Gary S. May
#16,028
Most Influential Person Now
American academic
Gary S. May's AcademicInfluence.com Rankings
Gary S. Mayengineering Degrees
Engineering
#567
World Rank
#936
Historical Rank
#249
USA Rank
Electrical Engineering
#127
World Rank
#145
Historical Rank
#60
USA Rank
Applied Physics
#3622
World Rank
#3741
Historical Rank
#444
USA Rank
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Engineering
Gary S. May's Degrees
- Bachelors Electrical Engineering Georgia Tech
- Masters Electrical Engineering Georgia Tech
- PhD Electrical Engineering Georgia Tech
Why Is Gary S. May Influential?
(Suggest an Edit or Addition)According to Wikipedia, Gary Stephen May is the chancellor of the University of California, Davis. From May 2005 to June 2011, he was the Steve W. Chaddick School Chair of the School of Electrical & Computer Engineering at Georgia Tech. He served as the Dean of the Georgia Tech College of Engineering from July 2011 until June 2017.
Gary S. May's Published Works
Published Works
- A 60-GHz Active Receiving Switched-Beam Antenna Array With Integrated Butler Matrix and GaAs Amplifiers (2012) (63)
- Modeling and sensitivity analysis of circuit parameters for flip-chip interconnects using neural networks (2005) (28)
- A comparison of statistically-based and neural network models of plasma etch behavior (1992) (21)
- Intrinsic transconductance extraction for deep-submicrometer MOSFETs (1989) (16)
- Heterogeneous Interconnect Stitching Technology With Compressible MicroInterconnects for Dense Multi-Die Integration (2017) (16)
- Passive circuit model parameter extraction using genetic algorithms (1999) (15)
- High-aspect ratio through-silicon vias for the integration of microfluidic cooling with 3D microsystems (2015) (14)
- Modeling and optimization of multilayer LTCC inductors for RF/wireless applications using neural network and genetic algorithms (2004) (13)
- Extraction of Passive Device Model Parameters Using Genetic Algorithms (2000) (13)
- Neurogenetic design centering (2006) (12)
- Low-Loss Air-Isolated Through-Silicon Vias for Silicon Interposers (2016) (12)
- Modeling and analysis of 3-D solenoid embedded inductors (2002) (12)
- Effect of doping on the reliability of GaAs multiple quantum well avalanche photodiodes (1997) (10)
- Performance and hot-electron reliability of deep-submicron MOSFET's (1987) (10)
- Recipe synthesis for PECVD SiO/sub 2/ films using neural networks and genetic algorithms (1996) (9)
- Modeling of via formation by photosensitive dielectric materials for MCM applications (1997) (8)
- Modeling and optimization of integral capacitor fabrication using neural networks (2000) (8)
- Modelling and optimization of multilayer RF passives using coupled neural networks and genetic algorithms (2004) (8)
- Endpoint Detection in Low Open Area TSV Fabrication Using Optical Emission Spectroscopy (2014) (8)
- Millimeter wave RF front end design using neuro-genetic algorithms (2005) (8)
- High-Frequency Analysis of Embedded Microfluidic Cooling within 3-D ICs Using a TSV Testbed (2016) (7)
- Impact of On-Chip Interconnect on the Performance of 3-D Integrated Circuits With Through-Silicon Vias: Part II (2016) (7)
- Neuro-genetic design centering of millimeter wave oscillators (2006) (7)
- Heterogeneous Multi-Die Stitching Enabled by Fine-Pitch and Multi-Height Compressible Mircointerconnects (CMIs) (2018) (7)
- Parametric manufacturing yield modeling of GaAs/AlGaAs multiple quantum well avalanche photodiodes (1999) (6)
- Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes (2017) (6)
- BEOL-Embedded 3D Polylithic Integration: Thermal and Interconnection Considerations (2020) (6)
- Analysis of Signal Propagation Through TSVs Within Distilled Water for Liquid-Cooled Microsystems (2016) (5)
- Heterogeneous Integrated Microsystems With Nontraditional Through-Silicon Via Technologies (2017) (5)
- Statistical analysis of embedded capacitors using Monte Carlo simulation (2000) (5)
