Ha Duong Ngo
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Computer Science
Why Is Ha Duong Ngo Influential?
(Suggest an Edit or Addition)According to Wikipedia, Ha Duong Ngo is an academician, research scholar in the field of Electrical Engineering/Microsystems Engineering. As the professor at the University of Applied Sciences Berlin and PI researcher of Microsensors technology at Fraunhofer Institute IZM Berlin, Professor Ngo initiated the research on surface micromachined actuators in microoptical applications, on SOI- and SiC-devices for use in extreme conditions and on rGO for biosensing.
Ha Duong Ngo's Published Works
Number of citations in a given year to any of this author's works
Total number of citations to an author for the works they published in a given year. This highlights publication of the most important work(s) by the author
Published Works
- Tuning Piezo ion channels to detect molecular-scale movements relevant for fine touch (2014) (207)
- A second generation MEMS surface fence sensor for high resolution wall shear stress measurement (2004) (36)
- A micro surface fence probe for the application in flow reversal areas (2002) (25)
- Plasma Etching of Tapered Features in Silicon for MEMS and Wafer Level Packaging Applications (2006) (23)
- Design and simulation of ultra high sensitive piezoresistive MEMS sensor with structured membrane for low pressure applications (2010) (23)
- Advanced Liquid-Free, Piezoresistive, SOI-Based Pressure Sensors for Measurements in Harsh Environments (2015) (19)
- SOI-based, High Reliable Pressure Sensor with Floating Concept for High Temperature Applications☆ (2014) (18)
- Liquid-free, piezoresistive, SOI-based pressure sensor for high temperature measurements up to 400 °C (2012) (13)
- Corner rounding to strengthen silicon pressure sensors using DRIE (2008) (13)
- Tapered Through-Silicon-Via Interconnects for Wafer-Level Packaging of Sensor Devices (2010) (12)
- Aeromems pressure sensor array featuring through-wafer vias for high-resolution wall pressure measurements (2008) (9)
- Embedding of wearable electronics into smart sensor insole (2016) (9)
- A MEMS surface fence sensor for wall shear stress measurement in turbulent flow areas (2001) (9)
- Real-Time Impedance Monitoring of Epithelial Cultures with Inkjet-Printed Interdigitated-Electrode Sensors (2020) (9)
- Wafer Level Packaging Technology for Optical Imaging Sensors (2009) (8)
- Design and Application of a High-G Piezoresistive Acceleration Sensor for High-Impact Application (2018) (8)
- Development and Characterization of a Novel Low-Cost Water-Level and Water Quality Monitoring Sensor by Using Enhanced Screen Printing Technology with PEDOT:PSS (2020) (7)
- Recent Advances and Challenges of Nanomaterials-Based Hydrogen Sensors (2021) (7)
- Piezoresistive Pressure Sensors for Applications in Harsh Environments—A Roadmap (2018) (7)
- Measurement of Young’s modulus and residual stress of thin SiC layers for MEMS high temperature applications (2012) (7)
- Mechanical Properties of Individual Composite Poly(methyl-methacrylate) -Multiwalled Carbon Nanotubes Nanofibers (2014) (6)
- A Novel Low Cost Wireless Incontinence Sensor System (Screen-Printed Flexible Sensor System) for Wireless Urine Detection in Incontinence Materials (2018) (6)
- Electrical Characterization of Low Temperature PECVD Oxides for TSV Applications (2018) (5)
- Investigation of Deep Dry Etching of 4H SIC Material for MEMS Applications Using DOE Modelling (2021) (4)
- A WSi–WSiN–Pt Metallization Scheme for Silicon Carbide-Based High Temperature Microsystems (2016) (4)
- Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects (2011) (4)
- Simulation And Electrical Characterization Of A Novel 2D-Printed Incontinence Sensor With Conductive Polymer PEDOT:PSS For Medical Applications (2018) (4)
- The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications (2017) (4)
- Design, Fabrication and Testing of Silicon-integrated Li-ion Secondary Micro Batteries with Side-by-Side Electrodes (2013) (4)
- MEMS sensor with giant piezoresistive effect using metall-semiconductor hybrid structure (2011) (4)
- Characterization of anodic bondable LTCC for wafer-level packaging (2016) (4)
- An advanced MEMS sensor packaging concept for use in harsh environments (2013) (4)
- Design of dual-frequency piezoelectric MEMS microphones for wind tunnel testing (2022) (3)
- Quasi one dimensional transport in individual electrospun composite nanofibers (2014) (3)
- Piezoresistive 4H-Silicon Carbide (SiC) pressure sensor (2021) (3)
- Design and modeling of a novel piezoresistive microphone for aero acoustic measurements in laminar boundary layers using FEM and LEM (2022) (3)
- Copper filling of TSVs for interposer applications (2012) (3)
- Dual-Rotor Electromagnetic-Based Energy Harvesting System for Smart Home Applications (2021) (3)
- Fabrication of High Voltage Capable TSV Using Backside via Last Process and Laser Abblation of Dry Film BCB (2019) (3)
- Development and fabrication of a very High-g sensor for very high impact applications (2016) (2)
- Investigation and Modeling of Etching Through Silicon Carbide Vias (TSiCV) for SiC Interposer and Deep SiC Etching for Harsh Environment MEMS by DoE (2022) (2)
- Investigation of Etching SIC VIAS for High Power Elctronics and Harsh Enviornment Mems (2020) (2)
- High-Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications (2019) (2)
- Editorial for the Special Issue on MEMS Accelerometers (2019) (2)
- Zero Bias Anomaly in an Individual Suspended Electrospun Nanofiber (2014) (2)
- Investigation of IDC Structures for Graphene Based Biosensors Using Low Frequency EIS Method (2019) (1)
- Measurement of Young’s modulus and residual stress of thin SiC layers for MEMS high temperature applications (2011) (1)
- Development of a Novel High Reliable Si-Based Trace Humidity Sensor Array for Aerospace and Process Industry (2016) (1)
- Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies (2019) (1)
- Evaluation and Signal Conditioning of Piezoresistive Silicon Pressure Sensor (2014) (1)
- Low Stress Solution of Anodic Bonding Technology with SW-YY® Glass for Sensitive MEMS (2018) (1)
- HIPIMS in full face erosion circular cathode for semiconductor applications (2015) (1)
- Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design (2016) (1)
- MEMS pressure sensor with maximum performances by using novel back-side direct-exposure concept featuring through glass vias (2013) (1)
- Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor (2017) (1)
- High Density Flex and Thin Chip Embedding Technology for Polymeric Interposer and Sensor Packaging Applications (2019) (1)
- Packaging solution for a novel silicon-based trace humidity sensor using coulometric method (2016) (1)
- Aero Acoustic MEMS Microphone Integration in Ultra-Thin and Flexible Substrate (2022) (0)
- A method for measuring topographic structures on components (2004) (0)
- A Novel Piezoresitive Microphone MEMS Sensor For Aerospace Applications (2022) (0)
- Platinum interconnections for harsh environment applications using atmospheric pressure sputtering (2022) (0)
- Design and Simulation of Optical Interfaces for Photonic Integrated System-in-Package (2011) (0)
- Mems Mass Flow Controller for Liquid Fuel Supply to HCCI-Driven Engine (2019) (0)
- Wireless Pressure Sensor System (2014) (0)
- Development of a PVDF Piezo-Film Sensor Array for Unsteady Wall-Pressure Measurements in a Turbulent SBLI (2022) (0)
- Semiconductor pressure sensor and method for its preparation (2008) (0)
- Thermal design of a tristable electromagnetic linear microactuator with high displacement and low actuation force for mass storage applications (2013) (0)
- D4.2 - Investigation of DRIE etching performance on signal quality of a SOI based pressure sensors for harsh environments (2015) (0)
- Development, simulation and characterization of a novel incontinence sensor system using 2D-printing technology with conductive polymer PEDOT:PSS (2021) (0)
- Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection (2019) (0)
- 4th International Conference on Structural NanoComposites (NANOSTRUC2018) (2019) (0)
- Abstract book for the proceedings of the 4th International conference on structural nano composites (NANOSTRUC 2018), 23-24 May 2018, Berlin, Germany. (2018) (0)
- Quantum Capacitance Transient Phenomena in High-K dielectric Armchair Graphene Nanoribbon Field-Effect Transistor Model (2021) (0)
- Plasma enhanced atomic layer deposition by means of an Anode Layer Ion Source for electronics packaging applications (2015) (0)
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