single-walled carbon nanotubes (2009) (0)
- XXI ICTAM, 15-21 August 2004, Warsaw, Poland DEFORMATION OF SOLDER JOINTS UNDER CURRENT STRESSING: EXPERIMENTAL MEASUREMENT AND NUMERICAL SIMULATION (2003) (0)
- Techniques for investigation of solder interconnect electromigration under time varying current stressing (2007) (0)
- Index (2004) (0)
- Reliability of Next Generation Power Electronics Packaging Under Concurrent Vibration, Thermal and High Power Loads (2008) (0)
- Joints under Electric Current Stresses Experimental Damage Mechanics of Micro / Power Electronics Solder (2005) (0)
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Cemal Basaran is affiliated with the following schools:
