Madhavan Swaminathan
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Madhavan Swaminathanengineering Degrees
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Madhavan Swaminathancomputer-science Degrees
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Computational Linguistics
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Engineering Computer Science
Madhavan Swaminathan's Degrees
- PhD Computer Science Stanford University
- Masters Electrical Engineering Stanford University
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Why Is Madhavan Swaminathan Influential?
(Suggest an Edit or Addition)According to Wikipedia, Madhavan Swaminathan is the John Pippin Chair in Electromagnetics in the School of Electrical and Computer Engineering and Director of the Center for Co-Design of Chip, Package, System, Georgia Institute of Technology.
Madhavan Swaminathan's Published Works
Number of citations in a given year to any of this author's works
Total number of citations to an author for the works they published in a given year. This highlights publication of the most important work(s) by the author
Published Works
- Power Integrity Modeling and Design for Semiconductors and Systems (2007) (281)
- Power distribution networks for system-on-package: status and challenges (2004) (250)
- Modeling and transient simulation of planes in electronic packages (2000) (159)
- The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade (2004) (154)
- Modeling of irregular shaped power distribution planes using transmission matrix method (2001) (143)
- Electrical modeling of Through Silicon and Package Vias (2009) (128)
- Designing and Modeling for Power Integrity (2010) (124)
- Modeling of simultaneous switching noise in high speed systems (2001) (119)
- Electromagnetic Modeling of Through-Silicon Via (TSV) Interconnections Using Cylindrical Modal Basis Functions (2010) (106)
- Impact of power-supply noise on timing in high-frequency microprocessors (2002) (102)
- Rigorous Electrical Modeling of Through Silicon Vias (TSVs) With MOS Capacitance Effects (2011) (96)
- A novel electromagnetic bandgap (EBG) structure for mixed-signal system applications (2004) (91)
- Electrical-Thermal Co-Simulation of 3D Integrated Systems With Micro-Fluidic Cooling and Joule Heating Effects (2011) (88)
- Multilayered Finite-Difference Method (MFDM) for Modeling of Package and Printed Circuit Board Planes (2007) (86)
- A Global Bayesian Optimization Algorithm and Its Application to Integrated System Design (2018) (75)
- Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias (2011) (73)
- Modeling of multilayered power distribution planes using transmission matrix method (2002) (73)
- Computation of cutoff wavenumbers of TE and TM modes in waveguides of arbitrary cross sections using a surface integral formulation (1990) (71)
- High-Dimensional Global Optimization Method for High-Frequency Electronic Design (2019) (70)
- On-Chip Power-Grid Simulation Using Latency Insertion Method (2008) (69)
- Impact of power-supply noise on timing in high-frequency microprocessors (2004) (67)
- Macromodeling of nonlinear digital I/O drivers (2006) (65)
- Construction of broadband passive macromodels from frequency data for simulation of distributed interconnect networks (2004) (63)
- Statistical signal integrity analysis and diagnosis methodology for high-speed systems (2004) (60)
- Modeling and analysis of power distribution networks for gigabit applications (2003) (52)
- Transient Analysis of CMOS-Gate-Driven $RLGC$ Interconnects Based on FDTD (2011) (52)
- A digitally adjustable resistor for path delay characterization in high-frequency microprocessors (2001) (48)
- Development of model libraries for embedded passives using network synthesis (2000) (47)
- Causality enforcement in transient simulation of passive networks through delay extraction (2005) (46)
- Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems (2017) (46)
- Finite-difference modeling of noise coupling between power/ground planes in multilayered packages and boards (2006) (45)
- Design of embedded passive components in Low-Temperature Cofired Ceramic on Metal (LTCC-M) technology (1998) (44)
- Magneto-Dielectric Nanocomposite for Antenna Miniaturization and SAR Reduction (2016) (44)
- Transient Chip-Package Cosimulation of Multiscale Structures Using the Laguerre-FDTD Scheme (2009) (43)
- Design of integrated low noise amplifiers (LNA) using embedded passives in organic substrates (2004) (41)
- Machine Learning and Uncertainty Quantification for Surrogate Models of Integrated Devices With a Large Number of Parameters (2019) (41)
- A Novel Compact Electromagnetic Bandgap Structure in Power Plane for Wideband Noise Suppression and Low Radiation (2011) (40)
- Do we need wide flits in Networks-on-Chip? (2013) (40)
- Design of High Efficiency Integrated Voltage Regulators with Embedded Magnetic Core Inductors (2016) (40)
- Characterization of embedded passives using macromodels in LTCC technology (1998) (39)
- A New Self-Healing Methodology for RF Amplifier Circuits Based on Oscillation Principles (2009) (39)
- Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems (2011) (39)
- Modeling of power supply noise in large chips using the circuit-based finite-difference time-domain method (2005) (38)
- Antenna miniaturization using magneto-dielectric substrates (2009) (38)
- Noise Isolation in Mixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure-Based Power Distribution Network (PDN) (2010) (37)
- Book review: Design and modeling for 3D ICs and interposers (2013) (36)
- A multi-PLL clock distribution architecture for gigascale integration (2001) (36)
- Decoupling Capacitor Placement in Power Delivery Networks Using MFEM (2011) (36)
- Design of inductors in organic substrates for 1-3 GHz wireless applications (2002) (36)
- Size reduction of electromagnetic bandgap (EBG) structures with new geometries and materials (2006) (35)
- Power transmission lines: A new interconnect design to eliminate simultaneous switching noise (2008) (35)
- A methodology for the placement and optimization of decoupling capacitors for gigahertz systems [CMOS VLSI] (2000) (34)