- Statistical Modeling of 3‐D Parallel‐Plate Embedded Capacitors Using Monte Carlo Simulation (2001) (5)
- LCP Characterization of Broadband RF Performance With Consideration of Fabrication Tolerances for CSLP Substrate Suitability (2013) (4)
- Designing Surface Chemistry of Silver Nanocrystals for Radio Frequency Circuit Applications. (2018) (4)
- Neural network modeling of the resistance of metallized vias formed by laser ablation in polymer dielectrics (2003) (4)
- Microfabrication, Coil Characterization, and Hermetic Packaging of Millimeter-Sized Free-Floating Neural Probes (2021) (4)
- Silicon interposer platform with low-loss through-silicon vias using air (2015) (4)
- TSVs embedded in a microfluidic heat sink: High-frequency characterization and thermal modeling (2016) (4)
- Fabrication and Characterization of Electrical Interconnects and Microfluidic Cooling for 3D ICS With Silicon Interposer (2016) (4)
- Modeling ceramic filled polymer integrated capacitor formation using neural networks (1999) (4)
- Hands-on module packaging education at Georgia Tech (2002) (4)
- Electrical Circuit Modeling and Validation of Through-Silicon Vias Embedded in a Silicon Microfluidic Pin-Fin Heat Sink Filled With Deionized Water (2020) (4)
- An automated meniscus coating system for polymer deposition on large-area MCM-D and MCM-L substrates (2000) (4)
- Reliability assessment of multiple quantum well avalanche photodiodes (1995) (3)
- High-aspect ratio through-silicon vias for the integration of micro fl uidic cooling with 3 D microsystems (2015) (3)
- A neural network model for sensitivity analysis of circuit parameters for flip chip interconnects (2003) (3)
- Yield prediction of acoustic charge transport transversal filters (1993) (3)
- An automated workcell for meniscus coating on 24-in packaging substrates (2001) (3)
- Monolithic Microfluidic Cooling of a Heterogeneous 2.5-D FPGA With Low-Profile 3-D Printed Manifolds (2021) (2)
- Novel photodefined polymer-clad through-silicon via technology integrated with endpoint detection using optical emission spectroscopy (2013) (2)
- Teaching electronics packaging using interactive multimedia (1998) (2)
- Investigation of 3-D embedded inductors using Monte Carlo analysis (2002) (2)
- Design and Development of an Integrated MEMS Sensor for Real Time Control of Plasma Etching (2003) (2)
- Design Considerations, Demonstration, and Benchmarking of Silicon Microcold Plate and Monolithic Microfluidic Cooling for 2.5D ICs (2021) (2)
- Novel modeling and layout optimization technique for highly compact planar bandpass filters on LCP (2004) (2)
- Monolithic-like heterogeneously integrated microsystems using dense low-loss interconnects (2017) (1)
- Thermal Isolation and Cooling Technologies for Heterogeneous 3D‐ and 2.5D‐ICs (2019) (1)
- Endpoint detection using optical emission spectroscopy in TSV fabrication (2013) (1)
- High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating (2019) (1)
- Design rule development for electrical modeling of RF multilayer packaging inductors (2003) (1)
- In-situ prediction of RIE time to completion using neural networks (1994) (1)
- The "virtual" cleanroom: microelectronics processing education through interactive multimedia (1995) (1)
- Preliminary study of As-for-Sb exchange for device applications (2003) (0)
- Heterogeneous Multi-Die Stitching Enabled by Fine-Pitch & Multi-Height Compressible MicroInterconnects (CMIs) (2019) (0)
- Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs (2021) (0)
- Evaluating the manufacturability of GaAs/AlGaAs multiple quantum well avalanche photodiodes using neural networks (1997) (0)
- Mechatronics toward development of a fully automated meniscus coating system (2004) (0)
- Low-cost, high throughput, large area meniscus coating for MCM-D and MCM-L substrates (2000) (0)
- ng Optical Emission Spectroscopy in (2013) (0)
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What Schools Are Affiliated With Gary S. May?
Gary S. May is affiliated with the following schools: