Dereje Agonafer

Q: What Schools Are Affiliated With Dereje Agonafer

Dereje Agonafer is affiliated with the following schools: University of Texas at Arlington, University of Maryland, College Park, University of Colorado Boulder, University of California, Berkeley, University of Texas at Austin, Addis Ababa University

Dereje Agonafer's AcademicInfluence.com Rankings

Dereje Agonafer

Engineering

#1761

World Rank

#2528

Historical Rank

Mechanical Engineering

#222

World Rank

#255

Historical Rank

Applied Physics

#3383

World Rank

#3475

Historical Rank

engineering Degrees

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Engineering

Dereje Agonafer's Degrees

PhD Mechanical Engineering University of California, Berkeley
Masters Mechanical Engineering University of California, Berkeley
Bachelors Mechanical Engineering Addis Ababa University

Why Is Dereje Agonafer Influential?

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According to Wikipedia, Dereje Agonafer is an Ethiopian-American engineer and educator, who is currently a professor of mechanical engineering at University of Texas at Arlington, and member of National Academy of Engineering. He is also a fellow of National Academy of Inventors since 2018.

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Dereje Agonafer's Published Works

Number of citations in a given year to any of this author's works

Total number of citations to an author for the works they published in a given year. This highlights publication of the most important work(s) by the author