- Efficient construction of two-port passive macromodels for resonant networks (2001) (34)
- Isolation in mixed-signal systems using a novel electromagnetic bandgap (EBG) structure (2004) (33)
- Transient Analysis of TSV Equivalent Circuit Considering Nonlinear MOS Capacitance Effects (2015) (33)
- Mid frequency decoupling using embedded decoupling capacitors (2005) (32)
- Layout-level synthesis of RF inductors and filters in LCP substrates for Wi-Fi applications (2005) (31)
- Liquid crystalline polymer (LCP) based lumped-element bandpass filters for multiple wireless applications (2004) (31)
- A novel self-healing methodology for RF Amplifier circuits based on oscillation principles (2012) (31)
- Architecture, Chip, and Package Co-design Flow for 2.5D IC Design Enabling Heterogeneous IP Reuse (2019) (31)
- Design, Modeling, and Characterization of Embedded Capacitor Networks for Core Decoupling in the Package (2007) (30)
- Design tradeoffs among MCM-C, MCM-D and MCM-D/C technologies (1993) (30)
- Stopband Analysis Using Dispersion Diagram for Two-Dimensional Electromagnetic Bandgap Structures in Printed Circuit Boards (2006) (30)
- Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules (2013) (30)
- Noise computation in single chip packages (1996) (30)
- Analytical Stability Condition of the Latency Insertion Method for Nonuniform GLC Circuits (2008) (29)
- Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions (2009) (29)
- Modeling and simulation of core switching noise for ASICs (2002) (27)
- Noise reduction and design methodology in mixed-signal systems with alternating impedance electromagnetic bandgap (AI-EBG) structure (2005) (27)
- Electrical–Thermal Cosimulation With Nonconformal Domain Decomposition Method for Multiscale 3-D Integrated Systems (2014) (27)
- A Laguerre-FDTD Formulation for Frequency-Dependent Dispersive Materials (2011) (27)
- Measurement of dielectric anisotropy of BPDA-PDA polyimide in multilayer thin-film packages (1994) (27)
- Design and demonstration of low cost, panel-based polycrystalline silicon interposer with through-package-vias (TPVs) (2011) (26)
- Constant Current Power Transmission Line-Based Power Delivery Network for Single-Ended Signaling (2011) (26)
- Design of embedded high Q-inductors in MCM-L technology (2001) (26)
- Macro-modeling of non-linear I/O drivers using spline functions and finite time difference approximation (2003) (26)
- Magnetic nanocomposites for organic compatible miniaturized antennas and inductors (2005) (25)
- A novel low-cost approach to MCM interconnect test (1995) (25)
- Demystifying Machine Learning for Signal and Power Integrity Problems in Packaging (2020) (25)
- Electrical modeling of annular and co-axial TSVs considering MOS capacitance effects (2009) (24)
- Design and fabrication of integrated RF modules in liquid crystalline polymer (LCP) substrates (2005) (24)
- Novel nanomagnetic materials for high-frequency RF applications (2011) (24)
- A Rigorous Model for Through-Silicon Vias With Ohmic Contact in Silicon Interposer (2013) (24)
- RF Characterization of Magnetodielectric Material Using Cavity Perturbation Technique (2015) (24)
- High-Q Embedded Passives on Large Panel Multilayer Liquid Crystalline Polymer-Based Substrate (2007) (24)
- Surface Roughness Modeling of Substrate Integrated Waveguide in D-Band (2016) (23)
- Improvements in Noise Suppression for I/O Circuits Using Embedded Planar Capacitors (2008) (23)
- Automatic package and board decoupling capacitor placement using genetic algorithms and M-FDM (2008) (23)
- High performance spiral inductors embedded on organic substrates for SOP applications (2002) (23)
- Electrical-thermal co-analysis for power delivery networks in 3D system integration (2009) (22)
- Accurate Transient Simulation of Interconnects Characterized by Band-Limited Data With Propagation Delay Enforcement in a Modified Nodal Analysis Framework (2008) (22)
- Air-Gap Transmission Lines on Organic Substrates for Low-Loss Interconnects (2007) (22)
- Stopband prediction with dispersion diagram for electromagnetic bandgap structures in printed circuit boards (2006) (22)
- Liquid crystalline polymer based RF/wireless components for multi-band applications (2004) (21)
- A novel test technique for MCM substrates (1997) (20)
- Determination of propagation constants of transmission lines using 1-port TDR measurements (2002) (20)
- Characterization of Next Generation Thin Low-K and Low-Loss Organic Dielectrics From 1 to 110 GHz (2010) (20)
- Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications (2007) (20)
- A novel synthesis method for designing electromagnetic band gap (EBG) structures in packaged mixed signal systems (2006) (20)
- Parameter extraction and electrical characterization of high density connector using time domain measurements (1999) (20)
- Enhancing Signal and Power Integrity Using Double Sided Silicon Interposer (2011) (20)
- Integral equation solution for analyzing scattering from one-dimensional periodic coated strips (1993) (19)
- Fault Detection and Automated Fault Diagnosis for Embedded Integrated Electrical Passives (1998) (19)
- Modeling of field penetration through planes in multilayered packages (2001) (18)
- Cobalt–Polymer Nanocomposite Dielectrics for Miniaturized Antennas (2014) (18)
- Processing and Dielectric Properties of Nanocomposite Thin Film “Supercapacitors” for High-Frequency Embedded Decoupling (2007) (18)
- Achieving near zero SSN power delivery networks by eliminating power planes and using constant current power transmission lines (2009) (18)
- Polarization mode basis functions for modeling insulator-coated through-silicon via (TSV) interconnections (2009) (18)
- Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data Communications (2020) (18)
- Conformal Antennas on Liquid Crystalline Polymer Based Rigid-Flex Substrates Integrated With the Front-End Module (2009) (18)
- Modeling of Through-Silicon Via (TSV) Interposer Considering Depletion Capacitance and Substrate Layer Thickness Effects (2015) (17)
- Iterative built-in testing and tuning of mixed-signal/RF systems (2009) (17)
- Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias (2020) (17)
- On the micro-architectural impact of clock distribution using multiple PLLs (2001) (17)
- Effect of substrate resistivity on switching noise in on-chip power distribution networks (2003) (17)
- Electromagnetic modeling of non-uniform through-silicon via (TSV) interconnections (2012) (17)
- Analysis and Design of Electromagnetic Bandgap (EBG) Structures for Power Plane Isolation Using 2D Dispersion Diagrams and Scalability (2006) (17)
- Design, modeling, and characterization of embedded electromagnetic band gap (EBG) structure (2008) (16)
- Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications (2020) (16)
- Embedded decoupling capacitor performance in high speed circuits (2005) (16)
- Self-Calibrating Embedded RF Down-Conversion Mixers (2009) (16)
- A Bayesian Framework for Optimizing Interconnects in High-Speed Channels (2018) (16)
- A low-cost approach to high-k thinfilm decoupling capacitors on silicon and glass interposers (2012) (15)
- Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse (2020) (15)
- Efficient Modeling of Package Power Delivery Networks with Fringing Fields and Gap Coupling in Mixed Signal Systems (2006) (15)
- Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics (2014) (15)
- Preconditioned Second-Order Multi-Point Passive Model Reduction for Electromagnetic Simulations (2010) (15)
- Modeling of multi-layered power distribution planes including via effects using transmission matrix method (2002) (15)
- Design and Characterization of Inductors for Self-Powered IoT Edge Devices (2018) (15)
- Characterization of ABF/Glass/ABF Substrates for mmWave Applications (2021) (15)
- Miniaturization of Electromagnetic Bandgap (EBG) Structures with High-Permeability Magnetic Metal Sheet (2007) (15)
- Finite difference modeling of multiple planes in packages (2006) (15)
- Skin-Effect-Incorporated Transient Simulation Using the Laguerre-FDTD Scheme (2013) (15)
- Multi-Physics Modeling and Characterization of Components on Flexible Substrates (2019) (14)
- Computation of TM and TE modes in waveguides based on a surface integral formulation (1992) (14)
- Electrical design of wafer level package on board for gigabit data transmission (2003) (14)
- Electromagnetic Band Gap Synthesis Using Genetic Algorithms for Mixed Signal Applications (2009) (14)
- Machine-Learning Approach for Design of Nanomagnetic-Based Antennas (2017) (14)
- Design, modeling and characterization of embedded capacitor networks for mid-frequency decoupling in semiconductor systems (2005) (14)
- Power Delivery for High-Performance Microprocessors—Challenges, Solutions, and Future Trends (2021) (14)
- Enhancement of signal integrity and power integrity with embedded capacitors in high-speed packages (2006) (14)
- A new approach to power integrity with thinfilm capacitors in 3D IPAC functional module (2013) (14)
- Next generation of 100-/spl mu/m-pitch wafer-level packaging and assembly for systems-on-package (2004) (14)
- Development of high-k embedded capacitors on printed wiring board using sol-gel and foil-transfer processes (2004) (14)
- Simultaneous switching noise suppression using hydrothermal barium titanate thin film capacitors (2004) (14)
- Electrical–thermal modeling of through‐silicon via (TSV) arrays in interposer (2013) (14)
- Use of the finite element method for the modeling of multi-layered power/ground planes with small features (2009) (14)
- Simulation of power delivery networks with Joule heating effects for 3D integration (2010) (14)
- Volume/surface formulation for analyzing scattering from coated periodic strips (1994) (13)
- Polymers for RF Apps (2011) (13)
- Do chip size limits exist for DCA (1999) (13)
- Fabrication, Characterization and Comparison of FR4-Compatible Composite Magnetic Materials for High Efficiency Integrated Voltage Regulators with Embedded Magnetic Core Micro-Inductors (2017) (13)
- Design of multiband baluns on liquid crystalline polymer (LCP) based substrates (2004) (13)
- An effective modeling method for multi-scale and multilayered power/ground plane structures (2011) (13)
- Machine Learning Driven Advanced Packaging and Miniaturization of IoT for Wireless Power Transfer Solutions (2018) (13)
- DesignCon 2012 Electrical Design and Modeling Challenges for 3 D System Integration (2011) (13)
- Repeater Insertion to Reduce Delay and Power in Copper and Carbon Nanotube-Based Nanointerconnects (2019) (13)
- A multiple frequency signal generator for 802.11a/b/g VoWLAN type applications using organic packaging technology (2004) (13)
- Analysis and design of compact wideband baluns on multilayer liquid crystalline polymer (LCP) based substrates (2005) (13)
- Eye-Pattern Design for High-Speed Differential Links Using Extended Passive Equalization (2008) (13)
- 1 Nanomagnetic Materials and Structures , and their Applicationsin Integrated RF and Power Modules (2015) (12)
- Bayesian Active Learning for Uncertainty Quantification of High Speed Channel Signaling (2018) (12)
- Modeling of power distribution networks with retardation using the transmission matrix method (2004) (12)
- System level signal and power integrity analysis methodology for system-in-package applications (2006) (12)
- Pseudo-balanced signaling using power transmission lines for parallel links (2011) (12)
- A Spectral Convolutional Net for Co-Optimization of Integrated Voltage Regulators and Embedded Inductors (2019) (12)
- 3D transient thermal solver using non-conformal domain decomposition approach (2012) (12)
- Fabrication, characterization and comparison of composite magnetic materials for high efficiency integrated voltage regulators with embedded magnetic core micro-inductors (2017) (12)
- Thin-Film High-Rejection Filter Integration in Low-Loss Organic Substrate (2011) (11)
- Modeling of multilayered packages and boards using modal decomposition and finite difference methods (2006) (11)
- Preliminary application of machine-learning techniques for thermal-electrical parameter optimization in 3-D IC (2016) (11)
- Design Exploration of Package-Embedded Inductors for High-Efficiency Integrated Voltage Regulators (2019) (11)
- Electromagnetic interference (EMI) issues for mixed-signal system-on-package (SOP) (2004) (11)
- Investigation of surface roughness effects for D-band SIW transmission lines on LCP substrate (2017) (11)
- Causal and Passive Parameterization of S-Parameters Using Neural Networks (2020) (11)
- Simulation of lossy package transmission lines using extracted data from one-port TDR measurements and nonphysical RLGC models (2005) (11)
- Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration (2009) (11)
- Utilization of fast algorithm to analyze embedded passive components using commercial EM solvers (1997) (11)
- Conformal Antennas on Liquid Crystalline Polymer Substrates for Consumer Applications (2007) (11)
- Noise induced jitter in differential signaling (2008) (11)
- Computationally Efficient Power Integrity Simulation for System-on-Package Applications (2007) (11)
- DC IR drop solver for large scale 3D power delivery networks (2010) (11)
- Signal and Power Integrity Co-Simulation for Multi-layered System on Package Modules (2007) (10)
- Transient Simulation of Multiscale Structures Using the Nonconformal Domain Decomposition Laguerre-FDTD Method (2015) (10)
- System-Level Thermal Modeling Using Nonconformal Domain Decomposition and Model-Order Reduction (2014) (10)
- Fast EM/Circuit Transient Simulation Using Laguerre Equivalent Circuit (SLeEC) (2009) (10)
- Recent advances in electromagnetic compatibility of 3D-ICs — Part II (2016) (10)
- W-band and D-band Transmission Lines on Glass Based Substrates for Sub-THz Modules (2020) (10)
- Modeling and analysis of SSN in silicon and glass interposers for 3D systems (2012) (10)
- Extraction of S-Parameters from TDR/TDT Measurements using Rational Functions (2000) (10)
- A low cost method for testing integrated RF substrates (2008) (10)
- Correlation of PDN impedance with jitter and voltage margin for high speed channels (2008) (10)
- Fabrication of package embedded spiral inductors with two magnetic layers for flexible SIP point of load converters in Internet of Everything devices (2018) (10)
- Fast electrical-thermal co-simulation using multigrid method for 3D integration (2012) (10)
- Modeling of Voltage-Controlled Oscillators Including I/O Behavior Using Augmented Neural Networks (2019) (10)
- A Novel Method for Testing Integrated RF Substrates (2007) (10)
- Modeling of Signal and Power Integrity in System on Package Applications (2007) (10)
- Causal Transient Simulation of Systems Characterized by Frequency-Domain Data in a Modified Nodal Analysis Framework (2006) (9)
- Characterization of Co-Planar Silicon Transmission Lines With and Without Slow-Wave Effect (2004) (9)
- Modeling and design of system-in-package integrated voltage regulator with thermal effects (2016) (9)
- Calibration of near field measurements using microstrip line for noise predictions (2004) (9)
- A Survey of Test Techniques for MCM Substrates (1997) (9)
- Delay extraction from frequency domain data for causal macro-modeling of passive networks (2005) (9)
- FDFD Modeling of Signal Paths With TSVs in Silicon Interposer (2014) (9)
- Liquid Crystal Polymer-Based Planar Lumped Component Dual-Band Filters For Dual-Band WLAN Systems (2007) (9)
- A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical Performance (2007) (9)
- 3D integration and characterization of high Q passives on multilayer liquid crystalline polymer (M-LCP) based substrate (2005) (9)
- Application of a New Power Distribution Scheme for Complex Printed Circuit Boards for High-Speed Signaling (2015) (9)
- A Design Technique for Embedded Electromagnetic Band Gap Structure in Load Board Applications (2012) (9)
- Filter integration in ultra thin organic substrate via 3D stitched capacitor (2009) (9)
- Synthesis and diagnosis of RF filters in liquid crystalline polymer (LCP) substrate (2005) (8)
- Statistical analysis and diagnosis methodology for RF circuits in LCP substrates (2005) (8)
- Recent advances in electromagnetic compatibility of 3D-ICs &2013; Part I (2015) (8)
- Reliability of Nano-Structured Nickel Interconnections Replacing FlipChip Solder Assembly without Underfill (2007) (8)
- Inverse Design of Transmission Lines with Deep Learning (2019) (8)
- Low-Noise Power Delivery Network Design Using Power Transmission Line for Mixed-Signal Testing (2011) (8)
- Heterogeneous Integration of 5G and Millimeter-Wave Diplexers with 3D Glass Substrates (2020) (8)
- Process Design Kit and Design Automation for Flexible Hybrid Electronics (2019) (8)
- A Nonlinear Behavioral Modeling Approach for Voltage-controlled Oscillators Using Augmented Neural Networks (2018) (8)
- Dynamic Thermal Management for 3-D ICs With Time-Dependent Power Map Using Microchannel Cooling and Machine Learning (2019) (8)
- New power delivery scheme for 3D ICs to minimize simultaneous switching noise for high speed I/Os (2012) (8)
- Causal Transient Simulation of Passive Networks with Fast Convolution (2006) (8)
- Behavioral Modeling of Tunable I/O Drivers With Preemphasis Including Power Supply Noise (2020) (8)
- Efficient statistical analysis and diagnosis of high speed source synchronous interfaces (2002) (8)
- Consideration of MOS capacitance effect in TSV modeling based on cylindrical modal basis functions (2012) (8)
- Modeling of power supply noise using efficient macro-model of non-linear driver (2004) (8)
- Innovative Sub-5- $\mu$ m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects (2019) (8)
- Chip-package codesign of integrated voltage-controlled oscillator in LCP substrate (2006) (8)
- Near field and far field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications (2005) (8)
- Enhancement of Laguerre-FDTD with Initial Conditions for Fast Transient EM/Circuit Simulation (2007) (8)
- Large-body-sized Glass-based Active Interposer for High-Performance Computing (2020) (8)
- Overcoming Limitations of Laguerre-FDTD for Fast Time-domain EM Simulation (2007) (8)
- Antennas in Glass Interposer For sub-THz Applications (2021) (7)
- Low-Loss Impedance-Matched Sub-25-μm Vias in 3-D Millimeter-Wave Packages (2020) (7)
- Nanomagnetics for High-Performance, Miniaturized Power, and RF Components [Nanopackaging] (2012) (7)
- Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission (2004) (7)
- Analysis, Design, and Prototyping of Temperature Resilient Clock Distribution Networks for 3-D ICs (2015) (7)
- Electromagnetic modelling of switching noise in on-chip power distribution networks (2003) (7)
- Fast memory-efficient full-wave 3D simulation of power planes (2009) (7)
- Printed monopole antennas with increased bandwidth and gain for wi-fi applications (2007) (7)
- Dielectric Constant and Loss Tangent Characterization of Thin High-K Dielectrics Using Corner-to-Corner Plane Probing (2006) (7)
- Extraction of electrical properties of nanomagnetic materials through meander-shaped inductor and inverted-F antenna structures (2012) (7)
- A Passive Equalizer Design for Shielded Differential Through-Silicon Vias in 3-D IC (2018) (7)
- Importance of damping and resonance in thin-film integrated decoupling capacitor design (1997) (7)
- Integration of thin film passive circuits using high/low dielectric constant materials (1997) (7)
- Enabling antenna design with nano-magnetic materials using machine learning (2015) (7)
- Causal Modeling and Extraction of Dielectric Constant and Loss Tangent for Thin Dielectrics (2007) (7)
- Design, simulation and measurement techniques for embedded decoupling capacitors in multi-GHz packages/PCBs (2005) (7)
- Coupling noise analysis and high frequency design optimization of power/ground plane stack-up in embedded chip substrate cavities (2008) (7)
- Constant Voltage-Based Power Delivery Scheme for 3-D ICs and Interposers (2013) (7)
- Extraction of current signatures for simulation of simultaneous switching noise in high speed digital systems (2003) (7)
- Wireless power transfer integrated board for low power IoT applications (2017) (7)
- Preliminary Application of Deep Learning to Design Space Exploration (2018) (7)
- Constant current Power Transmission Line based power delivery network for single-ended signaling with reduced simultaneous switching noise (2011) (7)
- Determining worst-case eye height in low BER channels using Bayesian optimization (2020) (7)
- Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects (2008) (7)
- Analysis for Signal and Power Integrity Using the Multilayered Finite Difference Method (2007) (7)
- System-on-a-package (SOP) module development for a digital, RF and optical mixed signal integrated system (2004) (7)
- Low-Cost Specification Based Testing of RF Amplifier Circuits using Oscillation Principles (2010) (7)
- Study of Electrical and Mechanical Characteristics of Inkjet-Printed Patch Antenna Under Uniaxial and Biaxial Bending (2019) (7)
- Pseudo-balanced Signaling Using Power Transmission Lines for Parallel I/O Links (2013) (6)
- Behavioral Modeling of Steady-State Oscillators with Buffers Using Neural Networks (2018) (6)
- System-on-a-package (SOP) substrate and module with digital, RF and optical integration (2004) (6)
- Electrical Characterization and Design Optimization of Embedded Chip in Substrate Cavities (2007) (6)
- Macromodeling of nonlinear driver and receiver circuits (2005) (6)
- Dielectric anisotropy of BPDA-PDA polyimide and its effect on electrical characteristics of interconnects (1993) (6)
- Measurement problems in high-speed networks (2001) (6)
- Fast FDTD simulation of multiscale 3D models using laguerre-MNA (2007) (6)
- A compact third-order 5 GHz bandpass filter with enhanced stopband characteristics in ultra thin organic substrate (2010) (6)
- Optimization of 3D stack for electrical and thermal integrity (2013) (6)
- Design of SIW Filters in D-band Using Invertible Neural Nets (2020) (6)
- Design of High-Speed Links via a Machine Learning Surrogate Model for the Inverse Problem (2019) (6)
- Accurate analysis of CMOS inverter driving transmission line based on FDTD (2009) (6)
- Fast FDTD Simulation Using Laguerre Polynomials in MNA Framework (2007) (6)
- Magneto-dielectric material characterization and antenna design for RF applications (2014) (6)
- Modeling and Performance Analysis of Shielded Differential Annular Through-Silicon Via (SD-ATSV) for 3-D ICs (2018) (6)
- Uncertainty quantification of SiP based integrated voltage regulator (2018) (6)
- Skin effect modeling of interconnects using the Laguerre-FDTD scheme (2012) (6)
- A low-cost test approach for embedded RF passive circuits (2008) (6)
- Smaller Microvias for Packaging Interconnects by Picosecond UV Laser With a Nanometer Metal Barrier Layer: A Feasibility Study (2020) (6)
- Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates (2005) (6)
- Optimal clock distribution with an array of phase-locked loops for multiprocessor chips (2001) (6)
- A low-cost approach for testing embedded rf passive circuits based on oscillation principle (2008) (6)
- Magnetic Core Solenoid Power Inductors on Organic Substrate for System-in-Package Integrated High-Frequency Voltage Regulators (2020) (6)
- Statistical Analysis of the Efficiency of an Integrated Voltage Regulator by means of a Machine Learning Model Coupled with Kriging Regression (2019) (6)
- Heterogeneous integration for artificial intelligence: Challenges and opportunities (2019) (6)
- A method for creating behavioral models of oscillators using augmented neural networks (2017) (6)
- Modeling and simulation of core switching noise on a package and board (2001) (6)
- Mechanical and High-Frequency Electrical Study of Printed, Flexible Antenna Under Deformation (2020) (6)
- Modeling of power supply noise in large chips with nonlinear circuits (2002) (6)
- A path finding based SI design methodology for 3D integration (2014) (6)
- High frequency characteristics of nanocomposite thin film "supercapacitors" and their suitability for embedded decoupling (2004) (6)
- Black-box optimization of 3D integrated systems using machine learning (2017) (6)
- Integration of carbon nanotube films with SRRs for air quality sensing applications (2014) (6)
- Design and Demonstration of Single and Coupled Embedded Toroidal Inductors for 48V to 1V Integrated Voltage Regulators (2020) (6)
- Noise suppression in ultra wide band (UWB) applications using alternating impedance electromagnetic bandgap (AI-EBG) structures (2005) (6)
- Cylindrical Conduction Mode Basis Functions for Modeling of Inductive Couplings in System-in-Package (SiP) (2007) (6)
- Module placement for power supply noise and wire congestion avoidance in 3D packaging (2004) (6)
- Measurement, Modeling and Characterization of Embedded Capacitors for Power Delivery in the Mid-Frequency Range (2005) (5)
- Design of a dual frequency oscillator for simultaneous multi-band radio communication on a multi-layer liquid crystalline polymer substrate (2006) (5)
- Timing analysis for thermally robust clock distribution network design for 3D ICs (2013) (5)
- Efficient Simulation of Power/Ground Planes for SiP Applications (2007) (5)
- Characterization of Chip-to-Package Interconnects for Glass Panel Embedding (GPE) for Sub-THz Wireless Communications (2021) (5)
- Reinforcement Learning for the Optimization of Decoupling Capacitors in Power Delivery Networks (2021) (5)
- Impedance Response Extrapolation of Power Delivery Networks using Recurrent Neural Networks (2019) (5)
- Flexible and Ultra-Thin Glass Substrates for RF Applications (2021) (5)
- Macro-modeling of non-linear pre-emphasis differential driver circuits (2005) (5)
- Simulation of switching noise in on-chip power distribution networks of FPGAs (2005) (5)
- Effect of EBG Structures for Reducing Noise in Multi-Layer PCBs for Digital Systems (2006) (5)
- Low-Cost One-Port Approach for Testing Integrated RF Substrates (2008) (5)
- Design of power delivery networks using power transmission lines and pseudo-balanced signaling for multiple I/Os (2011) (5)
- Choosing the Right Number of Basis Functions in Multiscale Transient Simulation Using Laguerre Polynomials (2007) (5)
- Characterization of alternate power distribution methods for 3D integration (2014) (5)
- A Compact Passive Equalizer Design for Differential Channels in TSV-Based 3-D ICs (2018) (5)
- A Triple Balanced Mixer in Multi-layer Liquid Crystalline Polymer (LCP) Substrate (2007) (5)
- Macro-modeling of transistor level receiver circuits (2004) (5)
- Automated Generation of All-Digital 1/0 Library Cells for System-In-Package Integration of Multiple Dies (2018) (5)
- Advances in High Performance RDL Technologies for Enabling IO Density of 500 IOs/mm/layer and 8-μm IO Pitch Using Low-k Dielectrics (2020) (5)
- RF substrates yield improvement using package-chip co-design and on-chip calibration (2010) (5)
- Near zero SSN power delivery networks using Constant Voltage Power Transmission Lines (2009) (5)
- A Simple Technique for Power Distribution With Better Characteristics Than Electromagnetic Bandgap Structures (2015) (5)
- Laminated Glass-Based, Compact Inline Stepped-Impedance Resonator Bandpass Filters for 5G New Radio Modules (2021) (5)
- Analysis of Embedded Package Capacitors for High Performance Components (2006) (5)
- A study of reduced-terminal models for system-level SSO noise analysis (2010) (5)
- Modeling of EBG Structures Using the Transmission Matrix Method (2006) (5)
- Advanced Low Loss Dielectric Material Reliability and Filter Characteristics at High Frequency for mmWave Applications (2020) (5)
- High-density low-loss millimeter-wave package interconnects with the impact of dielectric-material surface roughness (2021) (5)
- I/O Decoupling in High Speed Packages Using Embedded Planar Capacitors (2007) (5)
- Electrical design of an MCM package for a multi-processor digital system (1995) (5)
- Minimizing simultaneous switching noise at reduced power with constant-voltage power transmission lines for high-speed signaling (2013) (5)
- Analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure by transmission line network method (2005) (5)
- Wideband electrical modeling of large three-dimensional interconnects using accelerated generation of partial impedances with cylindrical conduction mode basis functions (2008) (5)
- Analysis on the miniaturization of reactive impedance surfaces with magneto-dielectrics (2009) (5)
- Analysis of Parameter Variability in an Integrated Wireless Power Transfer System via Partial Least-Squares Regression (2020) (4)
- Cointegration of Single-Mode Waveguides and Embedded Electrical Interconnects for High-Bandwidth Communications (2020) (4)
- Implementation of power transmission lines to field programmable gate array ICs for managing signal and power integrity (2013) (4)
- Compact Electromagnetic Bandgap structure for noise suppression in power plane (2008) (4)
- Worst-Case Eye Analysis of High-Speed Channels Based on Bayesian Optimization (2021) (4)
- A New Approach for Magneto-Static Hysteresis Behavioral Modeling (2016) (4)
- A Hybrid Methodology for Jitter and Eye Estimation in High-Speed Serial Channels Using Polynomial Chaos Surrogate Models (2019) (4)
- Antenna-Integrated, Die-Embedded Glass Package for 6G Wireless Applications (2022) (4)
- 3D Glass-Based Panel-Level Package with Antenna and Low-Loss Interconnects for Millimeter-Wave 5G Applications (2019) (4)
- Electrical Circuit Modeling and Validation of Through-Silicon Vias Embedded in a Silicon Microfluidic Pin-Fin Heat Sink Filled With Deionized Water (2020) (4)
- Power integrity/signal integrity co-simulation for fast design closure (2005) (4)
- Enhancing the Bandwidth of Low-Dropout Regulators Using Power Transmission Lines for High-Speed I/Os (2017) (4)
- Reduction of PDN induced coupling into signal lines using PTL power distribution (2015) (4)
- Multi-physics Modeling Characterization of Aerosol Jet Printed Transmission Lines (2018) (4)
- Enforcing Causality and Passivity of Neural Network Models of Broadband S-Parameters (2019) (4)
- Optimal sequencing energy allocation for CMOS integrated systems (2002) (4)
- RF design methodology for design-cycle-time reduction using parameterization of embedded passives on multilayer organic substrates (2008) (4)
- Exploring the limits of low cost, organics-compatible high-k ceramic thin films for embedded decoupling applications (2005) (4)
- 2008 IEEE electrical performance of electronic packaging suppression of vertical coupling using Electromagnetic Band Gap structures (2008) (4)
- Automated I/O Library Generation for Interposer-Based System-in-Package Integration of Multiple Heterogeneous Dies (2020) (4)
- Magneto-dielectric characterization and antenna design (2014) (4)
- Practical aspects of modeling apertures for signal and power integrity co-simulation (2011) (4)
- Parallel computation of electromagnetic scattering from arbitrary structures (1989) (4)
- Synthesis of Equivalent Circuits for Two-Port Integral Passive Components (1999) (4)
- Noise suppression in ultra wide band (UWB) applications using alternating impedance electromagnetic bandgap (AI-EBG) structures (2005) (4)
- Memory efficient Laguerre-FDTD scheme for dispersive media (2013) (4)
- A low-cost test method for embedded RF passive circuits using two-tone input signals (2009) (4)
- Comparison between Chebyshev and power series expansion functions for interpolating data (2001) (4)
- Integrated and Miniaturized Quasi Yagi D-Band Antenna in Glass Interposer (2022) (4)
- RF Wireless Power Transfer Using Integrated Inductor (2019) (4)
- Low-frequency test method for integrated RF substrates (2009) (4)
- Self-correcting, self-testing circuits and systems for post-manufacturing yield improvement (2011) (4)
- Open and Closed Loop Inductors for High-Efficiency System-on-Package Integrated Voltage Regulators (2019) (4)
- Minimizing the number of basis functions in chip-package co-simulation using lauerre-FDTD (2011) (4)
- Statistical modeling of a multi-drop source synchronous bus (2002) (4)
- Simulation of Eye-Diagrams on Lossy Transmission Lines using Extracted Data from 1-port TDR Measurements (2002) (4)
- High resolution and low-cost test technique for unpopulated MCM substrate (1996) (4)
- Design, Modeling and Characterization of Embedded Capacitors for Decoupling Applications (2010) (4)
- Design of quasi-lumped element diplexers for multiple wireless applications using liquid crystalline polymer (LCP) based substrates (2004) (4)
- Extraction of noise current signatures using wavelets in packaged digital systems (2005) (4)
- Broadband Modeling and Tuning of Multi-layer RF Circuits using Physical Augmentation Methodology (2007) (4)
- Chip-package co-simulation with multiscale structures (2008) (4)
- Design Flow for Active Interposer-Based 2.5-D ICs and Study of RISC-V Architecture With Secure NoC (2020) (4)
- New microstrip-to-CPS transition for millimeter-wave application (2011) (3)
- Behavioral Modeling of Tunable I/O Drivers with Pre-emphasis Using Neural Networks (2019) (3)
- Layout-level synthesis of RF bandpass filter on organic substrates for wi-fi applications (2004) (3)
- Modeling of Power/Ground Planes Using Triangular Elements (2014) (3)
- Compact Electromagnetic Bandgap Structures for Power Plane Isolation Using High-K Dielectrics - Best Paper Award Finalist in Board-Level Design Category (2007) (3)
- Wavelet based nonparametric regression approach for de-noising and modeling of transient switching noise measurements (2003) (3)
- A System-in-Package Based Energy Harvesting for IoT Devices with Integrated Voltage Regulators and Embedded Inductors (2018) (3)
- Modeling of Power Supply Noise with Non-Linear Drivers using Recurrent Neural Network (RNN) Models (2005) (3)
- Demonstration of a High-Inductance, High-Density, and Low DC Resistance Compact Embedded Toroidal Inductor for IVR (2021) (3)
- Design and implementations of RF systems and sub-systems in LCP-type multilayer technology (2006) (3)
- Accelerated frequency domain analysis by susceptance-element based model order reduction of 3D full-wave equations (2009) (3)
- Comparison of Collaborative versus Extended Artificial Neural Networks for PDN Design (2020) (3)
- Temperature-aware power distribution network designs for 3D ICs and systems (2015) (3)
- Design of Integrated Low Noise Amplifiers (LNA) (2004) (3)
- Model-order estimation and reduction of distributed interconnects via improved vector fitting (2005) (3)
- An integrated double balanced mixer on multilayer liquid crystalline polymer (M-LCP) based substrate (2005) (3)
- Inverse Design of Power Delivery Networks using Invertible Neural Networks (2021) (3)
- Multi-layer fringe-field augmentations for the efficient modeling of package power planes (2008) (3)
- Substrate Integrated Waveguides in Glass Interposers for mm Wave Applications (2021) (3)
- Measurement-based modeling and test methodology for integrated substrates (2002) (3)
- RX Equalization for a High-Speed Channel based on Bayesian Active Learning using Dropout (2020) (3)
- Eye-Pattern Improvement for Design of High-Speed Differential Links Using Passive Equalization (2006) (3)
- Low-Frequency and Low-Cost Test Methodology for Integrated RF Substrates (2010) (3)
- Do chip size limits exist for DCA? (1999) (3)
- Switching Noise Suppression in Mixed Signal System Applications Using Electromagnetic Band Gap (EBG) Synthesizer (2006) (3)
- Electrical and thermal analysis for design exchange formats in three dimensional integrated circuits (2013) (3)
- Scalable driver I/O macromodels for statistical analysis (2005) (3)
- Spectral domain technique using surface wave excitation for the analysis of interconnects (1994) (3)
- Glass Panel Packaging, as the Most Leading-Edge Packaging: Technologies and Applications (2020) (3)
- Surface integral formulation for calculating conductor and dielectric losses of various transmission structures (1995) (3)
- Extraction of frequency dependent transmission line parameters using TDR/TDT measurements (2001) (3)
- Polynomial Chaos modeling for jitter estimation in high-speed links (2018) (3)
- Miniaturization of Planar Packaged Inductor Using NiZn and Low Cost Screen Printing Technique (2017) (3)
- Extraction of material properties for low-K and low-loss dielectrics using cavity resonator and efficient finite difference solver up to 40GHz (2008) (3)
- Impact of interconnects on the optimal power-performance tradeoff for clock distribution in microprocessors (2000) (3)
- Electromagnetic simulation of 3D stacked ICs: Full model vs. S-parameter cascaded based model (2014) (3)
- Simple Equivalent Circuit Model of a Stripline in Inhomogeneous Dielectric Media (2009) (3)
- An alternate power distribution scheme with superior noise suppression characteristics than EBG (2014) (3)
- Design Space and Frequency Extrapolation: Using Neural Networks (2021) (3)
- Design and applications of high Q passive devices on multilayered liquid crystalline polymer based substrates for handset applications (2005) (3)
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- FDFD Nonconformal Domain Decomposition Method for the Electromagnetic Modeling of Interconnections in Silicon Interposer (2015) (2)
- Design, Fabrication, and Characterization of Package Embedded Solenoidal Magnetic Core Inductors for High-Efficiency System-In-Package Integrated Voltage Regulators (2019) (2)
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- On the Design of Energy-Efficient I/O Circuits for Interposer-based 2.5D System-in-Package (2018) (2)
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- A Modified Polynomial Chaos Modeling Approach for Uncertainty Quantification (2019) (0)
- Load-Board/PCB Noise Suppression via Electromagnetic Band Gap Power Plane Patterning (2008) (0)
- 2D Spectral Transposed Convolutional Neural Network for S-Parameter Predictions (2022) (0)
- CONDUCTOR LOSS IN EOLLW WAVEGUIDES USING A SURFACE INTEGRAL, FORHULATION (1991) (0)
- ANovelMethodforTesting Integrated RFSubstrates (2007) (0)
- Frequency domain measurements of VSPA: a novel packaging technology (1995) (0)
- Modeling of power supply noise in FPGA (2004) (0)
- Robust method for analysis of power distribution networks (2015) (0)
- Chip-Package Co-Design Methodology for Integrated RF Microsystems (2001) (0)
- Dielectric Constant andLossTangent Characterization ofThinDielectrics UsingaRapidSolver (2007) (0)
- Inverse Design of Embedded Inductor with Hierarchical Invertible Neural Transport Net (2022) (0)
- Design and Characterization of Package-Embedded Solenoidal Magnetic Core Inductors for High-Frequency and High-Efficiency SIP Integrated Voltage Regulators (2021) (0)
- Invertible Neural Networks for Design of Broadband Active Mixers (2022) (0)
- Computation of Maximum Voltage Droop in Power Delivery Networks (2020) (0)
- An Integrated Double Balance Liquid Crystalline Polymer (M (2005) (0)
- Antenna Array on Glass Interposer for 6G Wireless Communications (2023) (0)
- Reinforcement Learning for the Optimization of Power Plane Designs in Power Delivery Networks (2022) (0)
- Analysis of Parameter Variability in Integrated Devices by Partial Least Squares Regression (2020) (0)
- Semi-Additive Patterning process based fabrication of miniaturized, package-embedded high conversion ratio inductors for DC-DC converters (2022) (0)
- Mini-special issue on Electrical Performance of Electronic Packaging (EPEP) - Guest editorial (2001) (0)
- Lossy frequency selective surfaces for gas sensing using ZnO films (2015) (0)
- Foreword contributions from the eighth topical meeting on electrical performance of electronic packaging (2000) (0)
- Simulation ofswitching noiseinon-chip powerdistribution networks ofFPGAs (2005) (0)
- Surface impedance implementation of high frequency conductor losses using susceptance element equivalent circuit model and model order reduction (2014) (0)
- Transient non-conformal domain decomposition using the Laguerre-FDTD method (2015) (0)
- Reduction of PDN induced coupling into signal lines using PTL power distribution (2016) (0)
- Polymer waveguide photonic interconnect for multichip communications-based heterogeneous integration (2022) (0)
- A novel miniaturized feedback LC oscillator for UMTS-type applications in 3D stacked liquid crystalline polymer technology: Research Articles (2006) (0)
- Multiphysics Challenges and Opportunities for Integrated Voltage Regulators in Power Delivery Architectures (2022) (0)
- Advanced polymers for advanced RF packaging applications (2010) (0)
- System-On-a-Package Technologies for Enabling Future Microsystems (2002) (0)
- A Critical Review of Lithography Methodologies and Impacts of Topography on 2.5-D/3-D Interposers (2023) (0)
- Reliability Assessment of Ultra-low-K dielectric Material and Demonstration in Advanced Interposers (2022) (0)
- A Knowledge Based Method for Optimization of Decoupling Capacitors in Power Delivery Networks (2022) (0)
- Placement and routing of RF embedded passive designs in LCP substrate (2007) (0)
- HIPR-RF Hetergeneous Integration for Parasitic Loss in RF Microsystems. (2021) (0)
- 2011 IEEE International ... ; 1 (2011) (0)
- Power Distribution, Return Path Discontinuities and Thermal Management (2013) (0)
- System Integration and Modeling Concepts (2013) (0)
- Reliability Modeling of Micro-vias in High-Density Redistribution Layers (2021) (0)
- Application of wavelets and generalized pencil-of-function method for the extraction of noise current spectrum and simulation of simultaneous switching noise (2004) (0)
- HilbertNet: A Probabilistic Machine Learning Framework for Frequency Response Extrapolation of Electromagnetic Structures (2022) (0)
- Electrical Characterization andDesign Optimization ofEmbeddedChipinSubstrate Cavities (2007) (0)
- Package Design and Measurements for Radar Emulator using Accelerators and Photonics (2022) (0)
- Ultra-Wide Bandwidth Substrate Integrated Waveguide Fed Vivaldi Antenna in D-Band Using Glass Interposer (2023) (0)
- Hybrid Active-Passive Beamforming for Scalable sub-Terahertz Antenna Array (2021) (0)
- Epoxy Resin with Metal Complex Additives for Improved Reliability of Epoxy-Copper Joint (2022) (0)
- Advanced Low Df Dry film Build-up Material on Glass panel for 5G application (2020) (0)
- Recent Advances in SOP Integration (2001) (0)
- Effect ofEBG Structures forReducing Noisein Multi-Layer PCBsforDigital Systems (2006) (0)
- Modeling methods for power/ground plane structures in electronic packages (2011) (0)
- Contributions from the seventh topical meeting on electrical performance of electronic packaging (1999) (0)
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