Ephraim Suhir
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Engineering Physics
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(Suggest an Edit or Addition)Ephraim Suhir's Published Works
Number of citations in a given year to any of this author's works
Total number of citations to an author for the works they published in a given year. This highlights publication of the most important work(s) by the author
Published Works
- Stresses in Bi-Metal Thermostats (1986) (454)
- New approach to the high quality epitaxial growth of lattice‐mismatched materials (1986) (323)
- Interfacial Stresses in Bimetal Thermostats (1989) (317)
- An approximate analysis of stresses in multilayered elastic thin films (1988) (187)
- Calculated thermally induced stresses in adhesively bonded and soldered assemblies. (1986) (112)
- Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging (2007) (112)
- Thermal properties of carbon nanotube array used for integrated circuit cooling (2006) (110)
- Applied Probability for Engineers and Scientists (1997) (105)
- Structural analysis in microelectronic and fiber optic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California (1991) (103)
- Analysis of interfacial thermal stresses in a trimaterial assembly (2001) (82)
- Moisture Sensitivity of Plastic Packages of IC Devices (2010) (80)
- Mechanical approach to the evaluation of the low temperature threshold of added transmission losses in single-coated optical fibers (1990) (77)
- Accelerated life testing in microelectronics and photonics, its role, attributes, challenges, pitfalls, and its interaction with qualification tests (2002) (72)
- Is the maximum acceleration an adequate criterion of the dynamic strength of a structural element in an electronic product (1997) (62)
- Predictive Analytical Thermal Stress Modeling in Electronics and Photonics (2009) (57)
- Thermally induced stresses in an optical glass fiber soldered into a ferrule (1994) (56)
- Predicted thermal stresses in a bimaterial assembly adhesively bonded at the ends (2001) (54)
- Effect of initial curvature on low temperature microbending in optical fibers (1988) (53)
- Microelectronics and photonics-the future (2000) (51)
- Thermal stress in a polymer-coated optical glass fiber with a low-modulus coating at the ends (2001) (48)
- BOLTZMANN–ARRHENIUS–ZHURKOV (BAZ) MODEL IN PHYSICS-OF-MATERIALS PROBLEMS (2013) (48)
- Could electronics reliability be predicted, quantified and assured? (2013) (47)
- Stresses in Adhesively Bonded Bi-Material Assemblies Used in Electronic Packaging (1986) (42)
- Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices (1993) (42)
- Assembly Bonded at the Ends: Could Thinner and Longer Legs Result in a Lower Thermal Stress in a Thermoelectric Module Design? (2012) (40)
- On a Paradoxical Phenomenon Related to Beams on Elastic Foundation: Could External Compliant Leads Reduce the Strength of a Surface-Mounted Device? (1988) (40)
- Adhesively bonded assemblies with identical nondeformable adherends and ‘piecewise continuous’ adhesive layer: predicted thermal stresses in the adhesive (2000) (39)
- Predicted thermally induced stresses in, and the bow of, a circular substrate/thin-film structure (2000) (39)
- Solder-glass attachment in Cerdip/Cerquad packages: thermally induced stresses and mechanical reliability (1990) (38)
- Analytical Modeling in Electronic Packaging Structures: Its Merits, Shortcomings and Interaction With Experimental and Numerical Techniques (1989) (38)
- Approximate evaluation of the elastic interfacial stresses in thin films with application to high-Tc superconducting ceramics (1991) (38)
- Spring constant in the buckling of dual-coated optical fibers (1988) (36)
- Interfacial thermal stresses in a bi-material assembly with a low-yield-stress bonding layer (2006) (36)
- Axisymmetric Elastic Deformations of a Finite Circular Cylinder With Application to Low Temperature Strains and Stresses in Solder Joints (1989) (36)
- Stresses in Dual-Coated Optical Fibers (1988) (35)
- Could Shock Tests Adequately Mimic Drop Test Conditions (2002) (35)
- The future of microelectronics and photonics and the role of mechanics and materials (1997) (35)
- Could compliant external leads reduce the strength of a surface-mounted device? (1988) (33)
- Moisture Diffusion in Epoxy Molding Compounds Filled With Particles (2001) (33)
- Predicted Thermal Mismatch Stresses in a Cylindrical Bi-material Assembly Adhesively Bonded at Its Ends (1997) (31)
- Response of a Flexible Printed Circuit Board to Periodic Shock Loads Applied to its Support Contour (1992) (31)
- Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von Kármán's equations with consideration of thermoelastic strains (1997) (30)
- Could shock tests adequately mimic drop test conditions? (2002) (30)
- Dynamic response of a rectangular plate to a shock load, with application to portable electronic products (1994) (29)
- Thermal Stress Failures in Electronics and Photonics: Physics, Modeling, Prevention (2013) (29)
- Predicted stresses and strains in fused biconical taper couplers subjected to tension. (1993) (28)
- Manned missions to Mars: Minimizing risks of failure (2014) (28)
- Thermal stress modeling in microelectronics and photonic structures, and the application of the probablistic approach : Review and extension (2000) (28)
- Nonlinear dynamic response of a flexible thin plate to constant acceleration applied to its support contour, with application to printed circuit boards, used in avionic packaging (1992) (28)
- Approximate Evaluation of the Elastic Thermal Stresses in a Thin Film Fabricated on a Very Thick Circular Substrate (1994) (27)
- Thermal stress in a bi-material assembly with a ‘piecewise-continuous’ bonding layer: theorem of three axial forces (2009) (27)
- Approximate evaluation of the interfacial shearing stress in cylindrical double lap shear joints with application to dual-coated optical fibers (1994) (26)
- Analysis of interfacial thermal stresses and adhesive strength of bi-annular cylinders (1990) (26)
- Minimizing thermally induced interfacial shearing stress in a thermoelectric module (2012) (26)
- Dynamic response of a one-degree-of-freedom linear system to a shock load during drop tests: Effect of viscous damping (1996) (26)
- Stresses in Multilayered Thin Films on a Thick Substrate (1987) (25)
- Crew size impact on the design, risks and cost of a human mission to mars (2014) (25)
- Human in the Loop: Predicted Likelihood of Vehicular Mission Success and Safety (2012) (25)
- Helicopter Landing Ship: Undercarriage Strength and the Role of the Human Factor (2010) (25)
- Mechanical Behavior of Flip-Chip Encapsulants (1990) (24)
- Bimaterial assembly with a low modulus bonding layer at the ends (2003) (24)
- Elastic stability, free vibrations, and bending of optical glass fibers: effect of the nonlinear stress-strain relationship. (1992) (24)
- Mechanical behavior of materials and structures in microelectronics (1991) (24)
- Adhesively Bonded Assemblies with Identical Nondeformable Adherends and Nonhomogeneous Adhesive Layer: Predicted Thermal Stresses in the Adhesive (1998) (23)
- Shock protection with a nonlinear spring (1995) (23)
- Predicted reliability of aerospace electronics: Application of two advanced probabilistic concepts (2013) (23)
- Optical fiber interconnect with the ends offset and axial loading: What could be done to reduce the tensile stress in the fiber? (2000) (23)
- Analysis of a short beam with application to solder joints: could larger stand-off heights relieve stress? (2015) (23)
- Analysis of a pre‐stressed bi‐material accelerated‐life‐test (ALT) specimen (2011) (22)
- Predicted Thermal Stress in a Multileg Thermoelectric Module (TEM) Design (2013) (21)
- Tailored polymer–metal fractal nanocomposites: an approach to highly active surface enhanced Raman scattering substrates (2009) (21)
- Effect of the nonlinear stress-strain relationship on the maximum stress in silica fibers subjected to two-point bending. (1993) (20)
- Could application of column-grid-array (CGA) technology result in inelastic-strain-free state-of-stress in solder material? (2015) (20)
- Probabilistic design-for-reliability concept and novel approach to qualification testing of aerospace electronic products (2012) (20)
- Can the curvature of an optical glass fiber be different from the curvature of its coating (1993) (20)
- Buffering effect of fiber coating and its influence on the proof test load in optical fibers. (1990) (20)
- Probabilistic Design for Reliability (PDfR) and a Novel Approach to Qualification Testing (QT) (2012) (20)
- Predicted curvatures and stresses in a fiber-optic interconnect subjected to bending (1995) (19)
- Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with a low modulus solder at its ends (2015) (19)
- Adhesively bonded assemblies with identical nondeformable adherends: modeling of the induced thermal stresses in the adhesive layer (1998) (18)
- Predicted Stresses in Wire Bonds of Plastic Packages During Transfer Molding (1991) (18)
- On a Paradoxical Situation Related to Bonded Joints: Could Stiffer Mid-Portions of a Compliant Attachment Result in Lower Thermal Stress? (2009) (18)
- Nonlinear dynamic response of a ‘flexible-and-heavy’ printed circuit board (PCB) to an impact load applied to its support contour (2009) (18)
- Predicted Size of an Inelastic Zone in a Ball-Grid-Array Assembly (2013) (18)
- How to Make a Device into a Product: Accelerated Life Testing (ALT), Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests (2007) (18)
- Human-in-the-Loop: Probabilistic Modeling of an Aerospace Mission Outcome (2018) (18)
- Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board (2000) (18)
- Thermal stress in through-silicon-vias: Theory-of-elasticity approach (2014) (17)
- Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review (2003) (17)
- Improved performances of polymer-based dielectric by using inorganic/organic core-shell nanoparticles (2012) (17)
- Could thermal stresses in a BGA/CGA-system be evaluated from a model intended for a homogeneously bonded assembly? (2015) (17)
- Effects of the CTE and Young’s modulus lateral gradients on the bowing of an optical fiber: analytical and finite element modeling (2000) (17)
- Predicted Bow of Plastic Packages Due to the Nonuniform Through-Thickness Distribution of Temperature (1992) (17)
- Probabilistic Palmgren–Miner rule, with application to solder materials experiencing elastic deformations (2017) (17)
- Shock-excited vibrations of a conservative Duffing oscillator with application to shock protection in portable electronics (1996) (16)
- Predicted Thermal Stresses in a Trimaterial Assembly With Application to Silicon-Based Photovoltaic Module (2013) (16)
- Effect of the Nonlinear Behavior of the Material on Two-Point Bending of Optical Glass Fibers (1992) (16)
- Advances in electronic packaging, 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coas (1997) (16)
- Bending Stress in an Optical Fiber Interconnect Experiencing Significant Ends Off-Set (1998) (16)
- Thermally induced interfacial stresses in elongated bimaterial plates (1989) (15)
- Vibration frequency of a fused biconical taper (FBT) lightwave coupler (1992) (15)
- When adequate and predictable reliability is imperative (2012) (15)
- Twist-Off Testing of Solder Joint Interconnections (1989) (15)
- Effective Young's modulus of carbon nanofiber array (2006) (15)
- Nonlinear Dynamic Response of a Printed Circuit Board to Shock Loads Applied to Its Support Contour (1992) (15)
- Two Men in a Cockpit: Casualty Likelihood if One Pilot Becomes Incapacitated (2011) (15)
- Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results (2006) (15)
- Linear and Nonlinear Vibrations Caused by Periodic Impulses (1985) (15)
- Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design (2016) (15)
- Structural Dynamics of Electronic and Photonic Systems: Suhir/Structural Dynamics of Micro Systems (2011) (15)
- Solder material experiencing low temperature inelastic stress and random vibration loading: predicted remaining useful lifetime (2017) (15)
- Analytical Modeling Occupies a Special Place in the Modeling Effort (2016) (14)
- Statistics-related and reliability-physics-related failure processes in electronics devices and products (2014) (14)
- Fiber Optics Structural Mechanics: Brief Review (1998) (14)
- Bending performance of clamped optical fibers: stresses due to the end off-set. (1989) (14)
- Human-in-the-Loop (HITL): Probabilistic Predictive Modeling (PPM) of an Aerospace Mission/Situation Outcome (2014) (14)
- Three-step concept (TSC) in modeling microelectronics reliability (MR): Boltzmann-Arrhenius-Zhurkov (BAZ) probabilistic physics-of-failure equation sandwiched between two statistical models (2014) (14)
- Pull testing of a glass fiber soldered into a ferrule: how long should the test specimen be? (1994) (14)
- Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with an epoxy adhesive at its ends (2016) (14)
- What could and should be done differently: failure-oriented-accelerated-testing (FOAT) and its role in making an aerospace electronics device into a product (2018) (14)
- Stresses in a coated fiber stretched on a capstan. (1990) (14)
- Mechanical behavior and reliability of solder joint interconnections in thermally matched assemblies (1992) (14)
- 'Miracle–on–the–Hudson': quantitative aftermath (2013) (14)
- Elastic Stability of a Cantilever Beam (Rod) Supported by an Elastic Foundation, With Application to Nano-Composites (2012) (13)
- Technical Diagnostics in Electronics: Application of Bayes Formula and Boltzmann-Arrhenius-Zhurkov (BAZ) Model (2012) (13)
- Design-for-reliability (DfR) of aerospace electronics: Attributes and challenges (2013) (13)
- Short note - adequate trust, human-capacity-factor, probability-distribution-function of human non-failure and its entropy (2019) (13)
- Effect of rapid thermal annealing (RTA) on thermal properties of carbon nanofibre (CNF) arrays (2006) (13)
- Bonding strength of a carbon nanofiber array to its substrate (2006) (13)
- Static fatigue lifetime of optical fibers assessed using Boltzmann–Arrhenius–Zhurkov (BAZ) model (2017) (13)
- Radio frequency functional capacitors made of all-organic composites of thiourea in field-responsive polymers (2008) (13)
- Human-in-the-loop: application of the double exponential probability distribution function enables one to quantify the role of the human factor (2017) (13)
- HALT, FOAT and their role in making a viable device into a reliable product (2014) (12)
- Stresses in bi-material GaN assemblies (2011) (12)
- Two Men in a Cockpit: Probabilistic Assessment of the Likelihood of a Casualty if One of the Two Navigators Becomes Incapacitated (2010) (12)
- Assuring Electronics Reliability: What Could and Should Be Done Differently (2013) (12)
- Predicted Residual Bow of Thin Plastic Packages of Integrated Circuit Devices (1992) (12)
- Elastic stability of a dual-coated optical fiber of finite length (2007) (12)
- Inorganic/organic nanocomposites: Reaching a high filler content without increasing viscosity using core-shell structured nanoparticles (2015) (11)
- Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design (1995) (11)
- Human-in-the-loop: probabilistic predictive modelling, its role, attributes, challenges and applications (2015) (11)
- Interfacial stresses in a bi-material assembly with a compliant bonding layer (2008) (11)
- Probabilistic design for reliability in electronics and photonics: Role, significance, attributes, challenges (2015) (11)
- Highly compliant bonding material and structure for micro- and opto-electronic applications (2006) (11)
- On a paradoxical situation related to lap shear joints: could transverse grooves in the adherends reduce the interfacial stresses? (2008) (11)
- Analytical modeling of the interfacial shearing stress in dual-coated optical fiber specimens subjected to tension. (1993) (11)
- To Burn-In, or Not to Burn-In: That’s the Question (2019) (11)
- Free vibrations of a fused biconical taper lightwave coupler (1992) (11)
- Interfacial shearing stress in pull-out testing of dual-coated lightguide specimens (1993) (11)
- Probabilistic approach to evaluate improvements in the reliability of a chip-substrate (chip-card) assembly (1997) (11)
- Optical Fiber Interconnect Subjected to a Not-Very-Small Ends Off-Set: Effect of the Reactive Tension (1998) (10)
- Predicted thermal stresses in a bow-free adhesively bonded assembly for photonic packaging applications (2003) (10)
- Calculated stresses in dual coated optical fibers (1990) (10)
- Could shock tests adequately replace drop tests? (2002) (10)
- Elastic stability of a dual coated optical fiber with a stripped off coating at its end (2007) (10)
- Polymer coated optical glass fibers: review and extension (2004) (10)
- Analytical thermal stress modeling in electronics and photonics engineering: Application of the concept of interfacial compliance (2019) (10)
- Analysis of a Bow-Free Prestressed Test Specimen (2014) (10)
- Predicted failure criterion (von-Mises stress) for moisture-sensitive plastic packages (1995) (10)
- Failure Oriented Accelerated Testing (FOAT), Boltzmann Arrhenius Zhurkov Equation (BAZ), and their Application in Aerospace Microelectronics and Photonics Reliability Engineering (2019) (10)
- Design of Shock Table Tests to Mimic Real-Life Drop Conditions (2009) (10)
- New nano-particle material (NPM) for micro- and opto-electronic packaging applications (2005) (10)
- How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing? (1995) (10)
- Analytical bathtub curve with application to electron device reliability (2015) (10)
- Predictive Modeling of the Dynamic Response of Electronic Systems to Shocks and Vibrations (2010) (10)
- Compliance properties study of carbon nanofibres (CNFs) array as thermal interface material (2008) (10)
- Aerospace optoelectronics reliability: application of multi-parametric BAZ model (2014) (10)
- Bi-material assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at its ends: optimized stress relief (2016) (10)
- Stress Relief in Solder Joints Due to the Application of a Flex Circuit (1991) (10)
- Stresses in a partially coated optical glass fiber subjected to the ends off-set (1997) (9)
- Flip-chip solder joint interconnections and encapsulants in silicon-on-silicon MCM technology: thermally induced stresses and mechanical reliability (1993) (9)
- Analysis and optimization of the dynamic response of a rectangular plate to a shock load acting on its support contour, with application to portable electronic packages (1994) (9)
- Column-grid-array (CGA) versus ball-grid-array (BGA): board-level drop test and the expected dynamic stress in the solder material (2016) (9)
- Probabilistic modelling of the concept of anticipation in aviation (2015) (9)
- Expected stress relief in a bi-material inhomogeneously bonded assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at the ends (2016) (9)
- A unified multiple stress reliability model for microelectronic devices - Application to 1.55 μm DFB laser diode module for space validation (2015) (9)
- Some major guiding principles to make future manned missions to mars safe and reliable (2014) (9)
- Quantified Reliability of Aerospace Optoelectronics (2014) (9)
- Short note - assessment of the required human capacity factor using flight simulator as an appropriate accelerated test vehicle (2019) (9)
- Column-grid-array (CGA) technology could lead to a highly reliable package design (2016) (8)
- Astronaut's performance vs. his/hers human-capacity-factor and state-of-health: Application of double-exponential-probability-distribution function (2021) (8)
- Helicopter Landing Ship (HLS): Undercarriage Strength and the Role of the Human Factor (2009) (8)
- Towards Probabilistic Analysis of Human-System Integration in Automated Driving (2020) (8)
- Mechanical Deformation of Leadframe Assemblies in Plastic Packages During Molding (1991) (8)
- The Elementary Problems (1991) (8)
- Mechanical Behavior of Materials in Microelectronic and Fiber-Optic Structures: Application of Analytical Modeling - Review (1991) (8)
- Analytical stress modeling for TSVs in 3D packaging (2015) (8)
- Structural Analysis in Microelectronics (1992) (8)
- Flip-Chip (FC) and Fine-Pitch-Ball-Grid-Array (FPBGA) Underfills for Application in Aerospace Electronics—Brief Review (2018) (8)
- Failure-Oriented-Accelerated-Testing and its Possible Application in Ergonomics (2019) (8)
- How Long Should Be a Beam Specimen in Bending Tests (1990) (8)
- Landing on Mars: probabilistic modeling enables quantifying the last “six minutes of terror” (2021) (7)
- Prediction of delamination in a Bi-material system based on free-edge energy evaluation (2003) (7)
- Accelerated life testing in photonics packaging: its objectives, role, attributes, challenges, pitfalls, predictive models, and interaction with other accelerated stress categories (2003) (7)
- Saint-Venant's principle and the minimum length of a dual-coated optical fiber specimen in reliability (proof) testing (2013) (7)
- Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review (1999) (7)
- Electron Device Subjected to Temperature Cycling: Predicted Time-to-Failure (2019) (7)
- Structural mechanics of polymer coated optical glass fibres: review (2001) (7)
- Modeling of thermal phenomena in a high power diode laser package (2009) (7)
- Basic principles of engineering elasticity and fundamentals of structural analysis (1991) (7)
- Reliability improvement through nanoparticle material-based fiber structures (2007) (7)
- Remaining Useful Lifetime (RUL): Probabilistic Predictive Model (2021) (6)
- Probabilistic modelling of the role of the human factor in the Helicopter-Landing-Ship HLS situation (2010) (6)
- Using yield to predict long-term reliability of integrated circuits: Application of Boltzmann-Arrhenius-Zhurkov model (2020) (6)
- Application of a ‘surrogate’ layer for lower bending stress in a vulnerable material of a tri-material body (1998) (6)
- Predicted stresses in die‐carrier assemblies in “stretchable” electronics: is there an incentive for using a compliant bond? (2011) (6)
- Disc-like copper vias fabricated in a silicon wafer: Design for reliability (2008) (6)
- Bi-material assembly subjected to thermal stress: propensity to delamination assessed using interfacial compliance model (2016) (6)
- Mechanics of coated optical fibers: review and extension (2005) (6)
- Novel technique for the evaluation of adhesive strength of molding compounds used in plastic packaging (1992) (6)
- Response of a heavy electronic component to harmonic excitations applied to its external electric leads (2007) (6)
- Predicted Response of the Die-Carrier Assembly in Flexible Electronics to the Combined Action of Tension and Bending Applied to the Carrier (2012) (6)
- Analytical thermal stress model for a typical flip-chip (FC) package design (2018) (6)
- Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach (1997) (6)
- Towards adequate qualification testing of electronic products: Review and extension (2014) (5)
- The effect of the nonlinear stress-strain relationship on the mechanical behavior of optical glass fibers (1993) (5)
- Avoiding collision in automated driving situation (2020) (5)
- Bending of an Optical Glass Fiber “Pigtail” in a Splice Box Structure (1998) (5)
- Analytical Modeling Enables Explanation of Paradoxical Behaviors of Electronic and Optical Materials and Assemblies (2017) (5)
- Input/output fiber configuration in a laser package design (1993) (5)
- Nonlinear dynamic response of a flexible printed circuit board to a shock load applied to its support contour (1991) (5)
- Extraordinary Automated Driving Situations: Probabilistic Analytical Modeling of Human-Systems-Integration (HSI) and the Role of Trust (2020) (5)
- Fiber Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension (2007) (5)
- Head-on railway obstruction: a probabilistic model (2020) (5)
- Reliability physics and probabilistic design for reliability (PDfR): Role, attributes, challenges (2014) (5)
- STRUCTURAL DYNAMICS OF ELECTRONIC SYSTEMS (2013) (5)
- Predicted size of the inelastic zone in a ball-grid-array (BGA) assembly (2013) (5)
- FIBER OPTICS ENGINEERING: PHYSICAL DESIGN FOR RELIABILITY (2014) (5)
- Board level drop test: exact solution to the problem of the nonlinear dynamic response of a PCB to the drop impact (2016) (5)
- Survivability of species in different habitats: Application of multi-parametric Boltzmann-Arrhenius-Zhurkov equation (2020) (5)
- Predicted Thermal- and Lattice-Mismatch Stresses (2015) (5)
- Application of an Epoxy Cap in a Flip-Chip Package Design (1989) (5)
- Scanning acoustic microscopy and shear wave imaging mode performances for failure detection in high-density microassembling technologies (2015) (5)
- The coordinate function in the problem of the nonlinear dynamic response of an elongated printed circuit board (PCB) to a drop impact applied to its supports (2009) (5)
- Effect of Temperature on Vibrations of Physically Nonlinear Piezoelectric Rods (2006) (5)
- Could dynamic strength of a bonding material in an electronic device be assessed from static shear-off test data? (2016) (4)
- Predicted Useful Lifetime of Aerospace Electronics Experiencing Ionizing Radiation: Application of BAZ Model (2019) (4)
- Transient thermomechanical study of a thick-wire bond with particular attention to the interfacial shearing stress (2012) (4)
- Dynamic Response of Micro- and Opto-Electronic Systems to Shocks and Vibrations: Review and Extension (2007) (4)
- Can Power Cycling Life of Solder Joint Interconnections be Assessed on the Basis of Temperature Cycling Tests (1989) (4)
- Failure-Oriented-Accelerated-Testing and Its Role in Making a Device into a Product (2019) (4)
- Duffing Oscillator: Could an Impact Load of Finite Duration be Substituted with an Instantaneous Impulse? (2010) (4)
- Flip-chip assembly: is the bi-material model acceptable? (2017) (4)
- IEEE COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY SOCIETY (2010) (4)
- Semiconductor Film Grown on a Circular Substrate: Predictive Modeling of Lattice-Misfit Stresses (2016) (4)
- How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains? (2017) (4)
- Predicted curvature of a glass fiber from the measured curvature of its coating (1991) (4)
- Effect of Material’s Nonlinearity on the Mechanical Response of some Piezoelectric and Photonic Systems (2007) (4)
- Risk-Analysis in Aerospace Human-Factor-Related Tasks: Review and Extension (2020) (4)
- Human-in-the-Loop: Could Predictive Modeling Improve Human Performance? (2016) (4)
- Predicted lattice-misfit stresses in a gallium-nitride (GaN) film (2017) (4)
- Linear Response to Shocks and Vibrations (2011) (4)
- Structural analysis in microelectronics and fiber optics : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 (1993) (4)
- Quantifying the roles of human error and his/her state-of-health: use of the double-exponential-probability-distribution-function (2018) (4)
- Low-Cycle-Fatigue Failures of Solder Material in Electronics Packaging: Analytical Modeling Enables to Predict and Possibly Prevent Them-Review (2018) (4)
- Novel core-shell nanocomposites for RF embedded capacitors: Processing and characterization (2012) (4)
- Designing with consideration of the human factor: Changing the paradigm for higher safety (2014) (4)
- Application of a surrogate layer for lower bending stress in a tri-material body (1996) (4)
- Interfacial Stresses in a Lap Shear Joint (LSJ): The "Transverse Groove Effect" (TGE) (2010) (4)
- Degraded situation awareness risk assessment in the aerospace domain (2019) (4)
- Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications (2007) (4)
- Shock Test Methods and Test Standards for Portable Electronic Devices (2011) (3)
- Silicon photonics interfaced with microelectronics for integrated photonic quantum technologies: a new era in advanced quantum computers and quantum communications? (2023) (3)
- Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France (1998) (3)
- Reliability of photonics materials and structures : symposium held April 13-16, 1998, San Francisco, California, U.S.A. (1998) (3)
- The Outcome of an Engineering Undertaking of Importance Must be Quantified to Assure its Success and Safety: Review (2020) (3)
- Analytical (“mathematical”) modeling of the dynamic response of a printed circuit board (PCB) to an impact load (2010) (3)
- Reliability physics behind the QFN state of stress (2016) (3)
- Predicted Thermal Stresses in a Circular Assembly With Identical Adherends and With Application to a Holographic Memory Package Design (2012) (3)
- Aerospace electronics reliability prediction: application of two advanced probabilistic techniques (2018) (3)
- Novel test methodology for the most consistent and accurate characterization of solder materials in electronics engineering (2009) (3)
- Dynamic Physical Reliability in Application to Photonic Materials (2007) (3)
- Analysis of an elongated stretched strip, with application to a strain‐gage electrical sensor design (2011) (3)
- Calculated Interfacial Stresses in Elongated Bimaterial Plates Subjected to Bending (1989) (3)
- Thermomechanical stress analysis of copper/silicon interface in through silicon vias using FEM simulations and experimental analysis (2014) (3)
- Aerospace electronics-and-photonics (AEP) reliability has to be quantified to be assured (2016) (3)
- Analytical (mathematical) predictive modeling in fiber optics structural analysis (FOSA): review and extension (2015) (3)
- Fabrication of Nanodielectric BaTiO 3 Composites Exhibiting Stable Capacitor Functions in the High Frequency (> 100 MHz) Through Interfacial Polarization Interactions (2009) (3)
- Predicted thermal stresses in a cylindrical tri-material body, with application to optical fibers embedded into silicon (2013) (3)
- The Future of Microelectronics and Photonics , and the Role of Mechanical , Materials and Reliability Engineering (2001) (3)
- Aging-related failure rate obtained from bathtub curve data (2015) (3)
- Elevated Stand-Off Heights in Solder Joint Interconnections of Surface Mounted IC Packages Result in Appreciable Stress and Warpage Relief (2018) (2)
- Predictive reliability using FEA simulations of power stacked ceramic capacitors for aeronautical applications (2014) (2)
- Fiber optic interconnects: physical design for reliability (2010) (2)
- Assessed interfacial strength and elastic moduli of the bonding material from shear-off test data (2017) (2)
- Fundamentals of Applied Probability (2018) (2)
- A Plate Contactor in a Mechanical Input/Output Connector Interface: How Small Can It Be? (1991) (2)
- Elevated Standoff Heights of Solder Joint Interconnections Can Result in Appreciable Stress and Warpage Relief (2019) (2)
- Solder Joint Interconnections in Automotive Electronics: Design-for-Reliability and Accelerated Testing (2019) (2)
- Design for Reliability of Electronic Materials and Systems (2019) (2)
- HOW LONG COULD/SHOULD BE THE RESTORATION TIME FOR HIGH AVAILABILITY? (2013) (2)
- Two-Dimensional Problem in Polar Coordinates (1991) (2)
- Boltzmann-Arrhenius-Zhurkov Equation and Its Application in Aerospace Electronicsand- Photonics Reliability Physics Problems: Review (2020) (2)
- Elastic stability of a compressed cantilever beam on an elastic foundation, with application to a dual-coated fiber-optic connector (2014) (2)
- Lateral compliance and elastic stability of a dual-coated optical fiber of finite length, with application to nano-rods embedded into low-modulus elastic media (2009) (2)
- Probabilistic reliability-physics models in aerospace human-in-the-loop (HITL) problems (2019) (2)
- Structural Analysis of Microelectronic and Photonic Systems (2005) (2)
- Aerospace Mission Outcome: Predictive Modeling (2018) (2)
- SHOCK-EXCITED VIBRATIONS WITH APPLICATION TO THE SLAMMING RESPONSE OF A FLEXIBLE SHIP TO A REGULAR WAVE PACKET (1982) (2)
- A novel approach for evaluation of material interfaces in electronics (2016) (2)
- Polymeric Coating of Optical Silica Fibers, and a Nanomaterial-Based Coating System (2007) (2)
- Power core (PC) embedding a plurality of IC devices and sandwiched between two dissimilar insulated metal substrates (IMS’): predicted thermal stresses (2016) (2)
- Reliability of Photonics Materials and Structures (Proceedings of the Reliability of Photonics Materials and Structures Symposium held April 13–16, 1998 in San Francisco, CA) (1999) (2)
- Dynamic Response of Micro-Electronic Structures to Shocks and Vibrations: Review and Extension (2007) (2)
- Physical Design for Reliability of Solder Joint Interconnections for Application in Aerospace Electronics (2019) (2)
- Solder joints in surface mounted IC assemblies: Relief in stress and warpage owing to the application of elevated stand-off heights (2018) (2)
- Expected life-time of an optical silica fiber intended for open space applications: Probabilistic predictive model (2021) (2)
- Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles (1997) (2)
- Random Vibrations of Structural Elements in Electronic and Photonic Systems (2011) (2)
- Analytical Modeling Enables One to Explain Paradoxical Situations in Behavior and Performance of Electronic Product Materials (2016) (2)
- Is burn-in always needed ? (2020) (2)
- Materials physics-materials mechanics (2007) (1)
- Physics design-reliability and packaging (2007) (1)
- Figure-of-Merit for a Long-Term Survivorship of a Species Determined from the Short-Term Mortality Rate of Its Individual Organisms (2021) (1)
- Could Electronics Reliability be Assured, if it is Not Quantified (2016) (1)
- Lateral compliance of a compressed rod supported by an elastic foundation, with application to micro-electronic and fibre-optic structures (2008) (1)
- Predicted thermal stresses in a bow-free electronic assembly for automotive and potential aerospace applications (2016) (1)
- Structural analysis in microelectronics and fiber optics 1994 : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 (1994) (1)
- When Instrumentation and Human Performance Contribute Jointly to the Outcome of a Human-System-Integration (HSI) Mission: Brief Review (2021) (1)
- Helicopter-Landing-Ship and the Role of the Human Factor (2018) (1)
- Thermal stress modeling in electronics and photonics: Brief review (2012) (1)
- Aerospace electronic and photonic packaging: Predicted thermal stresses in Bi- and tri-material assemblies (2014) (1)
- Elastic stability of a dual-coated fiber-optic connector (2017) (1)
- Linear Response of Single‐Degree‐of‐Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions? (2011) (1)
- Bow-Free Tri-Component Mechanically Pre-Stressed Failure-Oriented-Accelerated-Test (FOAT) Specimen (2015) (1)
- Bending of a bi‐material cantilever beam, with consideration of the role of the interfacial shearing stress (2012) (1)
- Predicted Mechanical Behavior of High-Tc Superconducting Ceramic Films (1990) (1)
- Modified dynamic reliability model for damage accumulation (2015) (1)
- Fiber optics structural mechanics (1995) (1)
- Dynamic response of electronic materials to impact loading: review (2017) (1)
- Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension (2021) (1)
- Crossing the Lines (2004) (1)
- Effect of processing factors on dielectric properties of BaTiO3/hyperbranched polyester core-shell nanoparticles (2013) (1)
- Analysis of a bi‐material strip (2012) (1)
- Some Major Human Issues in Aerospace Engineering: Review and Extension (2021) (1)
- Bonded Tri-Material Specimen Subjected to Shear-Off Testing: Predicted Interfacial Stresses (2020) (1)
- Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application and Extension of the Theory of Thin Plates of Large Deflections (2010) (1)
- Prediction of remaining useful life (RUL) of ball-grid-array (BGA) interconnections during testing on the board level (2014) (1)
- Mental Workload vs. Human Capacity Factor: A Way to Quantify Human Performance (2019) (1)
- Application of Analytical Modeling in the Design for Reliability of Electronic Packages and Systems (2020) (1)
- Elastic stability of the glass fibers in a micromachined fiber-optic switch packaged into a dual-in-line ceramic package (1999) (1)
- Double-Sided “Velcro-Type” Input/Output Contactor Interface Design: Mechanical Behavior of Elastic Contactors (1990) (1)
- Driver propensity to fatigue and drowsiness: a probabilistic approach (2021) (1)
- Predicted Thermal Stress in Flip-Chip and Fine-Pitch-Ball-Grid-Array Designs: Effect of the Underfill Glass Transition Temperature (2018) (1)
- Input/output fiber configuration in a laser package design: optimization for lower stresses. (1994) (1)
- Bi-Material Assembly Subjected to Tensile Forces and Bending Moments Applied to the Ends of One of Its Components (2010) (1)
- Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse (2011) (1)
- Stress related aspects of GaN technology physics (2015) (1)
- Dynamic Response of PCB Structures to Shock Loading in Reliability Tests (2011) (1)
- Aerospace-electronics reliability-assurance (AERA): Three-step prognostics-and-health-monitoring (PHM) modeling approach (2016) (1)
- "Quantifying the Unquantifiable" in Aerospace Electronics and Ergonomics Engineering: Review (2020) (1)
- New Section in the Journal: Reliability of Microelectronics, Photonics and MEMS Materials and Packages (2000) (1)
- Predicted Thermal Stresses in a Photovoltaic Module (PVM) (2012) (1)
- “Stretchable” electronics: Does one really need a good thermal expansion (contraction) match between the silicon die and the plastic carrier? (2009) (1)
- Reliability of objects in aerospace technologies and beyond: Holistic risk management approach (2013) (1)
- Dynamic response of electronic systems to shocks and vibrations: Application of analytical (mathematical) modeling (2012) (1)
- Predicted Accelerations of Surface-Mounted Electron Devices during Spacecraft Launch (2020) (1)
- Mechanical Behavior of Optical Fibers and Interconnects: Application of Analytical Modelling (2020) (1)
- Thermal Stress Modeling in Micro- and Opto-Electronics: Review and Extension (2003) (1)
- Aerospace Electronics Reliability Must be Quantified to be Assured: Application of the Probabilistic Design for Reliability Concept (2020) (1)
- Interfacial shearing stress in a cylindrical double lap shear joint, with application to dual-coated optical fiber specimens (1994) (0)
- Double-Exponential Probability Distribution Function for the Human Nonfailure (2018) (0)
- Market Analysis on Lasers, Optics and Photonics (2019) (0)
- Three-step-concept (TSC): Boltzmann-Arrhenius-Zhurkov (BAZ) physics-of-failure equation sandwiched between two statistical models, with application to aerospace optics reliability (2017) (0)
- THERMAL STRESS MODELING IN MICROELECTRONICS AND PHOTONICS PACKAGING (2023) (0)
- Thermal stresses in a pre-framed silicon-based photovoltaic module (PVM): How thick should the backsheet be? (2012) (0)
- Required Repair Time to Assure the Given/Specified Availability (2020) (0)
- Equations and Conceptions (1991) (0)
- Mechanical Evaluation of the “Euler” Test Probe (1990) (0)
- Interfacial polarization and High Frequency ($>$100 MHz) Stable Capacitor Functions of Nanodielectric BaTiO3 Composites (2010) (0)
- Enhancement of Solar Biomass Dryer Adaptability of Karnaugh Maps Design and Fabrication of Power Modeling and Applications of a Solar (2021) (0)
- Aerodynamic Design Issues Modified Stepped Solar Still Construction of Concrete Wall Performance of a Capstone Gas (2022) (0)
- Probabilistic DfR in Electronics & Photonics & Its Role in Making a Viable IC Package into a Reliable Product (2021) (0)
- Lattice-Misfit Stresses in a Circular Bi-Material Gallium-Nitride Assembly (2013) (0)
- Fiber optics structural mechanics and nanotechnology-based new generation of fiber coatings (2006) (0)
- Probabilistic Assessment of an Aerospace Mission Outcome (2018) (0)
- Probabilistic Fitts’ Law with Application to Spacecraft Collision with an Asteroid (2022) (0)
- Structural analysis in microelectronics and fiber optics, 1996 : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia (1996) (0)
- Polytronic 2007 Conference Committees (2007) (0)
- Analytical Modeling of Electronic and Photonic Materials Reliability: Perspective and Extension (2023) (0)
- Surgeon’s performance: analogy with aircraft pilot’s challenges (2022) (0)
- Open Archive TOULOUSE Archive Ouverte (OATAO) (2015) (0)
- Curvatures and Stresses in a Fiber-optic nterconnect Subjected to Bending (1996) (0)
- Predicted Device-Degradation Failure-Rate (2015) (0)
- Buckling conditions for a dual-coated optical fiber (2013) (0)
- Predicted thermal stresses in a TSV design (2016) (0)
- Portable 2008 - Second ieee international interdisciplinary intersociety conference on pids (2008) (0)
- Interfacial stresses in a bi-material assembly subjected to external tensile forces and bending moments applied to the ends of one of its components (2009) (0)
- A View of Solution Procedures (1991) (0)
- The Variational and Energy Methods, and Some General Principles of Structural Analysis (1991) (0)
- Announcement of Optics 2020 (2019) (0)
- Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure (1997) (0)
- Fundamentals of Probabilistic Aerospace Electronics Reliability Engineering (2018) (0)
- Managing risk dormancy in multi-team work: application of time-dependent success-and-safety assurance methodology (2015) (0)
- Bow-free tri-component assembly for aerospace optoelectronics applications: Predicted thermal stresses (2015) (0)
- Low-cycle-fatigue failures of solder material in electronic products: Analytical modeling enables to explain, predict and possibly prevent them (2018) (0)
- “Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures (1997) (0)
- 7th International Conference on Physical and Theoretical Chemistry (2020) (0)
- Braking power required for safe landing: Probabilistic approach (2021) (0)
- Response of a flexible printed circuit board to periodic shock loads applied to its support loads applied to tis support contour (1992) (0)
- 複数のICデバイスが埋め込まれ,2つの異なる絶縁金属基板(IMS’)間に挟まれた電力コア(PC):熱応力の予測 (2016) (0)
- Avoiding inelastic strains in solder joint interconnections of space electronics (2022) (0)
- Two Men in a Cockpit (2018) (0)
- Design for Reliability of Electronic Materials and Systems (2020) (0)
- Shock Protection of Portable Electronic Devices Using a “Cushion” of an Array of Wires (AOW) (2011) (0)
- General Properties of Elastic Bodies (1991) (0)
- Maritime Orbital Strategic Superiority using Artificial Intelligence Capacity Building (MOS2AIC-B) (2020) (0)
- Reliability of Solder Joint Interconnections in Thermally Matched Assemblies (1998) (0)
- Shock test methods and test standards for electronic devices (2011) (0)
- Predicted static fatigue (delayed fracture) lifetime of a fiber optic test specimen: application of analytical modeling technique (2018) (0)
- Photovoltaic reliability engineering: quantification testing and probabilistic-design-reliability concept (2013) (0)
- Publisher's Note: “Thermal properties of carbon nanotube array used for integrated circuit cooling” [J. Appl. Phys.100, 074302 (2006)] (2006) (0)
- Bending of Beams (1991) (0)
- For How Long Should Effective Burn-in Testing Last? (2019) (0)
- Probabilistic Fitts' law and the likelihood of the Tunguska type of event (2023) (0)
- Editorial: Composite solder joints (2022) (0)
- Thermal stress in an optical silica fiber embedded (soldered) into silicon (2017) (0)
- Closure to “Discussion of ‘Stresses in Bi-Metal Thermostats’” (1987, ASME J. Appl. Mech., 54, p. 479) (1987) (0)
- The “Miracle-on-the-Hudson” Event: Quantitative Aftermath (2018) (0)
- Injection-coupled devices (ICDs): Operation principle, applications, design-for-reliability (2014) (0)
- Deformations in stretched surface mounted ceramic strips for sensor applications (2011) (0)
- Bending of Frames (1991) (0)
- How accurate should sight distance measurements be? (2021) (0)
- Bow-Free Electronic Assembly: Predicted Stresses in Its Components and Embedded Devices (2016) (0)
- Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs (1997) (0)
- Young Scientist Awards at Optics 2020 for the best researches in Lasers, Optics and Photonics (2019) (0)
- RUSSIAN STRENGTH STANDARDS FOR COMMERCIAL SHIPS (1982) (0)
- ミラー状パッケージ設計におけるボールグリッドアレイ(BGA)とカラムグリッドアレイ(CGA)相互接続における応力の予測 (2016) (0)
- Quantifying surgeon's performance: probabilistic approach. (2022) (0)
- Young Research Forum-Young Scientist Awards: Neonatal Congress 2020, Singapore, June 11-12, 2020 (2019) (0)
- コラムグリッドアレイ(CGA)対ボールグリッドアレイ(BGA):基板レベル落下試験とはんだ材料の予想動的応力 (2016) (0)
- Market Analysis of Optics 2020 (2019) (0)
- Predictive modeling sheds useful light on burn-in testing (BIT): Brief review and recent extension (2022) (0)
- 58 th ECTC ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE May 27 - May 30, 2008 (2008) (0)
- Laser Diodes, Optoeelectronic Devices and Heterogeneous Integration (2003) (0)
- Boltzmann-Arrhenius-Zhurkov equation and its applications in electronics-and-photonics reliability physics problems (2020) (0)
- Bending of Plates (1991) (0)
- Burn-in-Testing (BIT) Challenge: to BIT or not to BIT? (2021) (0)
- “Automatized” Peel Testing: Calculated Stresses and Deflections in the Film (1989) (0)
- Probabilistic Human-System-Integration (HSI) Models: Review and Extension (2021) (0)
- Young Researchers Awards: Young Scientist Awards and Best Poster Awards at Physics Conference (2020) (0)
- Reliability of an Electronic Product Fabricated of Mass-Produced Components (2018) (0)
- Two-Dimensional Problem in Rectangular Coordinates (1991) (0)
- Past Conference for Applied Physics 2020 (2020) (0)
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What Schools Are Affiliated With Ephraim Suhir?
Ephraim Suhir is affiliated with the following schools:
