Márta Rencz | Academic Influence

Márta Rencz's AcademicInfluence.com Rankings

Márta Rencz

Engineering

#8104

World Rank

#9579

Historical Rank

Electrical Engineering

#2575

World Rank

#2701

Historical Rank

engineering Degrees

Download Badge

Engineering

Márta Rencz's Degrees

Bachelors Electrical Engineering Budapest University of Technology and Economics
Masters Electrical Engineering Budapest University of Technology and Economics
PhD Electrical Engineering Budapest University of Technology and Economics

Why Is Márta Rencz Influential?

(Suggest an Edit or Addition)

According to Wikipedia, Dr. Márta Rencz is an Electrical Engineer. She is a faculty member and former Head of Department at the Budapest University of Technology and Economics and a member of the Hungarian Academy of Sciences.

(See a Problem?)

Márta Rencz's Published Works

Number of citations in a given year to any of this author's works

Total number of citations to an author for the works they published in a given year. This highlights publication of the most important work(s) by the author

Published Works

CMOS sensors for on-line thermal monitoring of VLSI circuits (1997) (119)
Measuring partial thermal resistances in a heat-flow path (2002) (107)
Thermal dynamics and the time constant domain (2000) (100)
Electro-thermal and logi-thermal simulation of VLSI designs (1997) (99)
Thermal Measurement and Modeling of Multi-Die Packages (2006) (77)
Dynamic thermal multiport modeling of IC packages (2001) (73)
Structure function evaluation of stacked dies (2004) (72)
Studies on the nonlinearity effects in dynamic compact model generation of packages (2004) (69)
Determining partial thermal resistances with transient measurements, and using the method to detect die attach discontinuities (2002) (68)
Multi-domain simulation and measurement of power LED-s and power LED assemblies (2006) (61)
Increasing the accuracy of structure function based thermal material parameter measurements (2005) (49)
THERMAN: a thermal simulation tool for IC chips, microstructures and PW boards (2000) (46)
Thermal mapping with liquid crystal method (1996) (42)
An efficient thermal simulation tool for ICs, microsystem elements and MCMs: the μS-THERMANAL (1998) (41)
Electro-thermal simulation: a realization by simultaneous iteration (1997) (40)
New approaches in the transient thermal measurements (2000) (39)
Tracing the Thermal Behavior of ICs (1998) (39)
Recent progress of thermal interface material research - an overview (2008) (38)
High-aspect-ratio metal microchannel plates for microelectronic cooling applications (2010) (36)
New possibilities in the thermal evaluation, offered by transient testing (2003) (36)
CMOS temperature sensors and built-in test circuitry for thermal testing of ICs (1998) (32)
Increasing the accuracy of thermal transient measurements (2002) (30)
Thermal issues in stacked die packages (2005) (30)
Measurement and evaluation of thermal transients (2001) (30)
A New Monolithic Temperature Sensor: The Thermal Feedback Oscillator (1995) (29)
Multi-Domain Modelling of LEDs for Supporting Virtual Prototyping of Luminaires (2019) (29)
Design for thermal testability (DfTT) and a CMOS realization (1996) (27)
Cad And Foundries For Microsystems (1997) (25)
Short time die attach characterization of leds for in-line testing application (2006) (25)
Electro-thermal simulation for the prediction of chip operation within the package (2003) (24)
A thermal benchmark chip: design and applications (1998) (24)
Delphi4LED — from measurements to standardized multi-domain compact models of LED: A new European R&D project for predictive and efficient multi-domain modeling and simulation of LEDs at all integration levels along the SSL supply chain (2016) (23)
Thermal Monitoring of Self-Checking Systems (1998) (23)
New methods and supporting tools for the thermal transient testing of packages (2001) (22)
Studies on the heat removal features of stacked SOI structures with a dedicated field solver program (SUNRED) (1997) (21)
A procedure to correct the error in the structure function based thermal measuring methods (2004) (21)
Temperature dependent timing in standard cell designs (2012) (21)
Fast field solvers for thermal and electrostatic analysis (1998) (21)
Electro-thermal and Logi-thermal Simulators aimed at the Temperature-aware Design of Complex Integrated Circuits (2008) (20)
Characterization method for thermal interface materials imitating an in-situ environment (2012) (20)
Boundary condition independent dynamic compact models of packages and heat sinks from thermal transient measurements (2003) (20)
Luminaire Digital Design Flow with Multi-Domain Digital Twins of LEDs (2019) (20)
