Pradeep Lall
#155,885
Most Influential Person Now
Pradeep Lall's AcademicInfluence.com Rankings
Pradeep Lallengineering Degrees
Engineering
#6497
World Rank
#7829
Historical Rank
Electrical Engineering
#1943
World Rank
#2045
Historical Rank
Applied Physics
#2086
World Rank
#2125
Historical Rank

Download Badge
Engineering
Pradeep Lall's Degrees
- PhD Electrical Engineering University of California, Berkeley
- Masters Electrical Engineering University of California, Berkeley
- Bachelors Electrical Engineering University of California, Berkeley
Why Is Pradeep Lall Influential?
(Suggest an Edit or Addition)Pradeep Lall's Published Works
Number of citations in a given year to any of this author's works
Total number of citations to an author for the works they published in a given year. This highlights publication of the most important work(s) by the author
Published Works
- Prognostics and health management of electronics (2006) (472)
- The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints (2007) (159)
- Reliability of the aging lead free solder joint (2006) (148)
- Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact (2004) (137)
- The effects of aging temperature on SAC solder joint material behavior and reliability (2008) (129)
- Model for BGA and CSP reliability in automotive underhood applications (2004) (122)
- Determination of Anand constants for SAC solders using stress-strain or creep data (2012) (121)
- Reduction of lead free solder aging effects using doped SAC alloys (2010) (112)
- Prognostics and Health Management of Electronic Packaging (2006) (112)
- Health monitoring for damage initiation & progression during mechanical shock in electronic assemblies (2006) (89)
- Improved predictions of lead free solder joint reliability that include aging effects (2012) (88)
- The effects of aging on the cyclic stress-strain behavior and hysteresis loop evolution of lead free solders (2011) (86)
- The effects of SAC alloy composition on aging resistance and reliability (2009) (82)
- Correlation of reliability models including aging effects with thermal cycling reliability data (2013) (81)
- Health Monitoring for Damage Initiation and Progression During Mechanical Shock in Electronic Assemblies (2008) (80)
- Effect of aging on the high strain rate mechanical properties of SAC105 and SAC305 leadfree alloys (2013) (78)
- Characterization of aging effects in lead free solder joints using nanoindentation (2013) (75)
- Leading indicators-of-failure for prognosis of electronic and MEMS packaging (2004) (74)
- Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling (2006) (74)
- High strain-rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature (2015) (70)
- Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging (2016) (70)
- Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages (2007) (70)
- Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics Under Shock Loads (2007) (66)
- Feature extraction and damage-precursors for prognostication of lead-free electronics (2006) (65)
- High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics (2007) (64)
- Prognostics Health Monitoring (PHM) for Prior-Damage Assessment in Electronics Equipment under Thermo-Mechanical Loads (2007) (63)
- The effects of aging on the Anand viscoplastic constitutive model for SAC305 solder (2014) (62)
- Feature extraction and health monitoring using image correlation for survivability of leadfree packaging under shock and vibration (2008) (60)
- Prognostics Health Management of Electronic Systems Under Mechanical Shock and Vibration Using Kalman Filter Models and Metrics (2012) (60)
- Solder-joint reliability in electronics under shock and vibration using explicit finite-element sub-modeling (2006) (60)
- Prognostication and health monitoring of leaded and lead free electronic and MEMS packages in harsh environments (2005) (59)
- The effects of aging on the fatigue life of lead free solders (2014) (57)
- Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging (2008) (56)
- Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging (2005) (55)
- Exploration of aging induced evolution of solder joints using nanoindentation and microdiffraction (2014) (52)
- Die stress characterization in flip chip on laminate assemblies (2005) (51)
- Explicit submodeling and digital image correlation based life-prediction of leadfree electronics under shock-impact (2009) (51)
- Extended Kalman Filter models and resistance spectroscopy for prognostication and health monitoring of leadfree electronics under vibration (2011) (51)
- Prognostics using Kalman-Filter models and metrics for risk assessment in BGAs under shock and vibration loads (2010) (50)
- Interrogation of system state for damage assessment in lead-free electronics subjected to thermo-mechanical loads (2008) (49)
- Tutorial: temperature as an input to microelectronics-reliability models (1996) (48)
- Evolution of the tension/compression and shear cyclic stress-strain behavior of lead-free solder subjected to isothermal aging (2012) (47)
- Thermal cycling reliability of aged PBGA assemblies - comparison of Weibull failure data and finite element model predictions (2015) (47)
- Nanomechanical characterization of SAC solder joints - reduction of aging effects using microalloy additions (2015) (47)
- Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration (2008) (46)
- Algorithms for prognostication of prior damage and residual life in lead-free electronics subjected to thermo-mechanical loads (2008) (45)
- Resistance spectroscopy-based condition monitoring for prognostication of high reliability electronics under shock-impact (2009) (42)
- Fundamentals of delamination initiation and growth in flip chip assemblies (2005) (42)
- Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep (2017) (41)
- The influence of temperature on integrated circuit failure mechanisms (1992) (40)
- Thermal cycling reliability of lead‐free chip resistor solder joints (2004) (40)
- Analysis of the mechanical behavior, microstructure, and reliability of mixed formulation solder joints (2009) (38)
- Corner bonding of CSPs: processing and reliability (2005) (37)
- Damage mechanics of electronics on metal-backed substrates in harsh environments (2006) (37)
- Thermal cycling reliability of lead free solders for automotive applications (2004) (37)
- Cyclic Stress-Strain Behavior of SAC305 Lead Free Solder: Effects of Aging, Temperature, Strain Rate, and Plastic Strain Range (2016) (37)
- Measurement of thermally induced die stresses in flip chip on laminate assemblies (2004) (36)
- Effects of aging on SAC-Bi solder materials (2016) (35)
- [InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems] (2021) (35)
- Mechanical characterization of doped SAC solder materials at high temperature (2016) (33)
- The Anand parameters for SAC solders after extreme aging (2016) (32)
- Visualization of Microstructural Evolution in Lead Free Solders during Isothermal Aging Using Time-Lapse Imagery (2017) (32)
- High temperature creep response of lead free solders (2016) (31)
- Continuous In-Situ Die Stress Measurements During Thermal Cycling Accelerated Life Testing (2007) (30)
- Peridynamic-models using finite elements for shock and vibration reliability of leadfree electronics (2010) (30)
- Evolution of the cyclic stress-strain behavior of doped SAC solder materials subjected to isothermal aging (2017) (29)
- Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics under Shock Loads (2009) (29)
- Influence of Temperature on Microelectronics and System Reliability : A Physics of Failure Approach (2020) (29)
- Mechanical Characterization of SAC Solder Joints at High Temperature Using Nanoindentation (2017) (29)
- Design envelopes and optical feature extraction techniques for survivability of SnAg leadfree packaging architectures under shock and vibration (2008) (29)
- The anand parameters of aging resistant doped solder alloys (2017) (28)
- Reliability of Copper, Gold, Silver, and PCC Wirebonds Subjected to Harsh Environment (2018) (26)
- Effect of Temperature on the High Strain Rate Properties of SAC Leadfree Alloys at Temperatures up to 200°C (2016) (26)
- Characterization of Doped SAC Solder Materials and Determination of Anand Parameters (2015) (25)
- Characterization of functional relationship between temperature and microelectronic reliability (1995) (24)
- Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter (2015) (23)
- Reliability and Failure Modes of Solid-State Lighting Electrical Drivers Subjected to Accelerated Aging (2015) (23)
- Mechanical characterization of SAC305 lead free solder at high temperatures (2016) (23)
- High strain rate mechanical properties of SAC105 leadfree alloy at high operating temperatures (2014) (23)
- Thermo-mechanical reliability tradeoffs for deployment of area array packages in harsh environments (2005) (22)
- Evolution of the Cyclic Stress-Strain and Constitutive Behaviors of Doped Lead Free Solder During Fatigue Testing (2018) (22)
- Use of prognostics in risk-based decision making for BGAs under shock and vibration loads (2010) (22)
- Characterization of Material Damage and Microstructural Evolution Occurring in Lead Free Solders Subjected to Cyclic Loading (2018) (21)
- Anomaly Detection and Classification for PHM of Electronics Subjected to Shock and Vibration (2012) (21)
- Mitigation of lead free solder aging effects using doped SAC-X alloys (2012) (20)
- Perspectives to understand risks in the electronic industry (1997) (20)
- Development Of An Alternative Wire Bond Test Technique (1992) (20)
- Experimental Characterization and Viscoplastic Modeling of the Temperature Dependent Material Behavior of Underfill Encapsulants (2011) (20)
- Prognostication Based on Resistance-Spectroscopy for High Reliability Electronics Under Shock-Impact (2009) (20)
- Characterization of microprocessor chip stress distributions during component packaging and thermal cycling (2010) (20)
- Fault-mode classification for health monitoring of electronics subjected to drop and shock (2009) (20)
- Evolution of the cyclic stress-strain and constitutive behaviors of SAC305 lead free solder during fatigue testing (2017) (20)
- Damage mechanics of electronics on metal-backed substrates in harsh environments (2004) (20)
- Reliability of lead-free SAC electronics under simultaneous exposure to high temperature and vibration (2012) (20)
- In-Situ, Real-Time Detector for Faults in Solder Joint Networks Belonging to Operational, Fully Programmed Field Programmabmle Gate Arrays (FPGAS) (2006) (19)
- Prediction of L70 Life and Assessment of Color Shift for Solid-State Lighting Using Kalman Filter and Extended Kalman Filter-Based Models (2015) (19)
- Sustained damage and remaining useful life assessment in leadfree electronics subjected to sequential multiple thermal environments (2012) (19)
- Digital-image correlation and XFEM based shock-reliability models for leadfree and advanced interconnects (2010) (19)
- Application of stress sensing test chips to area array packaging (2009) (19)
- AGING EFFECTS IN SAC SOLDER JOINTS (2009) (19)
- Effect of Prolonged Storage up to 1-Year on the High Strain Rate Properties of SAC Leadfree Alloys at Operating Temperatures up to 200 °C (2017) (19)
- Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments (2009) (19)
- Nano-Underfills for High-Reliability Applications in Extreme Environments (2005) (19)
- Ball Grid Array (BGA) Solder Joint Intermittency Detection: SJ BIST (2008) (19)
- Prognostication of latent damage and residual life in leadfree electronics subjected to multiple thermal-environments (2009) (19)
- Cohesive-Zone Explicit Sub-Modeling for Shock Life-Prediction in Electronics (2007) (18)
- Cohesive-Zone Explicit Submodeling for Shock Life-Prediction in Electronics (2009) (18)
- Prognostics and health monitoring of electronic systems (2011) (18)
- Effect of high strain-rate on mechanical properties of SAC105 and SAC305 leadfree alloys (2012) (18)
- High Temperature Mechanical Behavior of SAC and SAC+X Lead Free Solders (2018) (18)
- Temperature dependence of microelectronic device failures (1990) (17)
- Self-organized mapping of failure modes in portable electronics subjected to drop and shock (2010) (17)
- Material behavior of SAC305 under high strain rate at high temperature (2014) (17)
- Isothermal aging induced evolution of the material behavior of underfill encapsulants (2009) (17)
- Survivability assessment of electronics subjected to mechanical shocks up to 25,000g (2016) (17)
- BGA Reliability in Automotive Underhood Applications (2003) (17)
- Modeling and reliability characterization of area-array electronics subjected to high-g mechanical shock up to 50,000g (2012) (17)
- Non-destructive crack and defect detection in SAC solder interconnects using cross-sectioning and X-ray micro-CT (2014) (17)
- Evaluation of Aging Induced Microstructural Evolution in Lead Free Solders Using Scanning Probe Microscopy (2018) (17)
- High strain rate properties of SAC305 leadfree solder at high operating temperature after long-term storage (2015) (16)
- Quantification and Modeling of Microstructural Evolution in Lead Free Solders During Long Term Isothermal Aging (2018) (16)
- Decorrelated feature space and neural nets based framework for failure modes clustering in electronics subjected to mechanical-shock (2011) (16)
- A physics-of-failure (POF) approach to addressing device reliability in accelerated testing of MCMs (1995) (16)
- Real-Time Detection of Solder-Joint Faults in Operational Field Programmable Gate Arrays (2007) (16)
- Assessment of residual damage in leadfree electronics subjected to multiple thermal environments of thermal aging and thermal cycling (2010) (16)
- Life Prediction and Damage Equivalency for Shock Survivability of Electronic Components (2006) (16)
- Assembly-level reliability of flex-substrate BGA, elastomer-on-flex packages and 0.5 mm pitch partial array packages (2000) (15)
- Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging (2015) (15)
- Decision-Support Models for Thermo-Mechanical Reliability of Leadfree Flip-Chip Electronics in Extreme Environments (2005) (15)
- Comparison of Lalman-filter and extended Kalman-filter for prognostics health management of electronics (2012) (15)
- Microstructural Indicators for Prognostication of Copper–Aluminum Wire Bond Reliability Under High-Temperature Storage and Temperature Humidity (2016) (15)
- Prognostication of Residual Life and Latent Damage Assessment in Lead-Free Electronics Under Thermomechanical Loads (2011) (15)
- A framework for reliability modeling of electronics (1995) (15)
- Thermal reliability considerations for Deployment of area array packages in harsh environments (2004) (15)
- Stress–Strain Behavior of SAC305 at High Strain Rates (2015) (15)
- Measurements and modeling of the temperature dependent material behavior of underfill encapsulants (2003) (14)
- Measurement of die stresses in microprocessor packaging due to thermal and power cycling (2012) (14)
- Challenges in accelerated life testing (2004) (14)
- Mechanical Characterization of Intermetallic Compounds in SAC Solder Joints at Elevated Temperatures (2018) (14)
- Effects of Mechanical Cycling on the Microstructure of SAC305 Lead Free Solder (2018) (14)
- Mechanical deformation behavior of SAC305 at high strain rates (2012) (14)
- Evolution of the Mechanical Behavior of Lead Free Solders Exposed to Thermal Cycling (2019) (14)
- Particle filter models and phase sensitive detection for prognostication and health monitoring of leadfree electronics under shock and vibration (2011) (14)
- Microstructural Evolution in SAC+X Solders Subjected to Aging (2019) (13)
- Time–Frequency and Autoregressive Techniques for Prognostication of Shock-Impact Reliability of Implantable Biological Electronic Systems (2008) (13)
- L70 life prediction for solid state lighting using Kalman Filter and Extended Kalman Filter based models (2013) (13)
- IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING BOARD OF GOVERNORS (Continued on back cover) President (2004) (13)
- Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics (2012) (13)
- System Design Issues for Harsh Environment Electronics Employing Metal-Backed Laminate Substrates (2008) (13)
- Development of Test Protocols for the Flexible Substrates in Wearable Applications (2018) (13)
- Impelementatoin of a viscoelastic model for the temperature dependent material behavior of underfill encapsulants (2012) (13)
- Board trace fatigue models and design guidelines for electronics under shock-impact (2010) (13)
- Evolution of high strain rate and high temperature mechanical properties of SAC305 with long term storage up to 1-year (2017) (13)
- Effect of 100°C Aging for Periods of up to 120-days on High Strain Rate Properties of SAC305 Alloys (2020) (12)
- X-ray micro-CT and digital-volume correlation based three-dimensional measurements of deformation and strain in operational electronics (2015) (12)
- Prognostication of accrued damage in board assemblies under thermal and mechanical stresses (2012) (12)
- Reliability of flip chip assemblies subjected to extreme low temperatures (2006) (12)
- Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling (2018) (12)
- Finite Element Parametric Analysis on Fine-Pitch BGA (FBGA) Packages (2003) (12)
- Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders (2018) (12)
- Micro Indentation Measurements of the Creep Properties of CABGA Doped Solder Joint (2021) (12)
- High temperature tensile and creep behavior of lead free solders (2017) (12)
- A Comparative Study of the High Temperature Mechanical Behavior of Lead Free Solders (2018) (12)
- Principal component analysis based development of Norris-Landzberg acceleration factors and Goldmann Constants for leadfree electronics (2009) (11)
- The Influence of Poisson’s Ratio on the Reliability of SAC Lead Free Solder Joints (2018) (11)
- High strain rate mechanical behavior of SAC-Q solder (2017) (11)
- The Effect of Bi on the Mechanical Properties of Aged SAC Solder Joint (2020) (11)
- Thermal Cycling Reliability Predictions for PBGA Assemblies That Include Aging Effects (2013) (11)
- Effect of Aging on the Fatigue Life and Shear Strength of SAC305 Solder Joints in Actual Setting Conditions (2019) (11)
- Effect of Different Thermal Cycling Profiles on the Mechanical Behavior of SAC305 Lead Free Solder (2020) (11)
- Measurement of the temperature dependent constitutive behavior of underfill encapsulants (2005) (11)
- Anand Parameters for Modeling Prolonged Storage on High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder at High Operating Temperature (2018) (11)
- Squeezing the chip: The buildup of compressive stress in a microprocessor chip by packaging and heat sink clamping (2011) (11)
- Aging induced evolution of free solder material behavior (2008) (11)
- Ultra-High Reliability Flip Chip on Laminate For Harsh Environments (2005) (10)
- Prognostics Health Monitoring (PHM) for Prior Damage Assessment in Electronics Equipment Under Thermo-Mechanical Loads (2011) (10)
- Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging (2018) (10)
- High-G shock reliability of ceramic area-array packages (2012) (10)
- Test Protocol for Assessment of Flexible Power Sources in Foldable Wearable Electronics under Stresses of Daily Motion during Operation (2017) (10)
- Principal component regression models for life prediction of plastic ball grid arrays on copper-core and no-core assemblies (2008) (10)
- Aging induced evolution of the cyclic stress-strain behavior of lead free solders (2016) (10)
- Thermomechanical failures in microelectronic interconnects (1998) (10)
- Assembly-level reliability characterization of chip-scale packages (1998) (10)
- Color shift analysis and modeling of high power warm white pc-LED under high temperature and high humidity environment (2017) (10)
- Effects of Test Temperature and Prior Aging on the Cyclic Stress-Strain Behavior of Lead Free Solders (2019) (10)
- Prognostics of Damage Accrual in SSL Luminaires and Drivers Subjected to HTSL Accelerated Aging (2013) (10)
- Effect of Process Parameters on Aerosol Jet Printing of Multi-Layer Circuitry (2019) (10)
- Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs (2015) (10)
- Reliability characterization of the SLICC package (1996) (10)
- Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping (2012) (10)
- Characterization of die stresses in flip chip on laminate assemblies using (2003) (10)
- Mechanical Behavior Evolution of SAC+Bi Lead Free Solder Exposed to Thermal Cycling (2020) (10)
- Constitutive Behavior of SAC Leadfree Alloys at High Strain Rates (2011) (9)
- Prognostication of copper-aluminum wirebond reliability under high temperature storage and temperature-humidity (2014) (9)
- Effect of Shallow Cycling on Flexible Power-Source Survivability under Bending Loads and Operating Temperatures Representative of Stresses of Daily Motion (2018) (9)
- Methodologies for Prognostication and Health Monitoring of Leaded and Lead Free Electronics and MEMS Packages in Harsh Environments (2005) (9)
- A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures (2015) (9)
- Thermo-mechanical reliability of SAC leadfree alloys (2010) (9)
- Effect of Sintering Temperature on the Fatigue Life of Additively Printed Electronics During Cyclic Bending (2019) (9)
- The effects of silver content and solidification profile on the Anand constitutive model for SAC lead free solders (2014) (9)
- Leading indicators for prognostic health management of electrical connectors subjected to random vibration (2012) (9)
- PHM-based residual life computation of electronics subjected to a combination of multiple cyclic-thermal environments (2010) (9)
- Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder (2017) (9)
- PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads (2017) (9)
- Extreme Cold-Temperature High-Strain Rate Properties of SAC Solder Alloys (2020) (8)
- Degradation mechanisms in electronic mold compounds subjected to high temperature in neighborhood of 200°C (2014) (8)
- Assessment of Lumen Degradation and Remaining Life of LEDs Using Particle Filter (2013) (8)
- Property-Performance Relationships for Sustained High Temperature Operation of Electronics (2020) (8)
- The influence of aging on the stress-strain and creep behavior of SAC solder alloys (2010) (8)
- The Degradation Mechanisms of Underfills Subjected to High Temperature Long Term Aging (2020) (8)
- Fault-isolation in portable electronics subjected to drop and shock (2010) (8)
- Improved Submodeling Finite Element Simulation Strategies for BGA Packages Subjected to Thermal Cycling (2018) (8)
- Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments (2015) (8)
- Effect of Prolonged Storage on High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder at High Operating Temperature (2018) (8)
- Prediction of lumen output and chromaticity shift in LEDs using Kalman Filter and Extended Kalman Filter based models (2013) (8)
- Interrogation of accrued damage and remaining life in field-deployed electronics subjected to multiple thermal environments of thermal aging and thermal cycling (2011) (8)
- Bayesian models for life prediction and fault-mode classification in solid state lamps (2015) (8)
- FATIGUE AND SHEAR PROPERTIES OF HIGH RELIABLE SOLDER JOINTS FOR HARSH APPLICATIONS (2018) (8)
- Creep Behavior of Various Materials Within PBGA Packages Subjected to Thermal Cycling Loading (2020) (8)
- Effect of simultaneous high temperature and vibration on MEMS based vibratory gyroscope (2017) (8)
- High strain-rate mechanical properties of SnAgCu leadfree alloys (2011) (8)
- Time-frequency and auto-regressive techniques for prognostication of shock-impact reliability of implantable biological electronic systems (2008) (8)
- Reliability of solid-state lighting electrical drivers subjected to WHTOL accelerated aging (2014) (8)
- A comparison of temperature and humidity effects on phosphor converted LED package and the prediction of remaining useful life with state estimation (2016) (8)
- Leading-Indicators Based on Impedance Spectroscopy for Prognostication of Electronics Under Shock and Vibration Loads (2009) (8)
- Nanoindentation Testing of SAC305 Solder Joints Subjected to Thermal Cycling Loading (2019) (8)
- Measurement of the temperature dependent constitutive behavior of underfill encapsulants (2004) (8)
- Risk Management Models for Flip-Chip Electronics in Extreme Environments (2006) (8)
- Mechanical Behavior Evolution of SAC305 Lead Free Solder Joints under Thermal Cycling (2019) (7)
- Multiphysics-modeling of corrosion in copper-aluminum interconnects in high humidity environments (2015) (7)
- Investigation of Aging Induced Microstructural Changes in Doped SAC+X Solders (2019) (7)
- High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days (2021) (7)
- Effect of Shock Angle on Solder-Joint Reliability of Potted Assemblies Under High-G Shock (2020) (7)
- Principal Components Regression Model for Prediction of Acceleration Factors for Copper-Aluminum Wirebonds Subjected to Harsh Environments (2016) (7)
- Die stress variation in area array components subjected to accelerated life testing (2008) (7)
- High Strain-Rate Properties for SAC305 at Cold Operating Temperatures down to -65°C (2020) (7)
- Effects of aging on the stress-strain and creep behaviors of lead free solders (2006) (7)
- High strain rate stress-strain measurement of SAC105 leadfree alloy at temperatures up to 200°C (2016) (7)
- Prediction of L70 lumen maintenance and chromaticity for LEDs using extended Kalman filter models (2013) (7)
- Prognostication of remaining useful-life for flexible batteries in foldable wearable electronics (2016) (7)
- Investigation on the Mechanical Behavior Evolution Occurring in Lead Free Solder Joints Exposed to Thermal Cycling (2020) (7)
- Measurement and Prediction of Interface Crack Growth at the PCB-Epoxy Interfaces Under High-G Mechanical Shock (2018) (7)
- Investigation of Microstructural Evolution in SAC Solders Exposed to Short-Term and Long-Term Aging (2018) (7)
- Prognostication of the effect of mean temperature of thermal cycle on SAC305 leadfree reliability using damage pre-cursors (2014) (6)
- Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability Under Vibration (2014) (6)
- Experimental Characterization of the Dependence of the Poisson's Ratio of Lead Free Solder on Temperature, Strain Rate, Solidification Profile, and Isothermal Aging (2019) (6)
- The Effects of Aging of the Cyclic Stress-Strain and Fatigue Behaviors of Lead Free Solders (2013) (6)
- Effect of Surface Finish on the Fatigue Behavior of Bi-based Solder Joints (2019) (6)
- Model for prediction of package-on-package warpage and the effect of process and material parameters (2013) (6)
- Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys (2019) (6)
- Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C (2020) (6)
- Drop Reliability of Corner Bonded CSP in Portable Products (2003) (6)
- The Poisson's Ratio of Lead Free Solder - The Often Forgotten But Important Material Property (2019) (6)
- Creep test method for determination of Anand parameters for lead free solders and their variation with aging (2014) (6)
- Comparison of particle filter using SIR algorithm with self-adaptive filter using ARMA for PHM of Electronics (2012) (6)
- Identification of failure modes in portable electronics subjected to mechanical-shock using supervised learning of damage progression (2011) (6)
- Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder (2019) (6)
- EFFECTS OF MIXING SOLDER SPHERE ALLOYS WITH BISMUTH-BASED PASTES ON THE COMPONENT RELIABILITY IN HARSH THERMAL CYCLING (2018) (6)
- 3-D Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion (2019) (6)
- Reliability of MEMS devices under multiple environments (2014) (6)
- Mechanical Characterization and Microstructural Evolution of SAC and SAC+X Lead Free Solders Subjected to High Temperature Aging (2019) (6)
- Evolution of Anand Parameters for SAC-Q Solder Alloy after Prolonged Storage up to 1-Year at High Strain Rate at Very High Operating Temperature (2019) (6)
- Effects of moisture exposure on the mechanical behavior of flip chip underfills in microelectronic packaging (2014) (6)
- Physical aging and evolving mechanical behavior of underfill encapsulants (2008) (6)
- Evolution of the Mechanical Properties of Lead Free Solder Joints Subjected to Mechanical Cycling (2019) (5)
- A PoF approach to addressing defect-related reliability (1994) (5)
- Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Mechanical Shock Environments (2015) (5)
- Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments (2007) (5)
- Characterization of Moisture Induced Die Stresses in Flip Chip Packaging (2016) (5)
- The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders (2018) (5)
- Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging (2013) (5)
- Modeling Deformation Behavior of Multiple Grained SAC305 Solder Joints (2020) (5)
- Prognostics and condition monitoring of electronics (2009) (5)
- Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures (2017) (5)
- Deformation Behavior of SAC305 Solder Joints With Multiple Grains (2020) (5)
- Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone (2017) (5)
- Transient dynamics model and 3D-DIC analysis of new-candidate for JEDEC JESD22-B111 test board (2014) (5)
- Characterization of Viscoelastic Response of Underfill Materials (2019) (5)
- Characterization of Die Stresses in CBGA Packages due to Component Assembly and Heat Sink Clamping (2011) (5)
- Effect of Elevated Storage Temperature on the High Strain Rate Mechanical Properties of SAC305 Solder (2019) (5)
- Reliability Studies for Package-on-Package Components in Drop and Shock Environments (2011) (5)
- Level of damage and remaining useful life assessment in leadfree electronics subjected to multiple thermo-mechanical environments (2012) (5)
- Mechanical Properties and Microstructural Fatigue Damage Evolution in Cyclically Loaded Lead-Free Solder Joints (2019) (5)
- Determination of Anand Parameters From Creep Testing of SAC305 Solder Joints (2020) (5)
- Nanomechanical Characterization of Lead Free Solder Joints (2014) (5)
- Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration (2018) (5)
- Long term isothermal aging effects on the cyclic stress-strain behavior of Sn-Ag-Cu solders (2017) (5)
- Effect of Thermal Cycling on Reliability of QFN Packages (2018) (5)
- Evaluation of the Creep Response of Lead Free Solder Materials Subjected to Thermal Cycling (2020) (5)
- Interrogation of thermo-mechanical damage in field-deployed electronics (2012) (5)
- Assessment of Accrued Damage and Remaining Useful Life in Leadfree Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling (2012) (5)
- Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot (2013) (5)
- The influence of aging on the creep behavior of underfill encapsulants (2010) (5)