Published Works

Steady-state heat conduction in multi-layer bodies (2003) (96)
A Brief Overview of Recent Developments in Thermal Management in Data Centers (2015) (87)
Optimization of data center room layout to minimize rack inlet air temperature (2006) (69)
Design optimization and reliability of PWB level electronic package (2004) (42)
LVEL turbulence model for conjugate heat transfer at low Reynolds numbers (1996) (36)
A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending (2004) (36)
Effect of Under Floor Blockages on Data Center Performance (2006) (27)
Method for Determining a Dynamical State–Space Model for Control of Thermal MEMS Devices (2005) (26)
Thermo-Mechanical Challenges in Stacked Packaging (2008) (25)
Effects of mineral oil immersion cooling on IT equipment reliability and reliability enhancements to data center operations (2016) (24)
Flow Rate and inlet temperature considerations for direct immersion of a single server in mineral oil (2014) (23)
Numerical Modeling of Forced Convection Heat Transfer for Modules Mounted on Circuit Boards (1990) (22)
Thermal Performance and Efficiency of a Mineral Oil Immersed Server Over Varied Environmental Operating Conditions (2017) (21)
Thermal Model of a PC (1994) (19)
Thermal design optimization of a package on package (2009) (16)
Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture (2010) (15)
Hot spot mitigation using single-phase microchannel cooling for microprocessors (2010) (15)
Analytical Thermal Solution to a Nonuniformly Powered Stack Package With Contact Resistance (2013) (13)
Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die (2005) (13)
Effect of Relative Humidity, Temperature and Gaseous and Particulate Contaminations on Information Technology Equipment Reliability (2015) (13)
Electro-Thermal Analysis of In-Plane Micropump (2010) (13)
Effectiveness of rack-level containment in removing data center hot-spots (2014) (12)
CFD analysis of free cooling of modular data centers (2012) (12)
Effect of Variable Heat Transfer Coefficient, Fin Geometry, and Curvature on the Thermal Performance of Extended Surfaces (2003) (12)
Global-local finite element optimization study to minimize BGA damage under thermal cycling (2014) (12)
Comparison of Overhead Supply and Underfloor Supply with Rear Heat Exchanger in High Density Data Center Clusters (2008) (12)
Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling (2017) (11)
Conjugate Model of a Pin-Fin Heat Sink Using a Hybrid Conductance and CFD Model Within an Integrated Mcae Tool (1997) (11)
Numerical Modeling of Data Center Clusters: Impact of Model Complexity (2006) (11)
Comparative study of high ambient inlet temperature effects on the performance of air vs. liquid cooled IT equipment (2017) (11)
Failure mechanisms of boards in a thin wafer level chip scale package (2017) (11)
Effect of the Location and the Properties of Thermostatic Expansion Valve Sensor Bulb on the Stability of a Refrigeration System (2005) (11)
Rack-level study of hybrid cooled servers using warm water cooling for distributed vs. centralized pumping systems (2017) (10)
Effect of CRAC location on fixed rack layout (2006) (10)
Reliability Considerations for Oil Immersion-Cooled Data Centers (2019) (10)
Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package (2015) (10)
Strain based approach for predicting the solder joint fatigue life with the addition of intermetallic compound using finite element modeling (2004) (10)
CFD Modeling of Indirect/Direct Evaporative Cooling Unit for Modular Data Center Applications (2013) (10)
Qualitative Study of Cumulative Corrosion Damage of IT Equipment in a Data Center Utilizing Air-Side Economizer (2016) (9)
A Hybrid Methodology for the Optimization of Data Center Room Layout (2003) (9)
Factors that affect the performance characteristics of wet cooling pads for data center applications (2015) (9)
Improving cooling efficiency of servers by replacing smaller chassis enclosed fans with larger rack-mount fans (2014) (9)
Effect of warm water cooling for an isolated hybrid liquid cooled server (2015) (8)
Combining computational fluid dynamics (CFD) and flow network modeling (FNM) for design of a multi-chip module (MCM) cold plate (2013) (8)
Experimental analysis model of an active cooling method for 3D-ICs utilizing a multidimensional configured thermoelectric (2010) (8)
Effective Thermal Management of Data Centers Using Efficient Cabinet Designs (2009) (8)
Reliability of stack packaging varying the die stacking architectures for flash memory applications (2006) (8)
Solder ball reliability assessment of WLCSP — Power cycling versus thermal cycling (2017) (8)
Development of analytical model to a temperature distribution of a first level package With a nonuniformly powered die (2009) (7)
Computation of steady flow in a two-dimensional arterial model. (1985) (7)
Reliability of lead (Pb) free SAC solder interconnects with different PWB surface finishes under mechanical loading (2006) (7)
Thermal design considerations of air-cooled high powered telecommunication cabinets (2009) (7)
Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications (2014) (6)
Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope (2017) (6)
Journal of Electronic Packaging, Transactions of the ASME: Foreword (2004) (6)
Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers (2010) (6)
Simulation of PWB warpage during fabrication and due to reflow (2004) (6)
NUMERICAL SOLUTION OF NATURAL CONVECTION BETWEEN DIVERGING PLATES. (1984) (6)
Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB’s and Reliability of Electronic Packages (2019) (6)
Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance (2009) (6)
Design considerations relating to non-thermal aspects of oil immersion cooling (2016) (6)
Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization (2018) (6)
Polymer tube embedded in-plane micropump for low flow rate (2005) (5)
Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application (2004) (5)
Effectiveness of Rack-Level Fans—Part I: Energy Savings Through Consolidation (2017) (5)
Computational Modeling of the Reliability of Stacked Low Density Interconnects Devices (2006) (5)
Design of polymer tube embedded in-plane micropump (2006) (5)
Damage progression study of 3D TSV package during reflow, thermal shocks and thermal cycling (2017) (5)
Design and analysis of a scheme to mitigate condensation on an assembly used to cool a processor module (2002) (5)
Development of an analytical model to a temperature distribution of first level package with a non-uniformly powered die (2007) (5)
Experimental Analysis for Optimization of Thermal Performance of a Server in Single Phase Immersion Cooling (2019) (5)
Multi-design variable optimization for a fixed pumping power of a water-cooled cold plate for high power electronics applications (2012) (5)
Development of a Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center (2019) (5)
CFD Simulation of Two-Phase Immersion Cooling Using FC-72 Dielectric Fluid (2020) (5)
Multi-scale thermal analysis of electronics packaging (1994) (5)
Application of phase change material in sustainable cooling of data centers (2013) (4)
Computational Study of Hybrid Cooling Solution for Thermal Management of Data Centers (2007) (4)
Air filter effects on data center supply fan power (2012) (4)
OPTIMIZATION TRADE-OFF ANALYSES ON A THERMAL CONDUCTION MODULE PACKAGE USING CAEDS. (1986) (4)
Multi design variable optimization of QFN package on thick boards for enhanced board level reliability (2016) (4)
CFD modeling of a thermoelectric device for electronics cooling applications (2008) (4)
Mechanical characterization of RCC and FR4 laminated PCBs and assessment of their board level reliability (2017) (4)
Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time (2019) (4)
Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time (2018) (4)
Board Level Solder Joint Reliability Assessment Study of Megtron 6 Vs FR-4 Under Power Cycling and Thermal Cycling (2018) (4)
Numerical Analysis of Oil Immersion Cooling of a Server Using Mineral Oil and Al2O3 Nanofluid (2020) (4)
Numerical modeling of an entire Thermal Conduction Module using a thermal coupling methodology (1995) (4)
Methodology for an Integrated (Electrical/Mechanical) Design of PWBA (2004) (4)
Computational Analysis for Thermal Optimization of Server for Single Phase Immersion Cooling (2019) (4)
Cooling of Data Centers Using Airside Economizers (2009) (4)
Energy minimization based fan configuration for double walled telecommunication cabinet with solar load (2010) (4)
Effect of the Thermostatic Expansion Valve Characteristics on the Stability of a Refrigeration System: Part II (2003) (4)
Impact of area contact between sensor bulb and evaporator return line on modular refrigeration unit : Computational and experimental (2005) (4)
CFD Investigation of Dispersion of Airborne Particulate Contaminants in a Raised Floor Data Center (2020) (4)
Computational Form Factor Study of a 3rd Generation Open Compute Server for Single-Phase Immersion Cooling (2019) (4)
Compact Modeling of a Telecommunication Cabinet (2008) (3)
Effectiveness of Rack-Level Fans: Part II - Control Strategies and System Redundancy (2017) (3)
Analysing real time power of the microprocessor to estimate thermal time constant of the hotspot (2012) (3)
Solid Model Based Preprocessor to CFD Code for Applications to Electronic Cooling Systems (1997) (3)
Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection (2009) (3)
The Effect of Intermetallic Compound in Solder Joint Fatigue Life Prediction Using Finite Element Modeling (2003) (3)
A Comparative Study of Thermal Aging Effect on the Properties of Silicone-Based and Silicone-Free Thermal Gap Filler Materials (2021) (3)
Single-phase liquid cooling of a quad-core processor (2011) (3)
Determination of steady state temperature in a two-layer body with different form factors (2012) (3)
Mechanical design optimization of a package on package (2009) (3)
Artificial Neural Network Based Prediction of Control Strategies for Multiple Air-Cooling Units in a Raised-floor Data Center (2020) (3)
Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers (2020) (3)
CFD Analysis on Liquid Cooled Cold Plate Using Copper Nanoparticles (2020) (3)
Polymer Tube Embedded In-Plane Micropump: Design, Analysis and Fabrication (2005) (3)
Flip chip back end design parameters to reduce bump electromigration (2008) (3)
Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization (2019) (3)
Benchmark problems for system-level electronics cooling (1993) (3)
Steady state CFD modeling of an IT pod and its cooling system (2015) (2)
Improving ducting to increase cooling performance of high-end web servers subjected to significant thermal shadowing – an experimental and computational study (2015) (2)
Parametric thermal analysis of TSVs in a 3-D module based on interconnect delay and silicon efficiency (2012) (2)
Solution of a system-level benchmark problem in electronics cooling (1994) (2)
Impact of Die Attach Sample Preparation on Its Measured Mechanical Properties for MEMS Sensor Applications (2021) (2)
Numerical prediction of the thermal resistance of cold plate (2001) (2)
Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling (2017) (2)
Solar shroud design using Computational Fluid Dynamics (2010) (2)
Structural integrity optimization of 3D TSV package by analyzing crack behavior at TSV and BEOL (2017) (2)
CFD Simulation and Optimization of the Cooling of Open Compute Machine Learning “Big Sur” Server (2018) (2)
Comparison of the effect of elastic and viscoelastic modeling of PCBs on the assessment of board level reliability (2017) (2)
Solving Thermal Issues in a Three-Dimensional-Stacked-Quad-Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through-Silicon-Vias (2013) (2)
CFD modeling of environmental system options used for cooling of telecommunication shelters (2010) (2)
Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system (2003) (2)
Supply Air Temperature Prediction in an Air-Handling Unit Using Artificial Neural Network (2018) (2)
Power consumption minimization in hybrid cooled server by fan reduction (2017) (2)
Impact of replacing Sn-Ag bumps with Cu pillars on the BEoL Cu/Low-k fracture under reflow - a computational study (2014) (2)
Impact of Viscoelastic Properties of Low Loss Printed Circuit Boards (PCBs) on Reliability of WCSP Packages Under Drop Test (2020) (2)
Impact of PCB Layer Orientation on the Drop Reliability of WCSP Boards (2016) (2)
Flow Analysis and Linearization of Rectangular Butterfly Valve Flow Control Device for Liquid Cooling (2018) (2)
Thermoelectric Cooling Analysis Using Modified Graphical Method (2009) (2)
A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply (2017) (2)
Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling (2020) (2)
The Impact of Area Contact Between Sensor Bulb and Evaporator Return Line in a Modular Refrigeration Unit: Part I — Computational Study (2003) (2)
LIQUID COOLING FOR THERMAL MANAGEMENT OF DATA CENTERS (2008) (2)
Microchannel Heat Sink (2009) (2)
Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by Nanoindentation (2018) (2)
Effect of flip chip package architecture on stresses in the bump passivation opening (2009) (2)
Removing the Hot-Spots in High Power Devices Using the Thermoelectric Cooler and Micro Heat Pipe (2012) (2)
Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawai (1999) (2)
Parametric Study of Hybrid Cooling Solution for Thermal Management of Data Centers (2007) (2)
Fluxless optical fiber attachment for hermetic MOEMS applications (2006) (2)
Neural Network Based Bin Analysis for Indirect/Direct Evaporative Cooling of Modular Data Centers (2018) (2)
Coupled Thermal and Structural Parametric Analysis of TSVs in 3D Electronics (2010) (2)
CFD Analysis of Thermal Shadowing and Optimization of Heatsinks in 3rd Generation Open Compute Server for Single-Phase Immersion Cooling (2019) (2)
Expanding the envelope for indirect/direct evaporative data center cooling using thermal energy storage (2016) (2)
A Comparative Study of Energy Savings in a Liquid-Cooled Server by Dynamic Control of Coolant Flow Rate at Server Level (2021) (2)
Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading (2017) (1)
Weather Analysis Using Neural Networks for Modular Data Centers (2018) (1)
The Impact of Board Layout and Layup on PWB Warpage During Fabrication and Due to Reflow Solder Process: A Review of Literature (2003) (1)
Four challenges in thermal management in communication devices (2004) (1)
Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia (1996) (1)
Multi-Objective Optimization of Graphite Heat Spreader for Portable Systems Applications (2009) (1)
Prediction of natural convection in horizontal annular enclosures at high Rayleigh numbers (1988) (1)
Costs and benefits of thermal energy storage for augmenting indirect/direct evaporative cooling systems (2016) (1)
Numerical and experimental investigation of heat transfer phenomena over an electronic module (1990) (1)
A REVIEW OF COOLING ROAD MAPS FOR 3D CHIP PACKAGES (2014) (1)
Accelerated Degradation Testing of Rigid Wet Cooling Media to Analyse the Impact of Calcium Scaling (2018) (1)
Response Time Analysis of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers (2010) (1)
Driving PCA thermal analysis using IDF 4.0 data exchange (1999) (1)
Single-Phase Microchannel Cooling for Stacked Single Core Chip and DRAM (2011) (1)
Enhanced Thermal Map Prediction and Floor Plan Optimization in Electronic Devices Considering Sub-Continuum Thermal Effects (2011) (1)
Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling (2021) (1)
Experimental Characterization of Vertically Split Distribution Wet- Cooling Media Used in the Direct Evaporative Cooling of Data Centers (2018) (1)
Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 2 — Effect on System-Level Performance (2013) (1)
Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System (2011) (1)
Mechanical Characterization of Sn-Ag-Cu Solder With Gold Addition Under Tensile Loading (2007) (1)
Approximate analytical model for a first level package with non-uniformly powered die (2006) (1)
Thermal Performance Evaluation of Three Types of Novel End-of-Aisle Cooling Systems (2017) (1)
Effects of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces (2002) (1)
Raising Inlet Air Temperature for a Hybrid-Cooled Server Retrofitted With Liquid Cooled Cold Plates (2018) (1)
Experimental Description of Information Technology Equipment Reliability Exposed to a Data Center Using Airside Economizer Operating in Recommended and Allowable ASHRAE Envelopes in an ANSI/ISA Classified G2 Environment (2020) (1)
Mathematical Model for Thermostatic Expansion Valve (2000) (1)
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers (2021) (1)
Design of a cold plate tester for accurate measurement of thermal performance (2005) (1)
CFD Modeling of the Distribution of Airborne Particulate Contaminants Inside Data Center Hardware (2020) (1)
Numerical simulation of convection in electronic equipment cooling - Presented at the winter annual meeting of ASME, San Fransisco, California, December 10-15, 1989 (1989) (1)
Integrated (electrical/mechanical) design methodology for modeling of electronic cooling systems (1992) (1)
Coupled Computational Thermal and Mechanical Analysis of a Single Chip Flip Chip Module With Low-k Dielectric Medium (2011) (1)
Thermal-Aware Power Migration in Many-Core Processors (2010) (1)
Numerical methodology for analysis of card on board packages (1990) (1)
Industrial Assessment Center Program (2007) (1)
Liquid cooling of a stacked quad-core processor and DRAM using laminar flow in microchannels (2011) (1)
Rear Door Heat Exchanger Cooling Performance in Telecommunication Data Centers (2010) (1)
Experimental and computational characterization of a heat sink tester (2007) (1)
Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems (2013) (1)
Numerical Investigation of Enclosure Effects on Spot Cooling Devices (2004) (1)
Foreword: Special issue on electronic cooling (2005) (1)
Effect of Heat Sink Assembly on Mechanical Reliability of a Wire Bonded Plastic Ball Grid Array Package (2007) (1)
Optimization of Location of a Power Cell for Energy Efficient Operation of Air Cool Drives (2009) (1)
UNSTEADY BUOYANCY INDUCED FLOW IN AN ENCLOSURE. (1987) (0)
Multi-Objective Parameterization of Graphite Heat Spreader for Portable Systems Applications (2007) (0)
A Numerical Study on Multi-objective Design Optimization of Heatsinks for Forced and Natural Convection Cooling of Immersion Cooled Servers (2022) (0)
Performance of a Masterflux Compressor in a Refrigeration Unit for High End Computer System Application (2003) (0)
Experimentally verified procedure for determining dynamical model of the ETM MEMS structures (2004) (0)
Development of Constitutive Equations and Novel Methodology for Failure Prediction Models for SAC Lead-free Alloys (2006) (0)
CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas (1997) (0)
A computational study of PCB layer orientation of WCSP assembly under temperature dependent drop impact loading (2016) (0)
Heat Transfer Performance of Aluminum-Foam Heat Sink Immersed in Dielectric Synthetic Fluid (2023) (0)
Solar Assisted Household Clothes Dryer (2010) (0)
Thermal Management of Telecommunication Cabinets Using Thermoelectric Coolers (2009) (0)
Improving the thermal performance of a forced convection air cooled solution - Part 1: Modification of heat sink assembly (2013) (0)
CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 (1994) (0)
Message from the: Electronics and Photonics Packaging Division Chair (2001) (0)
CORRELATION OF SOLDER JOINT RELIABILITY OF μ PGA SOCKET TO PACKAGE FLATNESS AND PCB WARPAGE (2010) (0)
Career Development Workshop (2021) (0)
Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server (2022) (0)
CFD Optimization of the Cooling of Yosemite Open Compute Server (2017) (0)
Simplified and Detailed Analysis of Data Center Particulate Contamination At Server and Room Level Using CFD (2021) (0)
Effects of Gaseous and Particulate Contaminants On Information Technology Equipment Reliability - A Review (2021) (0)
Numerical Investigation on Effect of Target Coolant Delivery in Liquid-Cooled Microchannel Heat Sinks (2022) (0)
Impact of Static Pressure Differential Between Supply Air and Return Exhaust on Server Level Performance (2018) (0)
Thermal road map for telecom equipment (2005) (0)
Allan Kraus Thermal Management Medalist & Other Awards (2021) (0)
Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations (2022) (0)
Process Development and Die Shear Testing in MOEMS Packaging (2007) (0)
Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993 (1993) (0)
A Methodology for an Integrated (Electrical/Mechanical) Design of PWBA (2003) (0)
Numerical simulations of the natural convective heat transfer inside an electronic device (2001) (0)
37. Study of Crack Propagation Under Thermal Loading (Abstract only) (2016) (0)
COLD PLATE BASED DYNAMIC LIQUID COOLING AT DATA CENTER AND CHIP LEVEL (2022) (0)
Effect of Continuous and Discontinuous Fabrication and Reflow Processes on PWB Warpage (2005) (0)
Computer aided design in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 (1992) (0)
Impact of area contact between sensor bulb and evaporator return line on MRU-Part 2, Experimental work (2004) (0)
Transient CFD Analysis of Dynamic Liquid-Cooling Implementation at Rack Level (2022) (0)
Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment (2022) (0)
CFD SIMULATION AND DESIGN OPTIMIZATION TO IMPROVE COOLING (2017) (0)
39. Board Level Reliability Assessment of Thick Board QFN Assemblies Under Power Cycling (Abstract only) (2016) (0)
Numerical model of the heat transport phenomena in the entrance region of a heated channel (1993) (0)
Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling (2022) (0)
Assessment of Reliability Enhancement in High-Power CPUs and GPUs Using Dynamic Direct-to-Chip Liquid Cooling (2022) (0)
Die and wafer-level hermetic sealing for MEMS applications (2007) (0)
Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers (2022) (0)
Package and Board Level Study for a Thin Small Outline Package (TSOP) Using Compact Components (2003) (0)
NUMERICAL STUDY OF STEADY FLOW IN AN ARTERIAL MODEL. (1982) (0)
Static Power Consumption: Silicon on Insulator Metal Oxide Semiconductor Field Effect Transistor (2007) (0)
Multi objective optimization of BEoL and fBEOL structure in flip chip package during die attach process (2014) (0)
Validation of ASHRAE Equation to Find Evaporation Rates in Humid Cavity (2004) (0)
Heat transfer in electronic equipment, 1991 (1991) (0)
Effect of TSV Joule Heating on Device Performance (2013) (0)
CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server (2022) (0)
Deformation Characteristics and Constitutive Relationship of SnAgCu Lead (Pb)-Free Solder Alloys Under Thermo-Mechanical and Mechanical Loading (2006) (0)
CFD Analysis of Heat Capture Ratio in a Hybrid Cooled Server (2022) (0)
Effect of removal of layers of WCSP assembly under thermal cyclic loading: A computational approach (2016) (0)
Experimental and Simulation Board Level Reliability Assessment of Wafer Level Chip Scale Packages (WCSPs) Under Thermal Cycling by HASSAAN (2015) (0)
Sensitivity Analysis of a Calibrated Data Center Model to Minimize the Site Survey Effort (2021) (0)
MULTI-OBJECTIVE DESIGN OPTIMIZATION OF BEoL / fBEoL REGION DURING CHIP ATTACHMENT TO SUBSTRATE by HARDIK PAREKH (2013) (0)
Professor A. Haji-Sheikh on his 85th birthday (2018) (0)
Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center (2022) (0)
Optimization of heat pipe spacing in heat sinks: A computational fluid dynamics study (2001) (0)
A three dimensional thermo-mechanical analysis of a BGA package (2001) (0)
38. Computational Analysis of Ramp and Dwell Time on the Performance of WCSP Assemblies of Layer Removed Boards (Abstract only) (2016) (0)
NiyanTron — An approach to develop a control system app for data center cooling (2017) (0)
Impact of Immersion Cooling on Thermomechanical Properties of Non-Halogenated Substrate (2022) (0)
INVITED TALK: Birth-to-death (from Die Metal/Passivation Processing to Board Assembly) Modeling Methodology for the Optimization of Custom Board-Level Reliability (2016) (0)
Bump electromigration and back end design rules (2007) (0)
Optimal Design and Modeling of Server Cabinets With In-Row Coolers and Air Conditioning Units in a Modular Data Center (2019) (0)
Application of the integrated volume visualization system (IVS) to electronic cooling (1993) (0)
Parametric study of the QFN mounted PCB- Cu layer thickness effect on the stress induced during drop testing (2016) (0)
Experimental Study Demonstrating Pumping Power Savings at Rack Level Using Dynamic Cooling (2022) (0)
A convertible heat exchanger for air or water cooling of electronic equipment (1994) (0)
Design of the Next Generation Antenna Mounts (2015) (0)
Thermal Performance Evaluation of a New Close-Coupled Cooling Solution including Cooling Failure Analysis (2018) (0)
A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads (2022) (0)
Review of Reliability of the Cooling Technologies in the Telecommunications Systems (2009) (0)
Computational Study Of Behavior Of Gas Absorption In Data Center Equipment And Its Effects On The Rate Of Corrosion/contamination (2015) (0)
Welcome to ITHERM 2006 (2006) (0)
ITherm 2004 Organizing Committee (2004) (0)
A Thermo-Mechanical Study on Vertically Split Distribution-Wet Cooling Media Used in Data Centers (2018) (0)
Impact of Improved Ducting and Chassis Re-design for Air-Cooled Servers in a Data Center (2022) (0)
Master’s Thesis Defense Announcement Mechanical and Aerospace Engineering Department University of Texas at Arlington SOLDER JOINT LIFE PREDICTION OF PHOTONIC PACKAGE USING III-V MATERIALS (2021) (0)
The NAI Profile: An Interview With Dr. Dereje Agonafer (2020) (0)
Design and CFD analysis of a tank solution for natural convection based single-phase immersion cooling of servers (2021) (0)
Numerical simulation of convection in electronic equipment cooling : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989 (1989) (0)
Design for Reliability Applied to Packaging of a MOEMS Switch (2008) (0)
Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Centralized Coolant System (2018) (0)
Heat transfer education (1998) (0)
Challenges in chip/processor level thermal engineering (2004) (0)
Fluxless soldering for hermetic packaging of MOEMS (2006) (0)
Characterization of parallel and opposed control dampers to observe the effect on thermal mixing of air streams in an air-cooling unit (2022) (0)
40. Analysis for Modeling Methodology of Drop Reliability Due to Equivalent Material Properties (Abstract only) (2016) (0)
Impact of TXV and compressor in the stability of a high-end computer refrigeration system (2004) (0)
Cooling of a PWB With Irregular Populated Chips (2000) (0)
Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization (2020) (0)
Thermal Modeling of Remote Radio Head Units (2015) (0)
Thermally Based Design Optimization of Telecommunication Shelter (2010) (0)
Numerical studies on chimney-enhanced natural convection (2001) (0)
Impact of Immersion Cooling on Thermo-mechanical Properties of Low-loss Material Printed Circuit Boards (2021) (0)
Design, Optimization and Thermal Analysis of Motor-Controllers in a Quadruped Robot (2011) (0)
Viscoelastic Influence On the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling (2022) (0)
Effect of Relocation of Functional Units of a Non-Uniformly Powered Microprocessor on Thermal and Device Clock Performance (2009) (0)
Assessment of Pump Power Savings at Rack level for Dynamic Direct-to-Chip Liquid Cooling Using a Novel Flow Control Device (2022) (0)

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