Realization of an electronically controlled thermal resistance (2000) (19)
A methodology for the generation of dynamic compact models of packages and heat sinks from thermal transient measurements (2003) (19)
A Methodology for the Co-Simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards (2007) (18)
Thermal investigations of ICs and microstructures (1997) (18)
Non-linearity issues in the dynamic compact model generation [package thermal modeling] (2003) (17)
New way for thermal transient testing [IC packaging] (1999) (17)
Towards design and validation of mixed-technology SOCs (2000) (17)
Thermal testing methods to increase system reliability (1997) (17)
Inclusion of RC compact models of packages into board level thermal simulation tools (2002) (16)
A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation (2001) (16)
Measurement based compact thermal model creation - accurate approach to neglect inaccurate TIM conductivity data (2011) (16)
Thermal monitoring and testing of electronic systems (1999) (16)
Image processing procedures for the thermal measurements (1999) (16)
Issues in junction-to-case thermal characterization of power packages with large surface area (2010) (16)
Thermal Transient Testing (1997) (16)
LED 3D thermal model calibration against measurement (2018) (15)
3D extension of the SUNRED field solver (1998) (15)
SUNRED: A Field Solver and Compact Model Generator Tool Based on Successive Node Reduction (1999) (15)
Electro-thermal co-simulation of ICs with runtime back-annotation capability (2010) (15)
A fast algorithm for the layout based electro-thermal simulation (2003) (15)
Testing Interface Thermal Resistance (2007) (15)
Die attach quality control of 3D stacked dies (2004) (14)
Cooling as a possible way to extend the usability of I/sub DDQ/ testing (1997) (14)
An alternative method for electro-thermal circuit simulation (1999) (14)
Heat-flux sensor to support transient thermal characterisation of IC packages (2004) (14)
THERMODEL: A Tool for Thermal Model Generation, and Application for MEMS (2001) (14)
Package Characterization: Simulations or Measurements? (2008) (14)
Failure prediction of IGBT modules based on power cycling tests (2013) (13)
A step forward in the transient thermal characterization of chips and packages (1999) (13)
Investigation of die-attach degradation using power cycling tests (2013) (13)
Thermal test and monitoring (1995) (12)
SUNRED: a new field solving approach (1999) (12)
Thermal Characterization and Compact Modeling of Stacked Die Packages (2006) (12)
Design issues of a multi-functional intelligent thermal test die (2001) (12)
Thermal characterization of a radial micro-channel cooling plate (2005) (12)
Thermal transient analysis of semiconductor device degradation in power cycling reliability tests with variable control strategies (2014) (12)
μS-THERMANAL: an efficient thermal simulation tool for microsystem elements and MCMs (1996) (12)
Requirements specification for multi-domain LED compact model development in Delphi4LED (2017) (12)
Creating temperature dependent Ni-MH battery models for low power mobile devices (2007) (12)
Cross-Verification of Thermal Characterization of a Microcooler (2005) (11)
Temperature change induced degradation of SiC MOSFET devices (2016) (11)
SISSSI-A tool for dynamic electro-thermal simulation of analog VLSI cells (1997) (11)
Accurate thermal characterization of power semiconductor packages by thermal simulation and measurements (2011) (11)
Measurement issues in LED characterization for Delphi4LED style combined electrical-optical-thermal LED modeling (2017) (10)
Comparison of different power cycling strategies for accelerated lifetime testing of power devices (2014) (10)
Comparison of two alternative junction temperature setting methods aimed for thermal and optical testing of high power LEDs (2017) (10)
Thermal transient characterization of pHEMT devices (2012) (10)
Short time die attach characterization of semiconductor devices (2007) (10)
Vibration combined high Temperature Cycle Tests for capacitive MEMS accelerometers (2007) (10)
DELPHI Style Compact Modeling of Stacked Die Packages (2007) (9)
Issues in testing advanced power semiconductor devices (2016) (9)
Delphi4LED - From measurements to standardized multi-domain compact models of Light Emitting Diodes (LED) (2016) (9)
Application results of a new thermal benchmark chip (1998) (9)
Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems (2002) (9)
Electro-thermal simulation of MEMS elements (2003) (9)
Design of a static TIM tester (2008) (9)
Design, manufacture and testing of a low-cost micro-channel cooling device (2004) (9)
Contactless thermal characterization of high temperature test chamber (2008) (9)
Structural analysis and modelling of packaged light emitting devices by thermal transient measurements at multiple boundaries (2018) (8)
Real-time heating and power characterization of cells in standard cell designs (2013) (8)
Experimental study of a radial micro-channel cooling plate (2005) (8)
Analysis of concurrent failure mechanisms in IGBT structures during active power cycling tests (2014) (8)
Geometric optimization of microreactor chambers to increase the homogeneity of the velocity field (2018) (8)
Algorithmic extension of thermal field solvers: time constant analysis (2000) (8)
Studies on the Possibilities of In-Line Die Attach Characterization of Semiconductor Devices (2007) (8)
Design issues of a low frequency low-pass filter for medical applications using CMOS technology (2007) (8)
An efficient method for the self-consistent electro-thermal simulation and its integration into a CAD framework (1996) (8)
LED Characterization Within the Delphi4LED Project (2018) (7)
Fast field solver programs for thermal and electrostatic analysis of microsystem elements (1997) (7)
Integrating on-chip temperature sensors into DfT schemes and BIST architectures (1997) (7)
Lifetime estimation of power electronics modules considering the target application (2015) (7)
A General CAD Concept And Design FrameworkArchitecture For Integrated Microsystems (1970) (7)
Method for in-situ reliability testing of TIM samples (2009) (7)
Design of a scalable multifunctional thermal test die with direct and boundary scan access for programmed excitation and data measurement (2000) (7)
Simulation based method to eliminate the effect of electrical transients from thermal transient measurements (2014) (7)
Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array (2007) (6)
New level of accuracy in TIM measurements (2011) (6)
A generic method for thermal multiport model generation of IC packages (2001) (6)
Testing the Die Attach Quality of 3D Stacked Dies (2004) (6)
Measuring interface thermal resistance values by transient testing (2002) (6)
EVALUATION ISSUES OF THERMAL MEASUREMENTS BASED ON THE STRUCTURE FUNCTIONS (2003) (6)
Comparison of JEDEC dynamic and static test methods for the thermal characterization of power LEDs (2012) (6)
Thermal characterization and modelling of lithium-based batteries at low ambient temperature (2008) (6)
An algorithm for the direct co-simulation of dynamic compact models of packages with the detailed thermal models of boards (2002) (6)
Electro-Thermal Simulation with the SISSI Package (1999) (6)
Reliability testing of TIM materials with thermal transient measurements (2009) (5)
A step forward in the transient thermal characterization of packages (1997) (5)
Thermal Characterization and Modeling of Stacked Die Packages (2005) (5)
High Resolution Temperature Dependent Timing Model in Digital Standard Cell Designs (2013) (5)
Microfluidic flow-through chambers for higher performance (2017) (5)
Comparison of Two Low-Power Electronic Interfaces for Capacitive Mems Sensors (2008) (5)
CAD framework concept for the design of integrated microsystems (1995) (5)
Thermal transient characterisation of the etching quality of micro electro mechanical systems (2009) (5)
New simulation approaches supporting temperature-aware design of digital ICs (2012) (5)
New hardware tools for the thermal transient testing of packages (2000) (5)
Design and test of MEMS (1999) (5)
Thermal monitoring of safety-critical integrated systems (1996) (5)
Microsystem design framework based on tool adaptations and library developments (1996) (5)
Friendly tools for the thermal simulation of power packages (2000) (5)
Proceedings on 10th International Workshop on THERMAL INVESTIGATIONS of ICs and Systems (THERMINIC 2004), 29 September - 1 October 2004, Sophia Antipolis, Côte d'Azur, France (2004) (5)
Logi-thermal simulation using high-resolution temperature dependent delay models (2013) (5)
Ni-MH battery modelling for ambient intelligence applications (2008) (5)
Co-simulation of dynamic compact models of packages with the detailed models of printed circuit boards (2002) (5)
Alternative technology used to manufacture semitransparent monocrystalline silicon solar cells (2013) (4)
Towards the CFD model of flow rate dependent enzyme-substrate reactions in nanoparticle filled flow microreactors (2018) (4)
THERMAL CHARACTERISATION OF A RADIAL-CHANNEL MICRO-COOLER PLATE (2005) (4)
Investigation and Modeling of the Magnetic Nanoparticle Aggregation with a Two-Phase CFD Model (2020) (4)
Improved power modeling in logi-thermal simulation (2011) (4)
Investigation and optimization of microfluidic flow-through chambers for homogeneous reaction space (2017) (4)
In situ thermal reliability testing methodology for novel thermal interface materials (2014) (4)
Packaging and Characterization of Silicon and SiC-based Power Inverter Module with Double Sided Cooling (2016) (4)
On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices (2020) (4)
New technology used to manufacture a simple semitransparent monocrystalline silicon solar cell (2012) (4)
A way for measuring the temperature transients of capacitors (2016) (4)
THERMODEL: a tool for thermal model generation and application for MEMS packages (2000) (4)
Package hermeticity testing with thermal transient measurements (2008) (4)
Thermal transient testing without a tester (1998) (4)
Thermal characterization of capacitors (2016) (4)
1 NEW WAY FOR THERMAL TRANSIENT TESTING (2003) (4)
Effect of power cycling parameters on predicted IGBT lifetime (2015) (4)
A novel method for fatigue testing of MEMS devices containing movable elements (2007) (4)
Increasing the accuracy of structure function based evaluation of thermal transient measurements (2004) (4)
Improving Attack Aggregation Methods Using Distributed Hash Tables (2012) (4)
An 8x8 thermopile based uncooled infrared sensor (2004) (3)
IDDQ Testing of Submicron CMOS—by Cooling? (2000) (3)
FPGA power model for minimizing the thermal dissipation (2008) (3)
Thermal evaluation and modeling of MEMS packages (2000) (3)
Test structure for thermal monitoring (1996) (3)
A novel approach of logi-thermal simulation methodology and implementation for ASIC designs (2010) (3)
Design and verification of an electrostatic MEMS simulator (2004) (3)
15th International Workshop on Thermal Investigations of ICs and Systems, Therminic 2009: Preface (2009) (3)
Applied design and analysis of microsystems (1996) (3)
Mission profile driven component design for adjusting product lifetime on system level (2015) (3)
The effect of heat treatment on spin-on oxide glasses in solar cell application (2013) (3)
Thermal monitoring through boundary-scan (1998) (3)
Acquiring real-time heating of cells in standard cell designs (2012) (3)
Aging tendencies of power MOSFETs — A reliability testing method combined with thermal performance monitoring (2016) (3)
Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements (2019) (3)
Simulating and monitoring the resonant frequency of MEMS for failure detection and prediction (2010) (3)
Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages (2000) (3)
Thermal behaviour of new crystalline semitransparent solar cell structure (2013) (3)
Proceedings on 9th International Workshop on THERMAL INVESTIGATIONS of ICs and Systems (THERMINIC 2003), 24-26 September 2003, Aix-en-Provence, France (2003) (3)
Transient thermal measurements for dynamic package modeling: new approaches (1998) (3)
Thermal test and monitoring [microelectronic structures] (1995) (3)
New accurate temperature dependent timing model in digital standard cell designs (2013) (3)
LED multiphysics modeling for “Industry 4.0”, an approach proposed by the Delphi 4LED European project (2018) (2)
Algorithmic and Modeling Aspects in the Electro-thermal Simulation of Thermally Operated Microsystems (2003) (2)
Investigation of the motion of magnetic nanoparticles in microfluidics with a micro domain model (2020) (2)
Modelling the magnetic nanoparticle filling procedure of flow-through microchambers (2018) (2)
Application of thermal transient testing for solar cell characterization (2012) (2)
An approach for an industrial method for the in-situ characterization of thermal interface materials (2010) (2)
Characterisation of the Etching Quality in Micro-Electro-Mechanical Systems by Thermal Transient Methodology (2007) (2)
Thermal resistance measurement of discrete capacitors (2015) (2)
Design for Micro a Nano Manufacture — The "PATENT-DfMM Network of Excellence: Modelling a Simulation Cluster (2006) (2)
Thermal Investigations of Microsystems (1996) (2)
Thermal characterisation of novel crystalline semitransparent solar cell (2011) (2)
Guest editorialThermal investigations of ICs and microstructures II (1998) (2)
Methods for the Separation of Failure Modes in Power-Cycling Tests of High-Power Transistor Modules Using Accurate Voltage Monitoring (2020) (1)
Thermal evaluation of the SIP9 package (1999) (1)
Packaging and thermal evaluation of thermally operated intelligent micropump unit (1999) (1)
International Workshop on Thermal Investigations of ICs and Microstructures (THERMINIC 1996) September 25-27, 1996, Budapest, Hungary: Special Issue of Microelectronics Journal (1997) (1)
An Alternative Method to Accurately Determine the Thermal Resistance of SiC MOSFET Structures with Discrete Diodes (2018) (1)
Numerical modelling of magnetic nanoparticle dynamics in microfluidic devices (2019) (1)
A Method for Thermal Model Generation of MEMS Packages (2000) (1)
Thermal transient testing of packages without a tester (1998) (1)
Design considerations to enhance thermal testability (2012) (1)
In-situ characterization of thermal interface materials (2010) (1)
Thermo-mechanical characterization and integrity checking of packages and movable-structures (2005) (1)
Accelerating the Thermal Transient Testing by a Novel Temperature Sensitive Parameter Calibration Method based on I-V Characteristic Measurement (2022) (1)
Trends in Thermal Management of Microcircuits (1996) (1)
Measurement-Based Multi-Domain Modeling of LEDs for “Industry 4.0” (2019) (1)
Issues of finding a proper golden-reference sample for TIM tester calibration (2013) (1)
Thermal behaviour modeling of enzymatic reactions in flow-through microchambers (2017) (1)
Joint international master in smart systems integration: University collaboration for improved education (2018) (1)
Assessment of the validity of multi-domain LED model parameters in a broad current and temperature range (2019) (1)
Advances in the thermal measurement and evaluation technics (1998) (1)
In-situ transient testing of thermal interface sheets and metal core boards in power switch assemblies (2017) (1)
Enhanced semitransparent monocrystalline silicon solar cell structure (2014) (1)
18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012: Preface (2012) (1)
Experiments on effective board thermal conductivity measurements (2000) (1)
Thermal simulation tools for microsystem elements (1998) (1)
An efficient reliability testing method combined with thermal performance monitoring (2017) (1)
Methodology for the Inline Die Attach Characterization of Power LEDs (2007) (1)
A Distributed Hash Table Assisted Intrusion Prevention System (2012) (1)
Engineering tool set for monolithic and hybrid microsystem design (1997) (1)
Possibilities of humidity sensing with thermal transient testing on porous structures (2008) (1)
Main goals and obtained results of the THERMINIC Project (1997) (1)
Thermal qualification of 3D stacked die packages (2004) (1)
Aging tendencies of power leds under different humidity conditions during thermal reliability testing (2015) (1)
Thermal and Electro-Thermal Modeling and Simulation Techniques for Multichip Modules. (1998) (1)
Separation of failure modes in short cycle time power cycling experiments (2014) (1)
Studying the influence of chip temperatures on timing integrity (2011) (1)
A Sophisticated Method for Static Testing of TIM (2009) (1)
Thermal investigation of monolithic structures (1997) (1)
CFD modelling of magnetic nanoparticle suspension in microfluidics (2019) (0)
CIRCUIT SIMULATION PROGRAM ORIENTED PHYSICAL MODELLING OF INTEGRATED CIRCUIT ELEMENTS. (1980) (0)
Joint International Master in Smart Systems Integrated Solutions (2021) (0)
Joint International Master in Smart Systems Integrated Solutions (2022) (0)
To the Special section constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC'15 (2016) (0)
5th International Workshop on THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES (THERMINIC 1999), October 3-6, 1999, ROME, Italy: Special Issue, Microelectronics Journal (1999) (0)
Thermal investigations of integrated circuits and systems, THERMINIC'16 (2011) (0)
The influence of the cycling parameters on the reliability test results of IGBTs (2017) (0)
Implementation of a Multi-domain LED Model and its Application for Optimized LED Luminaire Design (2019) (0)
Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2015) (2015) (0)
Effect of the trench depth on the linear mode capability of trench technology MOSFET-s (2015) (0)
To the special issue constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC'17 (2018) (0)
Thermal investigations of integrated circuits and systems at THERMINIC'02 (2003) (0)
3rd International Workshop on THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES (THERMINIC 1997), September 21-23, Cannes, "Côte d'Azur", France: , Volume (1998) (0)
Thermal transient testing alternatives for the characterisation of GaN HEMT power devices (2022) (0)
Tool and method for the theremal transient evaluation of packages (1999) (0)
Comparison of different models of magnetic nanoparticle aggregation in microchannels with magnetic field (2021) (0)
An Eecient Method for the Self-consistent Electro-thermal Simulation and Its Integration into a Cad Framework 1 (1996) (0)
Concepts for high throughput LED testing using high-speed optical transients of LEDs (2022) (0)
Thermally compensated intelligent irradiation sensor (2010) (0)
Structural and algorithmic questions of a platform independent electro-thermal simulator (1998) (0)
Simulation of the magnetic nanoparticle filling procedure of microchambers (2018) (0)
Extracting model parameters from thermal transient measurements for thermal stress simulation (2014) (0)
4th International Workshop on THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES (THERMINIC 1998) September 27-29,Cannes, "Côte d'Azur", France: Special Issue, Microelectronics Journal (1999) (0)
Constant frequency drive method for MEMS for improved failure detection (2015) (0)
From MEMS to the global simulation of SoCs (2000) (0)
Alternative technology used to manufacture semitransparent monocrystalline silicon solar cells (2013) (0)
LED based application design in an “Industry 4.0” approach: implementation as proposed by the Delphi4LED project (2018) (0)
3D packaging of a microsystem with special thermal constraints (1998) (0)
Proceedings on 8th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC 2002), 1-4 October 2002, Madrid, Spain (2002) (0)
Proceedings of the 18th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2016) (2016) (0)
Development of a platform independent electro-thermal simulator (2001) (0)
New tools and methods for the thermal transient testing of packages (2001) (0)
Non-destructive structural analysis of the heat conducting path in power electronics and solid state lighting by thermal transient testing (2017) (0)
Thermal transient testing of the quality of encapsulation (1996) (0)
On the Correction of the Effects of Electrical Transients in the Measured Thermal Transients (2021) (0)
Algorithmic and practical questions of electrothermal circuit simulation (1999) (0)
Foreword contributions from thermal investigations of ICs and systems (THERMINIC) (2002) (0)
solar cell structure (2014) (0)
Thermal characterization and of die packages (2005) (0)
Thermal qualification of 3D stacked die structures (2006) (0)
To the special issue from the selected papers of thermal investigations of integrated circuits and systems, THERMINIC'13 (2014) (0)
Thermal investigations of integrated circuits in systems at THERMINIC'05 (2007) (0)
Determination of the severity of thermal stress using model data calculated from thermal transient results (2014) (0)
CONTACTLESS THERMAL CHARACTERIZATION OF HIGH TEMPERATURE TEST (2008) (0)
Modeling of Light Emitting Device Populations in the Electrical, Thermal, and Optical Domain for Luminaire Design (2019) (0)
Studies With Transient Compact Models of Packages and Heat Sinks (2003) (0)
Thermal investigations of integrated circuits in systems at THERMINIC'11 (2013) (0)
Investigation of nonlinear thermal parameters of compound semiconductor devices (2013) (0)
Design of a multi-functional intelligent thermal test die (0)
To the special section constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC09 (2011) (0)
Foreword: Thermal investigations of integrated circuits and systems at THERMINIC'04 (2006) (0)
Design for Micro & Nano Manufacture — The "PATENT-DfMM Network of Excellence: Modelling & Simulation Cluster (2006) (0)
2nd International Workshop onTHERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES (THERMINIC 1996), September 25-27,Budapest Hungary: Special Issue, IEEE Transactions on VLSI Systems (1997) (0)
Compact dynamic thermal multiport models of packages for MEMS-package cosimulation (2001) (0)
Thermal investigations of integrated circuits in systems at THERMINIC'07 (2009) (0)
Suggestions for Extending the Scope of the Transient Dual Interface Method (2021) (0)
Collection of Papers Presented at the 13th International Workshop on THERMal INvestigation of ICs and Systems (2007) (0)
Proceedings on 11th International Workshop on THERMAL INVESTIGATIONS of ICs and Systems (THERMINIC 2005), 27 - 30 September 2005, Belgirate, Lake Maggiore, Italy (2005) (0)
Determination of the Complex Thermal Characteristics of Discrete Power Devices and Power Modules (2019) (0)
Modelling , manufacture and test of a microchannel cooling plate for microelectronics packaging (2004) (0)
THERmal Investigations of ICs and Systems (THERMINIC'07) (2007) (0)
Contactless Thermal Characterization Method of PCB-s Using Different IR Sensor Arrays (2007) (0)
17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011: Preface (2008) (0)

This paper list is powered by the following services:

Other Resources About Márta Rencz

en.wikipedia.org

What Schools Are Affiliated With Márta Rencz?

Márta Rencz is affiliated with the following schools:

Budapest University of Technology and Economics