- A Study on the Effect of Mean Cyclic Temperature on the Thermal Fatigue Reliability of SAC Solder Joints Using Digital Image Correlation (2015) (5)
- Effect of Sintering Time and Sintering Temperature on the Mechanical and Electrical Properties of Aerosol-Jet Additively Printed Electronics (2019) (5)
- Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours (2019) (5)
- High Temperature Aging Effects in SAC and SAC+X Lead Free Solders (2019) (5)
- Factors Influencing the Line Consistency of Commonly Used Geometries for Additively Printed Electronics (2019) (5)
- Cost assessment for implementation of embedded prognostic health management for electronic systems (2012) (5)
- Drop-Impact Reliability of Chip-Scale Packages in Handheld Products (2003) (5)
- Reliability of Additively Printed Traces on Polymer Substrates Subjected to Mechanical Stretching (2019) (5)
- Study on the effect of fixtures on deformation and warpage of the double-sided flexible printed circuit board through reflow using DIC (2017) (5)
- Failure mechanisms and color stability in light-emitting diodes during operation in high-temperature environments in presence of contamination (2015) (5)
- Multiphysics Life-Prediction Model Based on Measurements of Polarization Curves for Copper-Aluminum Intermetallics (2016) (5)
- Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources (2019) (5)
- Nanomechanical characterization of IMCs formed in SAC solder joints subjected to isothermal aging (2017) (5)
- Nanomechanical Characterization of Intermetallic Compounds in Lead Free Solder Joints (2018) (5)
- ANN based RUL assessment for copper-aluminum wirebonds subjected to harsh environments (2016) (5)
- Real-Time BIST Detector for BGA Faults in Field Programmable Gate Arrays (FPGAs) (2006) (5)
- Damage pre-cursor based assessment of impact of high temperature storage on reliability of leadfree electronics (2013) (4)
- Health Monitoring and Feature Vector Identification of Failure for SAC305 Solder PCB’s under Shock Loads up to 10,000g (2020) (4)
- Effect of Use Parameters on Fatigue-Life of Flexible Substrates under Bending Loads (2019) (4)
- Thermal performance of underfilled BGAs (2004) (4)
- Solid State Lighting Life Prediction Using Extended Kalman Filter (2013) (4)
- Prognostication and Health Monitoring of Electronics in Implantable Biological Systems (2008) (4)
- Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact (2012) (4)
- Influence of Surface Segregation on Wetting of Sn-Ag-Cu (SAC) Series and Pb-Containing Solder Alloys (2011) (4)
- Process-Consistency-Performance Relationships for Additively Printed Z-axis Interconnects in Multilayer Circuits (2020) (4)
- Life prediction and classification of failure modes in solid state luminaires using Bayesian Probabilistic Models (2014) (4)
- Capacity Degradation of Flexible Li-Ion Power Sources Subjected to Shallow Discharging (2019) (4)
- High Temperature High Strain Rate Properties of SAC305 with Effect of 100°C Storage for Prolonged Duration (2021) (4)
- Stress Strain Analysis on Stitch Bond of Cu-Al Wirebonds Using X-ray Micro-CT Technique (2019) (4)
- Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage (2018) (4)
- Evolution of the Microstructure of Lead Free Solders Subjected to Both Aging and Cyclic Loading (2019) (4)
- Effect of Shallow Charging on Flexible Power Source Capacity Subjected to Varying Charge Protocols and C-Rates (2019) (4)
- Resistance Spectroscopy Based Assessment of Degradation in Cu-Al Wire Bond Interconnects (2013) (4)
- Degradation of thermal performance of ball grid arrays after thermal cycling (2006) (4)
- Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments (2017) (4)
- Degradation Mechanisms of Epoxy Molding Compound Subjected to High Temperature Long Term Aging (2021) (4)
- Effects of Shear Cycling on the Mechanical Properties of SAC and SAC+X Lead Free Solder Joints (2019) (4)
- A Revised Anand Constitutive Model for Lead Free Solder That Includes Aging Effects (2013) (4)
- Prognostic health monitoring for a micro-coil spring interconnect subjected to drop impacts (2013) (4)
- Investigation of the Mechanical Behavior of SAC305 Solder Joints at Extreme High Temperatures Using Nanoindentation (2020) (4)
- Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation (2020) (4)
- Remaining Useful Life Assessment of Field Deployed Electronics Using X-Ray Micro-CT Based Digital Volume Correlation and Finite-Element Analysis (2016) (4)
- Electrically Conductive Adhesive Interconnections on Additively Printed Substrates (2021) (4)
- Fatigue Performance of Doped SAC Solder Joints in BGA Assembly (2020) (4)
- Feature Extraction and RUL Prediction of SAC Solder Alloy Packages by Different Statistical and Time-frequency Analysis Techniques under Simultaneous Temperature-Vibration Loads (2018) (4)
- High Strain-Rate Constitutive Behavior of SAC305 Solder During Operation at High Temperature (2014) (4)
- Evolution of Viscoelastic Properties and Interface-Fracture Toughness Under Sustained High Temperature Operation Typical of Automotive Underhood for up to 1-year (2021) (4)
- Effect of Long Term Isothermal Exposure on Underfill Material Properties (2020) (4)
- Mechanical Property Evolution in SAC+Bi Lead Free Solders Subjected to Various Thermal Exposures (2021) (4)
- Temperature as a Reliability Factor (2020) (4)
- Moisture-Induced Die Stresses in PBGA Packages Exposed to Various Environments (2018) (4)
- Process-Consistency in Additive Printed Multilayer Substrates With Offset-Vias Using Aerosol Jet Technology (2020) (4)
- Nanomechanical characterization of SAC305 solder joints - effects of aging (2014) (4)
- FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling (2015) (4)
- A study on damage progression in MEMS based Silicon oscillators subjected to high-g harsh environments (2016) (4)
- Prognostication of solder-joint reliability of 0.4mm and 0.5mm pitch bgas subjected to mechanical shocks up to 10,000G (2015) (4)
- Effect of Prolonged Storage Up to 1-Year on Anand Parameters for SAC105 Leadfree Alloys (2019) (4)
- A Study on Die Stresses in Flip Chip Package Subjected to Various Hygrothermal Exposures (2018) (4)
- High Strain Rate Properties of SAC305 Alloy at Cold Temperatures Subsequent to 100°C Storage for Periods up to 120 Days (2021) (4)
- Effect of Aging on Component Reliability in Harsh Thermal Cycling (2019) (4)
- Computational Methods and High Speed Imaging Methodologies for Transient-Shock Reliability of Electronics (2007) (4)
- Nanomechanical Characterization of Various Materials within PBGA Packages Subjected to Thermal Cycling Loading (2020) (4)
- Effect of Green EMCs on Fatigue Reliability of Molded Cu Wirebond System (2018) (4)
- Effects of Aging on the Damage Accumulation in SAC305 Lead Free Solders Subjected to Cyclic Loading (2019) (4)
- Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints (2015) (4)
- De-bonding simulation of Cu-Al wire bond intermetallic compound layers (2016) (3)
- Effect of EMCs on the high current reliability of Cu wirebonds operating in harsh environments (2017) (3)
- Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion Subjected to Highly-Accelerated Stress Test (2018) (3)
- Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies (2015) (3)
- Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation (2021) (3)
- Fatigue Performance of Ball Grid Array Components at Elevated Temperature (2021) (3)
- SSL and LED life prediction and assessment of CCT shift (2014) (3)
- Electronic Packaging Applications (2008) (3)
- Interfacial Fracture Toughness of PCB/Epoxy Interfaces Under Three Point and Four Point Loading with Sustained High Temperature Exposure (2021) (3)
- Influence of Quantifiable Extrinsic Stresses on Tin Whisker Growth (2009) (3)
- High Strain Rate Properties of M758 Solder at Extreme Operating Temperatures (2021) (3)
- Sustained High-Temperature Vibration Reliability of Thermally Aged Leadfree Assemblies in Automotive Environments (2020) (3)
- Effect of storage on high strain rate mechanical properties of SAC105 at operating temperature up to 200°C (2017) (3)
- Non-Perpendicular High-G Shock on Potted Fine Pitch Electronics Under Sustained High Temperature Aging (2021) (3)
- Nano-underfills and Potting Compounds for Fine-Pitch Electronics (2018) (3)
- Mechanical Design of Electronic Systems (2017) (3)
- Flexure and Twist Test Reliability Assurance of Flexible Electronics (2019) (3)
- LED Lumen Degradation and Remaining Life Under Exposure to Temperature and Humidity (2013) (3)
- A novel Micro-CT data based Finite Element Modeling technique to study reliability of densely packed fuze assemblies (2016) (3)
- Improved meshing strategy for finite element modeling of PBGA thermal cycling (2016) (3)
- Models for Shock and Vibration Survivability of Electronic and MEMS Packaging (2005) (3)
- Effects of aging on shear cyclic stress strain and fatigue behaviors of lead free solder joints (2014) (3)
- Additively Printed Multilayer Substrate Using Aerosol-Jet Technique (2020) (3)
- Comparison of FEA Modeling Techniques for Plastic Ball Grid Array Assemblies (2018) (3)
- Effect of Fatigue on Individual SAC305 Solder Joints Reliability at Elevated Temperature (2020) (3)
- Prognostic indicators for Cu-Al wirebond degradation under operation at elevated temperature and combined temperature humidity (2014) (3)
- Effect of Print Parameters on Print Consistency of Aerosol Jet Printed Electronics (2019) (3)
- DIC Based Investigation Into the Effect of Mean Temperature of Thermal Cycle on the Strain State in SnAgCu Solder Joint (2015) (3)
- Improved finite element modeling strategies with multipoint constraints for BGA packages subjected to thermal cycling (2017) (3)
- Evolution of Prony Parameters for Underfills Subjected to High Temperature Long Term Aging (2021) (3)
- Development of FE Models and Measurement of Internal Deformations of Fuze Electronics Using X-Ray MicroCT Data with Digital Volume Correlation (2017) (3)
- KEYNOTE PRESENTATION Prognostics and Health Monitoring of Electronic Systems (2011) (3)
- Fatigue Performance of Aged SAC-Bi Solder Joint under Varying Stress Cycling (2021) (3)
- Health Monitoring of PCB’s Under Mechanical Shock Loads (2019) (3)
- Flexible Wearable Biometric Band and Smartphone Application for Prevention of Sudden Causes of Death (2018) (3)
- Low Temperature High Strain Rate Material Properties for SAC-Q Leadfree Alloys (2020) (3)
- Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads (2008) (3)
- PBGA package Finite Element Analysis based on the physical geometry modeling using X-ray micro CT digital volume reconstruction (2016) (3)
- Model for Inverse Determination of Process and Material Parameters for Control of Package-on-Package Warpage (2015) (3)
- Transactions on Components and Packaging Technologies Editors CPMT Transactions Editor-in-Chief (2009) (3)
- Effect of Shock Pulse Variation on Surface Mount Electronics under High-G Shock (2019) (3)
- Effect of Process Parameters on the Long-Run Print Consistency and Material Properties of Additively Printed Electronics (2019) (3)
- Particle swarm optimization with extended Kalman filter for prognostication of accrued damage in electronics under temperature and vibration (2012) (3)
- Latent damage assessment and prognostication of residual life in airborne lead-free electronics under thermo-mechanical loads (2008) (3)
- Stress measurements in large area array flip chip microprocessor chips (2008) (3)
- Reliability of SAC Leadfree Solders in Automotive Underhood Temperature-Vibration (2018) (3)
- Comparison of Thermal Cycling Induced Mechanical Property Evolutions in Bulk Solder and Solder Joints (2021) (3)
- RUL Estimations of SAC305 Solder PCB's under Different Conditions of Temperature and Vibration Loads (2020) (3)
- Measurement of die stress distributions in flip chip CBGA packaging (2010) (3)
- Low-Temperature High Strain Rate Constitutive Behavior of Doped and Undoped SnAgCu Solder Alloys after Prolonged Storage at High Temperature (2021) (3)
- Prognostication of Damage in Automotive Underhood Electronics Subjected to Temperature and Vibration (2018) (3)
- Characterization of die stresses in microprocessor packages subjected to thermal cycling (2012) (3)
- Damage pre-cursor based life prediction of the effect of mean temperature of thermal cycle on the SnAgCu solder joint reliability (2014) (3)
- Experimental Characterization of Underfill Materials Exposed to Moisture Including Preconditioning (2015) (3)
- PHM of Leadfree Interconnects Using Resistance Spectroscopy Based Particle Filter Models for Shock and Vibration Environments (2011) (3)
- Effect of Thermal Aging on the Evolution of Anand Parameters for SAC105 Leadfree Alloys Operating at Cold Temperatures down to -55 °C (2020) (3)
- Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT (2017) (3)
- X-ray micro-CT and DVC based analysis of strains in metallization of flexible electronics (2017) (3)
- Package-level multiphysics simulation of Cu-Al WB corrosion under high temperature/humidity environmental conditions (2017) (3)
- Correlation of Accelerated Tests with Human Body Measurements for Flexible Electronics in Wearable Applications (2020) (3)
- Finite element models for simulation of wear in electrical contacts (2008) (2)
- A Novel Numerical Multiphysics Framework for the Modeling of Cu-Al Wire Bond Corrosion under HAST Conditions (2018) (2)
- PHM of state-of-charge for flexible power sources in wearable electronics with EKF (2018) (2)
- Effect of reflow process on glass transition temperature of printed circuit board laminates (2012) (2)
- Mechanical Characterization of Solder Mask Materials (2018) (2)
- Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment (2021) (2)
- Models for Reliability of Fine-Pitch BGAs and CSPs in Shock and Drop Impact (2004) (2)
- Development of survivability envelopes for SnAg leadfree packaging architecures under shock and vibration (2008) (2)
- Mechanical Behavior and Reliability of SAC+Bi Lead Free Solders with Various Levels of Bismuth (2021) (2)
- Accrued Damage and Remaining Life in Field Extracted Assemblies Under Sequential Thermo-Mechanical Loads (2011) (2)
- Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning (2021) (2)
- Measurement of Stress and Delamination in Flip Chip on Laminate Assemblies (2003) (2)
- Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics (2013) (2)
- Influence of Tempemture on Microelectronics and System Reliability (2020) (2)
- Anand Parameters for Eutectic Tin-Bismuth Solder (2021) (2)
- Aging Effects on the Mechanical Behavior and Reliability of SAC Alloys (2009) (2)
- Model for Interaction of EMC Formulation with Operating Current and Reliability of Cu-Al Wirebonds Operating in Harsh Environments (2017) (2)
- A Life-Cycle Approach To Design And Manufacturing Simulation Of Multichip Modules (1996) (2)
- A Physics-of-Failure Approach to IC Burn-In (2020) (2)
- Experimental characterization of underfill materials exposed to different moisture conditions (2017) (2)
- Evolution of the Properties of SAC-Bi-Ni-Sb Lead Free Solder During Mechanical Cycling (2020) (2)
- Prognostics Health Management Model for LED Package Failure Under Contaminated Environment (2015) (2)
- LED Chip Deformation Measurement During the Operation Using the X-Ray CT Digital Volume Correlation (2015) (2)
- Sintering Process Conditions for Additive Printing of Multi-Layer Circuitry Aerosol-Jet Process in Conjunction with Nanoparticle Ink (2020) (2)
- Prognostication of LED remaining useful life and color stability in the presence of contamination (2015) (2)
- Investigation and Comparison of Aging Effects in SAC+X Solders Exposed to High Temperatures (2020) (2)
- Low Temperature Solder Interconnection of Surface Mount Devices with Additively Printed Pads on Flexible Substrate (2021) (2)
- Thermo-mechanical Deformation in Flexible-Board Assemblies During Reflow and Post-Assembly Usage (2018) (2)
- Interconnection of Passive Components using Printed Aerosol-Jet Traces (2021) (2)
- Evolution of High Strain Rate Mechanical Properties of SAC-R with High Temperature Storage at 50°C with High and Low Operating-Temperatures (2020) (2)
- Accuracy, Hysteresis and Extended Time Stability of Additively Printed Temperature and Humidity Sensors (2020) (2)
- PCR for Derivation of Parameter Dependencies, Thermo-Mechanical Norris-Landzberg Acceleration Factors, Goldmann Fatigue Constants for Leadfree Electronics (2009) (2)
- Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads (2021) (2)
- Low Operating-Temperature High Strain Rate Constitutive Behavior of SnAgCu Solder Alloys after Prolonged Storage at High Temperature (2021) (2)
- Classification of location of damage in package-on-package (PoP) assemblies using ANN with feature vectors for progression of accrued damage (2012) (2)
- Thermal Cycling Reliability of Chip Resistor Lead Free Solder Joints (2003) (2)
- Surfaces of mixed formulation solder alloys at melting (2011) (2)
- Effects of Physical Aging on the Stress-Strain and Creep Behaviors of Lead Free Solders (2006) (2)
- Effect of Bismuth Content on the Mechanical Cyclic Properties of SAC+Bi Lead Free Solders (2021) (2)
- Reliability of Leadfree Solders in High Temperature Vibration in Automotive Environments (2019) (2)
- Damage Evolution in MEMS Pressure Sensors during High Temperature Operating Life and Prolonged Storage at Sub-Zero Temperature (2018) (2)
- Process Recipes for Additively Printed Copper-Ink Flexible Circuits using Direct Write Methods (2021) (2)
- Prognosis Methodologies for Health Management of Electronics and MEMS Packaging (2004) (2)
- Effect of Drop Angle Variation and Restraint Mechanisms on Surface Mount Electronics Under High G Shock (2019) (2)
- Damage Progression Using Speckle‐Correlation and High‐Speed Imaging for Survivability of Leadfree Packaging Under Shock (2009) (2)
- Micromechanical Modeling of SAC305: Homogenization and Effect of IMC Particles on Deformation Behavior (2021) (2)
- Material Characterization and Die Stress Measurement of Low Expansion PCB for Extreme Environments (2005) (2)
- Temperature and Time-dependent Property Prediction and Validation for Nano-Underfills using RSA based RVE Algorithms (2006) (2)
- Prognostic and RUL Estimations of SAC105, SAC305,and SnPb Solders under Different Drop and Shock Loads using Long Short-Term Memory (LSTM) Deep Learning Technique (2021) (2)
- Modeling of Effect of Underfill Properties on Flip Chip Bumps and Solder Balls of FCBGA Package in Automotive Underhood Applications (2021) (1)
- Bayesian probabilistic model for life prediction and fault mode classification of solid state luminaires (2014) (1)
- Effect of Thermal Aging on the Interface Fracture Toughness of the PCB-UF Interface (2020) (1)
- Study of the Effect of Solder-Joint Voiding using X-ray MicroCT Data-based FE Models with Experimental Validation (2019) (1)
- Evolution of the Stress-Strain and Creep Behavior of Underfill Encapsulants With Aging (2009) (1)
- Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages (2015) (1)
- Process Development for Printed Copper with Surface Mount Devices On Inkjet Metallization (2022) (1)
- Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics (2017) (1)
- Cooling in Electronic Applications (1999) (1)
- Time-Frequency Analysis and Built-In Reliability Test for Health Monitoring of Electronics Under Shock Loads (2007) (1)
- Novel Flexible Bioelectronics Device and Software Application for Prevention of Sudden Causes of Death (2018) (1)
- Effect of Dynamic Folding with Varying Fold Orientations and C-rates on Flexible Power Source Capacity Degradation (2020) (1)
- Effect of Charging Cycle Elevated Temperature Storage and Thermal Cycling on Thin Flexible Batteries in Wearable Applications (2019) (1)
- Computer Aided Design And Reliability Assessment Of Microelectronic Packages (1970) (1)
- Effectiveness of potting methods and underfills on the enhancement of survivability of fine pitch electronics at 25,000g shock loads (2017) (1)
- Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink (2020) (1)
- Die Stress Variation During Thermal Cycling Reliability Tests (2007) (1)
- Extended-Time Process Consistency and Process-Property Relationships for Flexible Additive-Printed Electronics (2020) (1)
- Thermal Cycling Reliability of Lead-Free Solder Alloys using Surface Mount Resistors Considering Aging (2021) (1)
- Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment (2021) (1)
- Prognostics health management of electronic systems — A reliability physics approach (2018) (1)
- Mechanical Property and Microstructure Evolution in SAC and $\text{SAC} +\mathrm{X}$ Lead Free Solders Exposed to Various Thermal Cycling Profiles (2021) (1)
- Folding-Reliability of Flexible Electronics in Wearable Applications (2019) (1)
- Flexible Power-Source Survivability Assurance under Bending Loads and Operating Temperatures Representative of Stresses of Daily Motion (2018) (1)
- Effect of Evolution of High Strain Rate Properties on Plastic-Work of SAC305 Alloy with 100°C Aging for Periods up to 240-days (2022) (1)
- WARPAGE OF FLEXIBLE-BOARD ASSEMBLIES WITH BGAS DURING REFLOW AND POST-ASSEMBLY USAGE (2018) (1)
- Evolution of Viscoelastic Properties of Underfills Exposed to High Temperature (2021) (1)
- Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments (2018) (1)
- Reliability and die stress measurements in flip chip assemblies with carbon fiber core laminate substrates (2006) (1)
- Mechanics of Wirebond Interconnects (1993) (1)
- Reliability study of the laminate-based flip-chip chip scale package (1998) (1)
- An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions (2015) (1)
- Study of electromigration in Cu and Ag wirebonds operating at high current in extreme environments (2017) (1)
- Health monitoring of implantable biological electronic systems by statistical pattern recognition techniques (2008) (1)
- Development of Model for Identification of Process Parameters for Wet Decapsulation of Copper–Aluminum Wirebond in PEMs (2017) (1)
- High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging (2020) (1)
- SOH Modelling of Li-Ion Coin Cells Subjected to Varying C-Rates, Depths of Charge, Operating Temperatures and Custom Charge Profiles (2021) (1)
- Shock and Vibration Survivability Prediction Using Failure Envelopes for Electronic and MEMS Packaging (2005) (1)
- Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate (2021) (1)
- Application of Nanoindentation and Microdiffraction to Study Aging Effects in Lead Free Solder Interconnects (2016) (1)
- Stresses in Area Array Assemblies Subjected to Thermal Cycling (2009) (1)
- A study on the effect of aging on thermal cycling reliability of Sn-Ag-Cu interconnects using Digital Image Correlation (2016) (1)
- Effect of Dielectric Material on the Reliability of 3640 MLCC Capacitors under High-G Shock Loads (2019) (1)
- Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies (2020) (1)
- Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements (2019) (1)
- Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures (2021) (1)
- Microstructural Study of Lead Free Solder Joints Subjected to Mechanical Cyclic Loading Under Various Conditions (2021) (1)
- Anomaly detection and fault-mode isolation for prognostics health monitoring of electronics subjected to drop and shock (2010) (1)
- Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for QSAC10 and QSAC20 (2021) (1)
- Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature (2017) (1)
- Isothermal Aging Dependent Anand Parameters of SAC305 Lead Free Solder at Extreme High Temperatures (2020) (1)
- High Temperature Storage and HAST Reliability of Copper-Aluminum Wirebond Interconnects (2014) (1)
- HighSpeedDigital ImageCorrelation forTransient-Shock Reliability ofElectronics (2007) (1)
- Reliability modeling of electronic systems subjected to high strain rates (2012) (1)
- Analysis of Progressive Damage in Fuze Electronics using Micro-Computed Tomography and Finite Element Models (2018) (1)
- Visualization and Modeling of Microstructural Evolution in SAC305 BGA Joints during Extreme High Temperature Aging (2020) (1)
- Sensitivity of Sensor Location and Use Conditions on the Detectability of Accrued Damage for PHM under Combined Temperature Vibration (2019) (1)
- Mechanical Behavior and Microstructure Evolution in Lead Free Solders Subjected to Mechanical Cycling at Elevated Temperatures (2021) (1)
- High Temperature-Vibration Reliability of SnAgCu Leadfree Assemblies in Automotive Environments (2021) (1)
- Causes of Degradation of Thermal Performance of Ball Grid Arrays After Thermal Cycling (2007) (1)
- Cohesive Zone Modeling and Damage Prediction of Interfacial Delamination in Potted Electronics Subjected to High-G Mechanical Shock (2019) (1)
- Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing (2020) (1)
- Explicit FE Failure Prediction of Interfaces and Interconnect in Potted Electronics Assemblies Subject to High-g Acceleration Loads (2019) (1)
- Effect of Varying Amplitude Cycling on SAC-Bi Solder Joint Fatigue (2020) (1)
- Measurement of the Constitutive Behavior of Underfill Encapsulants (2003) (1)
- Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage (2021) (1)
- Multiphysics Model for Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages (2015) (1)
- Feature Vector Identification and Prognostics of SAC305 PCBs for Varying G-Levels of Drop and Shock Loads (2021) (1)
- High Cycle Fatigue Life-Prediction for Lead-Free Interconnects Under Simultaneous High Temperature and Vibration (2013) (1)
- Transient-Response Spectral Analysis Based Feature Extraction for Built-In Reliability Test of Electronics Under Shock Loads (2007) (1)
- Process Development for Printing Z-Axis Interconnects in Multilayered Flexible Substrates (2020) (1)
- Fault-Detection and Isolation Algorithms for Health Monitoring of Electronics Subjected to Shock and Vibration (2009) (1)
- The Effect of Bismuth Content on Mechanical Properties of SAC+Bi Lead Free Solder Materials and Determination of Anand Parameters (2021) (1)
- Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading (2019) (1)
- Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition (2020) (1)
- High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C (2019) (1)
- Flexible Batteries Under Dynamic Folding and Flex-to-Install with Varying C-Rates and Temperatures (2020) (1)
- Damage Accumulation and Life-Prediction Models for SnAgCu Leadfree Electronics Under Shock-Impact (2009) (1)
- Measurement of Electronic Packaging Material Behavior and Flip Chip Die Stresses at Extreme Low Temperatures (2005) (1)
- Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability (2013) (1)
- Investigation of the Effects of High Temperature Aging on Mechanical Behavior and Microstructural Changes in Lead Free Solders (2019) (1)
- Study of Lead Free Solder Joints Subjected to Isothermal Mechanical Shear Cycling (2020) (1)
- Principal components regression model for prediction of life-reduction in SAC leadfree interconnects during long-term high temperature storage (2015) (1)
- Shock Angle Variation on High-G Impact Reliability of Electronics Potted Assemblies (2021) (0)
- Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150c to 200c (2021) (0)
- Component Attachment to Inkjet Additive Printed Circuits to Achieve Flexible Signal Filters using Silver and Copper Nanoparticle Metal Inks (2022) (0)
- Process Development and Performance Analysis of Additively Printed Humidity Sensor using Aerosol Jet Printing (2020) (0)
- Sustained High Temperature Fracture Toughness Evolution of Chip-UF and Substrate-UF Interfaces in FCBGAs for Automotive Applications (2022) (0)
- Effect of Lamination Parameters and Mechanical Folding on Li-Ion Battery Capacity Deterioration and SOH Degradation Rate (2021) (0)
- High Strain Rate Mechanical Properties of Sac-Q Between -65c and +200c After Exposure to Isothermal Aging (2021) (0)
- Guidelines for Temperature-Tolerant Design and use of Electronic Packages (2020) (0)
- Guidelines for Temperature-Tolerant Design and use of Microelectronic Devices (2020) (0)
- Interfacial Fracture Toughness of EMC/Substrate Interface Under Mode–I Dynamic Loading with Long-Term High Temperature Aging (2022) (0)
- News Nsf Center for Advanced Vehicle and Extreme Environment Electronics Samuel Ginn College of Engineering (0)
- Characterization of Hysteresis Loop Evolution in Aged Lead Free Solders (2011) (0)
- High Strain Rate Properties for Sac-R After Exposure to Isothermal Aging for Operating Temperature Ranging From -65 C to 200 C (2021) (0)
- Feature Vector Based Failure Mode Identification and Prognostication of Electronics Subjected to Shock and Vibration (2009) (0)
- Effects of β-Sn Crystal Orientation on the Deformation Behavior of SAC305 Solder Joints (2022) (0)
- Aging Induced Mechanical Property Degradation and Microstructure Evolution of SAC+X Lead Free Solder Alloys (2013) (0)
- Folding Reliability of Flexible Wearable Band With Vital Sign Acquisition Sensors (2021) (0)
- Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep (2017) (0)
- Effect of Thermal Aging on the Interface Fracture Toughness of the PCB-UF Interface (2021) (0)
- Leading indicator based assessment of operational readiness in electronics subjected to multiple environments (2012) (0)
- Methodologies for System-State Interrogation for Prognostication of Electronics Under Thermo-Mechanical Loads (2007) (0)
- Remaining Useful-Life Based on Damage Pre-Cursors for Leadfree Electronics Subjected to Multiple Thermal-Environments (2009) (0)
- PHM of Flexible Li-ion Batteries Subjected to Sustained Elevated-Temperature Storage and Thermal Cycling (2019) (0)
- Improved predictions of cyclic stress-strain curves for lead free solders using the Anand viscoplastic constitutive model (2016) (0)
- Twist Reliability Assessment of Flexible Batteries in Wearable Applications (2020) (0)
- Effect of SAC105 Solder Alloys High Strain Rate Property Evolution on Plastic Work at Low Operating Temperatures (2022) (0)
- Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures (2022) (0)
- Development of a Test Methodology to Design an Overnight Charging Profile to Reduce the SOH Degradation Rate of Li-ion Batteries (2021) (0)
- Effect of Combining Solder Pastes with SAC305 Spheres on Component Reliability in Harsh Thermal Cycling (2020) (0)
- Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage (2021) (0)
- High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C (2022) (0)
- Effect of Mean Temperature on the Evolution of Strain-Amplitude in SAC Ball-Grid Arrays during Operation under Thermal Aging and Temperature Excursions (2017) (0)
- Effect of Lamination Parameters and Mechanical Folding on SOH Degradation of Li-ion Battery Subjected to Accelerated Life Testing (2021) (0)
- The Effect of Bismuth Content on Mechanical Property Evolution of SAC+Bi Lead Free Solders Subjected to Long Term Thermal Exposures (2022) (0)
- Reliability of a CBGA miroproessor package incorpoating a decoupling capacitor array (2016) (0)
- Damage Pre-Cursors Based Assessment of Accrued Thermo-Mechanical Damage and Remaining Useful Life in Field Deployed Electronics (2015) (0)
- Reliability Assessment of Cu-Al WB Under High Temperature and Voltage Bias (2021) (0)
- Thermal Cycling Induced Evolution of the Creep Behavior of Lead Free Solder Materials (2021) (0)
- Effect of Storage on Reliability of Thin-Flexible Laminated and Unlaminated Batteries in Wearable Applications (2022) (0)
- Life Prediction of Thin Flexible Batteries under U-Flex-to-Install, Dynamic Folding, Dynamic Twisting and Battery Lamination (2021) (0)
- AI and Feature-Vector Based Damage Monitoring and Remaining Useful-Life Assessment for Electronics Assemblies in Mechanical Shock and Vibration (2023) (0)
- Effect of Prolonged Storage on High strain rate Mechanical properties of QSAC10 and QSAC20 Solders after Exposure to Isothermal Aging of 50°C (2022) (0)
- Effect of Long-Term Isothermal Exposure on Chip/Underfill Interfacial Crack Growth Under Mode – I Fatigue Loading (2022) (0)
- Indentation Creep Properties Evolution of Lead-Free Solder Joints Subjected to Thermal Cycling (2022) (0)
- Material behavior changes in underfill encapsulants exposed to isothermal aging (2006) (0)
- Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging (2022) (0)
- Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder (2022) (0)
- Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days (2022) (0)
- A Crystal Plasticity Finite Element Modeling to Explain the Effects of β-Sn Crystal Orientation on SAC305 Solder Ball Deformation (2022) (0)
- Failure-Mode Clustering for Electronics Under Shock and Vibration Using Neural-Net Based Self-Organized Maps (2010) (0)
- Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging (2020) (0)
- Microstructural Evolution of SAC305 BGA Joints during Extreme High Temperature Aging (2020) (0)
- Performance of Component Interconnection Methods on Direct Write Additive Silver Circuits (2022) (0)
- Study on Folding-Reliability of Wearable Biometric Band (2020) (0)
- Keynote Presentation Prognostics and Condition Monitoring of Electronics (2009) (0)
- Flex-to-Install Application Performance of Power Sources Subjected to Varying Fold Orientations, C-Rates and Depths of Charge (2020) (0)
- Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties (2019) (0)
- State of Health Estimation of Li-Ion Battery Subjected to Flex-to-Install and Dynamic Folding With Varying Orientations, Folding Speeds, Depths of Charge and C-Rates (2021) (0)
- The Effects of Dopants on the Aging Behavior of Lead Free Solders (2011) (0)
- Improved Approaches for FEA Analyses of PBGA Packages Subjected to Thermal Cycling (2018) (0)
- Chapter 2 Nanomechanical Characterization of Lead Free Solder Joints (2019) (0)
- Damage mechanisms in copper-aluminum wirebond under high temperature operation (2014) (0)
- Effect of Underfill Property Evolution on Solder Joint Reliability in Automotive Applications (2022) (0)
- Mechanical Behavior of Sn1Ag0.5Cu and Sn3Ag0.5Cu Alloys at High Strain Rates (2012) (0)
- High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging (2020) (0)
- Effect of Manufacturing Process Parameters on Property Evolution of Printed Circuit Board Laminates (2012) (0)
- High Strain Rate Mechanical Properties of Sac-Q Between -65 C and +200 C After Exposure to Iso-Thermal Aging Up to 90 Days (2021) (0)
- Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform (2022) (0)
- Challenges in modeling of accelerated life testing ITHERM 2004 panel discussion (2004) (0)
- Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation (2022) (0)
- Reliability and SOH Degradation of Thin Li-ion Batteries Under Various Flexing Conditions (2021) (0)
- Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging (2021) (0)
- CHARACTERIZATION OF STRESS IN HIGH PERFORMANCE SERVER MICROPROCESSORS (2008) (0)
- Prediction of Electrical Performance and Print Geometry for Inkjet Additive Circuits via Statistical Modeling (2022) (0)
- Investigation of the Effect of Isothermal Mechanical Shear Cycling on Lead Free Solder Joints (2021) (0)
- Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates (2020) (0)
- Evolution of Lead Free Solder Material Behavior Under Elevated Temperature Aging (2007) (0)
- Impact of Environmental Preconditioning and Composition Parameters on Constitutive Behavior of Underfills (2003) (0)
- Evaluation of Directional Properties of SAC305 Solder Joints Using the Nanoindentation Technique (2022) (0)
- Mechanical Property Evolution in SAC+Bi Lead-Free Solders Subjected to Various Thermal Exposure Profiles (2022) (0)
- Flexible Encapsulation Process-Property Relationships for Flexible Hybrid Electronics (2021) (0)
- Interaction of Photonic Curing Process Parameters on Additively Printed Copper Circuits (2022) (0)
- A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration (2013) (0)
- High Reliability Flip Chip Using Low CTE Laminate Substrates (2005) (0)
- Prediction of Stress-Strain Behavior of Thermally Cycled SAC305 Solder Joints by Finite Element Modeling and Nanoindentation Characterization (2021) (0)
- CORROSION AND CONTAMINANT DIFFUSION MULTI-PHYSICS MODEL FOR COPPER-ALUMINUM WIREBONDS IN HIGH TEMPERATURE HIGH HUMIDITY ENVIRONMENTS (2015) (0)
- Measurement of Microprocessor Die Stress due to Thermal Cycling, Power Cycling, and Second Level Assembly (2013) (0)
- Passive Components (2018) (0)
- Electrical Parameter Variations in Mosfet Devices (2020) (0)
- Statistical Pattern Recognition andBuilt-in Reliability TestforFeature Extraction andHealthMonitoring ofElectronics underShockLoads (2007) (0)
- Additively Printed Multi-Material Temperature Sensor Realized using Screen Printing (2020) (0)
- Characterization of Fatigue Crack Growth of Epoxy Molding Compounds Under High-Temperature Long-Term Aging (2022) (0)
- COMPARISON OF RELIABILITY OF COPPER , GOLD , SILVER , AND PCC WIREBONDS UNDER SUSTAINED OPERATION AT 200 C (2018) (0)
- Air Cooling Technologies For Electronic Equipment [Book Reviews] (1998) (0)
- SIF Evaluation Using XFEM and Line Spring Models Under High Strain Rate Environment for Leadfree Alloys (2011) (0)
- Microstructural Indicators for Assessment of Effect of Prolonged and Intermittent Storage on Reliability of Lead-free Electronics (2016) (0)
- Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability (2022) (0)
- Interrogation of damage-state in leadfree electronics under sequential exposure to thermal aging and thermal cycling (2011) (0)
- Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months (2021) (0)
- The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials (2018) (0)
- Conclusions (2020) (0)
- Damage Progression in Electronic Molding Compounds under Sustained High Temperature for up to 1-year in Automotive Underhood Environments (2022) (0)
- Models for Component Selection and Thermo-Mechanical Reliability Trade-Offs to Address Component Obsolescence in Military Electronics (2008) (0)
- High Strain Rate Materials Characterization at Low Test Temperatures for Thermally Aged SAC-Q Solder Alloys (2022) (0)
- Influence of Sustained High Temperature Exposure on the Interface Bond Strength between TIM-Copper Substrates (2022) (0)
- Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies (2009) (0)
- Evolution of SAC305 Mechanical Behavior Due to Damage Accumulation During Cycling (2022) (0)
- Remaining Useful Life Estimation using a combined Physics of Failure and Deep Learning-based approach on SAC305 Solder PCBs subjected to Thermo-Mechanical Vibration Loads (2022) (0)
- Study of Interface Strength of Flexible Encapsulation for FHE Applications (2021) (0)
- Evolution of Lead Free Solder Material Behavior During Isothermal Aging (2006) (0)
- Method for Assessment of Prolonged and Intermittent Storage on Reliability of Leadfree Electronics Using Leading Indicators (2013) (0)
- Study of Interface Reliability of PCB-UF Interface in FCBGAs under Sustained High Temperature Operation in Automotive Underhood Environments (2022) (0)
- Multi-Layer Circuitry Process Development With Z-Axis Interconnects Using Aerosol-Jet Technology (2021) (0)
- Folding Reliability of Flexible Batteries in Wearable Applications (2021) (0)
- Outstanding Papers—2005 (2005) (0)
- Effect of High and Low Storage Temperatures, Storage Duration and Varying Depth of Discharge on Coin Cell SOH Degradation (2022) (0)
- ANN Based Assessment of State-of-Health Reliability of Flexible Li-Ion Batteries Under Dynamic Flexing and Calendar Aging (2022) (0)
- Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions (2021) (0)
- Feature Vector Identification and Prognostics of Sac305 Pcb\u2019s for Varying Conditions of Temperature and Vibration Loads (2021) (0)
- Deformation Behavior Sac305 Solder Joints With Multiple Grains (2021) (0)
- Effect of Material Anisotropy on Deformation Behavior of Multiple Grained Sac305 Solder Joints (2021) (0)
- SOH Degradation of Curved and Flat Li-ion Thin Flexible Batteries Subjected to Flex-to-Install Testing at Various Fold Diameters (2022) (0)
- Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year (2017) (0)
- Thermal Stability and Viscoelasticity Behavior of Underfill Encapsulants in Sustained High Temperature Environment up to 1-year (2022) (0)
- Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements (2020) (0)
- Electronic Components (2018) (0)
- Reliability Characterization and Modeling of Flexible LCO battery Under Flexing and Calendar Aging for SOH degradation analysis (2022) (0)
- Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation (2021) (0)
- Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries (2022) (0)
- Evolution of Sac Leadfree Alloys at High Strain Rate at Low Operating Temperatures (2021) (0)
- Mechanical Behavior and Microstructure Evolution in SAC+Bi Lead Free Solders Subjected to Mechanical Cycling (2022) (0)
- Evolution of the Creep Behavior for SAC305 Lead Free Solder Exposed to Various Thermal Profiles (2022) (0)
- High Strain Rate Mechanical Properties of M758 Solder at Extreme Surrounding Temperatures, with 100°C Isothermal Aging for up to 180 Days (2022) (0)
- Evaluation of the Creep Response of Lead-Free Solder Materials Subjected to Thermal Cycling (2021) (0)
- Characterization of Viscoelastic Behavior of Epoxy Molding Compounds Subjected to Sustained High Temperature Environment up to 1 year (2022) (0)
- Nano-Underfills for Fine-Pitch Electronics (2008) (0)
- Fault-Mode Classification of Solid State Luminaires Using Bayesian Probabilistic Models (2014) (0)
- Failure Modes of Flexible Electronics Under Mechanical Vibration (2019) (0)
- Evolution of Fatigue Reliability of UF-Substrate Interfaces under High Temperature Exposure (2022) (0)
- Evolution of Anand Parameters and High Strain Rate Mechanical Properties of Sac Solder Alloy at Low and High Operating Temperatures (2021) (0)
- Testing and Reliability Characterization Methods for Flexible Hybrid Electronics (2020) (0)
- Reliability of Component Attachment using ECA and LTS on Flexible Additively Printed Ink-Jet Circuits for Signal-Filtering in Wearable Applications (2022) (0)
- Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration (2022) (0)
- Health Monitoring and Prognostics of Sac305 Pcb\u2019s for Dynamic Loading Conditions of Temperature and Vibration (2021) (0)
- Multilayer Substrates With Additively Printed Micro-Vias Using Aerosol Jet Technology (2021) (0)
- Fe Modelling and Experimental Study of Crack Propagation at the Pcb/underfill Interface Due to Thermal Aging (2021) (0)
- Process Development for Additive Fabrication of Z-Axis Interconnects In Multilayer Circuits (2020) (0)
- Drop Shock Performance of SAC-Bi Compared to SnPb (2022) (0)
- Classification of multiple failure modes in package-on-package (PoP) assemblies using feature vectors for progression of accrued damage (2012) (0)
- Damage Relationships for BGA Reliability in Harsh Environments (2003) (0)
- Guest Editorial (2011) (0)
- Process Development for Fabrication of Copper Additive-Multilayer Circuits with Component Attachment using ECA and LTS (2022) (0)
- RT 184: Electronic Survivability in Harsh Environments (2018) (0)
- Determination of Anand Parameters From Shear Creep Tests of Lead Free Solder Joints (2021) (0)
- Process-Consistency in Printed Layers in Multi-Layer Substrate Using Aerosol Jet Technology (2020) (0)
- Feature Vector Based Remaining Useful-Life Assessment in Mechanical Shock and Vibration for Leadfree Electronics (2022) (0)
- EFFECTS OF VOIDS ON REACTIVITY AND REACTOR STABILITY. (1971) (0)
- BallGridArray(BGA)Solder Joint Intermittency (2008) (0)
- Reliability Evaluation of Cu-Al WB in High Temperature and High Current Applications (2021) (0)
- Material Behavior of Mixed Formulation Solder Joints (2009) (0)
- Leading Prognostic Indicators for Health Management of Electronics Under Thermo-Mechanical Stresses (2007) (0)
- Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure (2022) (0)
- Multilayer Conductive Metallization with Offset Vias Using Aerosol Jet Technology (2022) (0)
- Packaging Reliability, Chip‐Scale Semiconductor (1999) (0)
- Feature Vector Identification and Prognostics of SAC305 PCB’s for Varying Conditions of Temperature and Vibration Loads (2020) (0)
- Improvements to the IES TM-28-14 Lumen Maintenance Standard: A Generalized Acceleration Factor Approach for Solid-State Lighting (2016) (0)
- Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications (2021) (0)
- Aging Effects in Sac+x Solders Exposed to High Temperatures (2021) (0)
- Influence of Component Interconnect with Printed Copper Circuits on Realized Mechanical and Electrical Characteristics in FHE Applications (2022) (0)
- Assessment of reliability of missile fuze using micro-CT data based finite element technique with digital volume correlation (2017) (0)
- Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for SAC-R after Sustained Exposure to 50°C (2021) (0)
- Reliability Assessment of Cu-Al WB under Automotive Temperatures in Presence of Ionic Contamination and Voltage Bias (2022) (0)
- Development of Process-Recipe for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink (2021) (0)
- Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for SAC-R after Sustained Exposure to 50°C (2022) (0)
- Prognostication of Accrued Damage and Impending Failure Under Temperature-Vibration in Leadfree Electronics (2019) (0)
- Evolution of Interfacial Properties under Long Term Isothermal Aging of PCB/Potting Compound Interfacial Samples under Pure Mode-I Loading (2022) (0)
- High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C (2020) (0)
- SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates (2022) (0)
- Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments (2022) (0)
- Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints (2021) (0)
- Study of Interface Monotonic and Fatigue Fracture Measurements at the Substrate Potting Compound Interfaces Under Flexure Loading (2022) (0)
- KL Transform and Neural-Net Based Framework for Failure Modes Classification in Electronics Subjected to Mechanical-Shock (2011) (0)
- TheInfluence ofElevated Temperature AgingonReliability ofLeadFreeSolder Joints (2007) (0)
- PHM of Leadfree Electronic Assemblies Using Resistance Spectroscopy With Sequential Importance Resampling (2011) (0)
- Leading Indicators of Damage for Prognostication of Leadfree Electronics Subjected to Multiple Thermo-Mechanical Environments (2009) (0)
- Process-Recipe Development for Printing of Multi-Layer Circuitry with Z-Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias (2022) (0)
- Condition-Based Assessment of Damage Progression During Mechanical Shock in Electronic Assemblies (2006) (0)
- Creep and Microstructure Evolutions in SAC305 Lead Free Solder Subjected to Different Thermal Exposure Profiles (2022) (0)
- Accelerated Life Cycling of Additively Printed Flexible Linear Charging Circuits and its Effect on Evolution of Line Resistance and Charging Current (2022) (0)
- Extreme Low-Temperature High Strain-Rate Constitutive Behavior Evolution of Doped and Undoped Leadfree Solders under Sustained High Temperature Exposure (2022) (0)
- Investigation and Comparison of Microstructural Changes in SAC and SAC+X Solders Exposed to Short-Term Aging (2020) (0)
- Life Prediction and RUL Assessment of Fine Pitch Solder Joint Fuze Electronics Under Mechanical Shock Loads Up to 50,000g (2016) (0)
- The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages (2017) (0)
- Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components (2022) (0)
- Process Development for Printing Copper Conductible Ink on Flexible Substrates using Aerosol Jet Printing Technology (2021) (0)
- Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging (2020) (0)
- Prognostic Health Monitoring of Damage Progression in Leadfree Electronics Under Sequential Exposure to Thermal Aging and Thermal Cycling (2010) (0)
- Electrical Parameter Variations in Bipolar Devices (2020) (0)
- Investigation and Comparison of Aging Effects in SAC+Bi Solders Exposed to High Temperatures (2021) (0)
- Prognostication of Cu-Al WB system subjected to high temperature-humidity condition (2016) (0)
- Process-Consistency in Additively Printed Multi-Layer Substrates With Offset Vias Using Aerosol Jet Technology (2021) (0)
- Reliability of State-of-health of the Flexible Li-ion Batteries Under Various Flexing Conditions and Calendar Aging (2022) (0)
- Experimental and Fe Modelling Study of Crack Propagation at the Pcb/underfill Interface Due to Iso-Thermal Aging (2021) (0)
- Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration (2009) (0)
- Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads (2021) (0)
- RT 186: Product Assurance for Electronics in Harsh Environments (2018) (0)
- Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics (2011) (0)
- Failure Mode Clustering is Electronic Assemblies Using Sammon’s Mapping With Supervised Training of Perceptrons (2011) (0)
- Reliability Assessment of Cu-Al WB Under High Temperature and High Voltage Bias Application (2020) (0)
- Effect of Voids on Thermo-Mechanical Reliability of QFN Solder Joints (2020) (0)
- Remaining Useful Life Estimation and Prognostication of SAC305 PCB's for Dynamic Conditions of Temperature and Vibration Loads (2021) (0)
- Printed Wiring Board Design and Fabrication (2018) (0)
- Nanomechanical Characterization of Aging Effects in Solder Joints in Microelectronic Packaging (2013) (0)
- Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits (2022) (0)
- Reliability of Silver Wire Bonds in Harsh Environments (RT 190) (2018) (0)
- Undoped and Doped Solder Performance under High Strain Rates and Wide Operating Temperatures after Prolonged Storage (2023) (0)
- Process-Reliability Relationships of SnBiAg and SnIn Solders for Component Attachment on Flexible Direct-Write Additive Circuits in Wearable Applications (2022) (0)
- Printed flexible LC filter using the micro-dispensing technique using silver conductive pasted and ECA for component attachment (2021) (0)
- Method for Assessment of Folding-Reliability of Flexible Electronics in Wearable Applications (2019) (0)
- Evolution of Die Stress and Delamination During Thermal Cycling of Flip Chip Assemblies (2005) (0)
- Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys (2021) (0)
- Interconnections and Connectors (2018) (0)
- Characterization of Die Stress Distributions in Area Array Flip Chip Packaging (2009) (0)
- Evolution of Creep Response of Various Materials Within Pbga Packages Exposed to Thermal Cycling Loading (2021) (0)
- Modeling Effect of Underfill Property Evolution on the FCBGA Reliability at Sustained Automotive Underhood Temperatures (2022) (0)
- LEADING INDICATORS FOR PROGNOSTICATION OF IMPENDING FAILURES ON CU-AL INTERCONNECTS (2013) (0)
- Anand Viscoplasticity Model for the Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temperature (2015) (0)
- Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Exposed to High Temperature (2021) (0)
- Effect of U-Flex-to-Install and Dynamic U-Flexing On Li-Ion Battery SOH Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates and Temperatures (2021) (0)
- Deep Learning Neural Network Approach for Correlation between Print Parameters and Realized Electrical Performance and Geometry on Ink-Jet Platform (2022) (0)
- Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock Using X-Ray Digital Volume Correlation (2017) (0)
- Evolution of Mechanical Properties of Sac305 Lead Free Solder Materials Subjected to Different Thermal Cycling Profiles (2021) (0)
- Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications (2022) (0)
This paper list is powered by the following services:
What Schools Are Affiliated With Pradeep Lall?
Pradeep Lall is affiliated with the following schools: