Pradeep Lall

Pradeep Lall's AcademicInfluence.com Rankings

Pradeep Lall

Engineering

#6497

World Rank

#7829

Historical Rank

Electrical Engineering

#1943

World Rank

#2045

Historical Rank

Applied Physics

#2086

World Rank

#2125

Historical Rank

engineering Degrees

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Engineering

Pradeep Lall's Degrees

PhD Electrical Engineering University of California, Berkeley
Masters Electrical Engineering University of California, Berkeley
Bachelors Electrical Engineering University of California, Berkeley

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Pradeep Lall's Published Works

Number of citations in a given year to any of this author's works

Total number of citations to an author for the works they published in a given year. This highlights publication of the most important work(s) by the author

Published Works

Prognostics and health management of electronics (2006) (472)
The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints (2007) (159)
Reliability of the aging lead free solder joint (2006) (148)
Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact (2004) (137)
The effects of aging temperature on SAC solder joint material behavior and reliability (2008) (129)
Model for BGA and CSP reliability in automotive underhood applications (2004) (122)
Determination of Anand constants for SAC solders using stress-strain or creep data (2012) (121)
Reduction of lead free solder aging effects using doped SAC alloys (2010) (112)
Prognostics and Health Management of Electronic Packaging (2006) (112)
Health monitoring for damage initiation & progression during mechanical shock in electronic assemblies (2006) (89)
Improved predictions of lead free solder joint reliability that include aging effects (2012) (88)
The effects of aging on the cyclic stress-strain behavior and hysteresis loop evolution of lead free solders (2011) (86)
The effects of SAC alloy composition on aging resistance and reliability (2009) (82)
Correlation of reliability models including aging effects with thermal cycling reliability data (2013) (81)
Health Monitoring for Damage Initiation and Progression During Mechanical Shock in Electronic Assemblies (2008) (80)
Effect of aging on the high strain rate mechanical properties of SAC105 and SAC305 leadfree alloys (2013) (78)
Characterization of aging effects in lead free solder joints using nanoindentation (2013) (75)
Leading indicators-of-failure for prognosis of electronic and MEMS packaging (2004) (74)
Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling (2006) (74)
High strain-rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature (2015) (70)
Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging (2016) (70)
Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages (2007) (70)
Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics Under Shock Loads (2007) (66)
Feature extraction and damage-precursors for prognostication of lead-free electronics (2006) (65)
High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics (2007) (64)
Prognostics Health Monitoring (PHM) for Prior-Damage Assessment in Electronics Equipment under Thermo-Mechanical Loads (2007) (63)
The effects of aging on the Anand viscoplastic constitutive model for SAC305 solder (2014) (62)
Feature extraction and health monitoring using image correlation for survivability of leadfree packaging under shock and vibration (2008) (60)
Prognostics Health Management of Electronic Systems Under Mechanical Shock and Vibration Using Kalman Filter Models and Metrics (2012) (60)
Solder-joint reliability in electronics under shock and vibration using explicit finite-element sub-modeling (2006) (60)
Prognostication and health monitoring of leaded and lead free electronic and MEMS packages in harsh environments (2005) (59)
The effects of aging on the fatigue life of lead free solders (2014) (57)
Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging (2008) (56)
Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging (2005) (55)
Exploration of aging induced evolution of solder joints using nanoindentation and microdiffraction (2014) (52)
Die stress characterization in flip chip on laminate assemblies (2005) (51)
Explicit submodeling and digital image correlation based life-prediction of leadfree electronics under shock-impact (2009) (51)
Extended Kalman Filter models and resistance spectroscopy for prognostication and health monitoring of leadfree electronics under vibration (2011) (51)
Prognostics using Kalman-Filter models and metrics for risk assessment in BGAs under shock and vibration loads (2010) (50)
Interrogation of system state for damage assessment in lead-free electronics subjected to thermo-mechanical loads (2008) (49)
Tutorial: temperature as an input to microelectronics-reliability models (1996) (48)
Evolution of the tension/compression and shear cyclic stress-strain behavior of lead-free solder subjected to isothermal aging (2012) (47)
Thermal cycling reliability of aged PBGA assemblies - comparison of Weibull failure data and finite element model predictions (2015) (47)
Nanomechanical characterization of SAC solder joints - reduction of aging effects using microalloy additions (2015) (47)
Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration (2008) (46)
Algorithms for prognostication of prior damage and residual life in lead-free electronics subjected to thermo-mechanical loads (2008) (45)
Resistance spectroscopy-based condition monitoring for prognostication of high reliability electronics under shock-impact (2009) (42)
Fundamentals of delamination initiation and growth in flip chip assemblies (2005) (42)
Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep (2017) (41)
The influence of temperature on integrated circuit failure mechanisms (1992) (40)
Thermal cycling reliability of lead‐free chip resistor solder joints (2004) (40)
Analysis of the mechanical behavior, microstructure, and reliability of mixed formulation solder joints (2009) (38)
Corner bonding of CSPs: processing and reliability (2005) (37)
Damage mechanics of electronics on metal-backed substrates in harsh environments (2006) (37)
Thermal cycling reliability of lead free solders for automotive applications (2004) (37)
Cyclic Stress-Strain Behavior of SAC305 Lead Free Solder: Effects of Aging, Temperature, Strain Rate, and Plastic Strain Range (2016) (37)
Measurement of thermally induced die stresses in flip chip on laminate assemblies (2004) (36)
Effects of aging on SAC-Bi solder materials (2016) (35)
[InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems] (2021) (35)
Mechanical characterization of doped SAC solder materials at high temperature (2016) (33)
The Anand parameters for SAC solders after extreme aging (2016) (32)
Visualization of Microstructural Evolution in Lead Free Solders during Isothermal Aging Using Time-Lapse Imagery (2017) (32)
High temperature creep response of lead free solders (2016) (31)
Continuous In-Situ Die Stress Measurements During Thermal Cycling Accelerated Life Testing (2007) (30)
Peridynamic-models using finite elements for shock and vibration reliability of leadfree electronics (2010) (30)
Evolution of the cyclic stress-strain behavior of doped SAC solder materials subjected to isothermal aging (2017) (29)
Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics under Shock Loads (2009) (29)
Influence of Temperature on Microelectronics and System Reliability : A Physics of Failure Approach (2020) (29)
Mechanical Characterization of SAC Solder Joints at High Temperature Using Nanoindentation (2017) (29)
Design envelopes and optical feature extraction techniques for survivability of SnAg leadfree packaging architectures under shock and vibration (2008) (29)
The anand parameters of aging resistant doped solder alloys (2017) (28)
Reliability of Copper, Gold, Silver, and PCC Wirebonds Subjected to Harsh Environment (2018) (26)
Effect of Temperature on the High Strain Rate Properties of SAC Leadfree Alloys at Temperatures up to 200°C (2016) (26)
Characterization of Doped SAC Solder Materials and Determination of Anand Parameters (2015) (25)
Characterization of functional relationship between temperature and microelectronic reliability (1995) (24)
Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter (2015) (23)
Reliability and Failure Modes of Solid-State Lighting Electrical Drivers Subjected to Accelerated Aging (2015) (23)
Mechanical characterization of SAC305 lead free solder at high temperatures (2016) (23)
High strain rate mechanical properties of SAC105 leadfree alloy at high operating temperatures (2014) (23)
Thermo-mechanical reliability tradeoffs for deployment of area array packages in harsh environments (2005) (22)
Evolution of the Cyclic Stress-Strain and Constitutive Behaviors of Doped Lead Free Solder During Fatigue Testing (2018) (22)
Use of prognostics in risk-based decision making for BGAs under shock and vibration loads (2010) (22)
Characterization of Material Damage and Microstructural Evolution Occurring in Lead Free Solders Subjected to Cyclic Loading (2018) (21)
Anomaly Detection and Classification for PHM of Electronics Subjected to Shock and Vibration (2012) (21)
Mitigation of lead free solder aging effects using doped SAC-X alloys (2012) (20)
Perspectives to understand risks in the electronic industry (1997) (20)
Development Of An Alternative Wire Bond Test Technique (1992) (20)
Experimental Characterization and Viscoplastic Modeling of the Temperature Dependent Material Behavior of Underfill Encapsulants (2011) (20)
Prognostication Based on Resistance-Spectroscopy for High Reliability Electronics Under Shock-Impact (2009) (20)
Characterization of microprocessor chip stress distributions during component packaging and thermal cycling (2010) (20)
Fault-mode classification for health monitoring of electronics subjected to drop and shock (2009) (20)
Evolution of the cyclic stress-strain and constitutive behaviors of SAC305 lead free solder during fatigue testing (2017) (20)
Damage mechanics of electronics on metal-backed substrates in harsh environments (2004) (20)
Reliability of lead-free SAC electronics under simultaneous exposure to high temperature and vibration (2012) (20)
In-Situ, Real-Time Detector for Faults in Solder Joint Networks Belonging to Operational, Fully Programmed Field Programmabmle Gate Arrays (FPGAS) (2006) (19)
Prediction of L70 Life and Assessment of Color Shift for Solid-State Lighting Using Kalman Filter and Extended Kalman Filter-Based Models (2015) (19)
Sustained damage and remaining useful life assessment in leadfree electronics subjected to sequential multiple thermal environments (2012) (19)
Digital-image correlation and XFEM based shock-reliability models for leadfree and advanced interconnects (2010) (19)
Application of stress sensing test chips to area array packaging (2009) (19)
AGING EFFECTS IN SAC SOLDER JOINTS (2009) (19)
Effect of Prolonged Storage up to 1-Year on the High Strain Rate Properties of SAC Leadfree Alloys at Operating Temperatures up to 200 °C (2017) (19)
Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments (2009) (19)
Nano-Underfills for High-Reliability Applications in Extreme Environments (2005) (19)
Ball Grid Array (BGA) Solder Joint Intermittency Detection: SJ BIST (2008) (19)
Prognostication of latent damage and residual life in leadfree electronics subjected to multiple thermal-environments (2009) (19)
Cohesive-Zone Explicit Sub-Modeling for Shock Life-Prediction in Electronics (2007) (18)
Cohesive-Zone Explicit Submodeling for Shock Life-Prediction in Electronics (2009) (18)
Prognostics and health monitoring of electronic systems (2011) (18)
Effect of high strain-rate on mechanical properties of SAC105 and SAC305 leadfree alloys (2012) (18)
High Temperature Mechanical Behavior of SAC and SAC+X Lead Free Solders (2018) (18)
Temperature dependence of microelectronic device failures (1990) (17)
Self-organized mapping of failure modes in portable electronics subjected to drop and shock (2010) (17)
Material behavior of SAC305 under high strain rate at high temperature (2014) (17)
Isothermal aging induced evolution of the material behavior of underfill encapsulants (2009) (17)
Survivability assessment of electronics subjected to mechanical shocks up to 25,000g (2016) (17)
BGA Reliability in Automotive Underhood Applications (2003) (17)
Modeling and reliability characterization of area-array electronics subjected to high-g mechanical shock up to 50,000g (2012) (17)
Non-destructive crack and defect detection in SAC solder interconnects using cross-sectioning and X-ray micro-CT (2014) (17)
Evaluation of Aging Induced Microstructural Evolution in Lead Free Solders Using Scanning Probe Microscopy (2018) (17)
High strain rate properties of SAC305 leadfree solder at high operating temperature after long-term storage (2015) (16)
Quantification and Modeling of Microstructural Evolution in Lead Free Solders During Long Term Isothermal Aging (2018) (16)
Decorrelated feature space and neural nets based framework for failure modes clustering in electronics subjected to mechanical-shock (2011) (16)
A physics-of-failure (POF) approach to addressing device reliability in accelerated testing of MCMs (1995) (16)
Real-Time Detection of Solder-Joint Faults in Operational Field Programmable Gate Arrays (2007) (16)
Assessment of residual damage in leadfree electronics subjected to multiple thermal environments of thermal aging and thermal cycling (2010) (16)
Life Prediction and Damage Equivalency for Shock Survivability of Electronic Components (2006) (16)
Assembly-level reliability of flex-substrate BGA, elastomer-on-flex packages and 0.5 mm pitch partial array packages (2000) (15)
Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging (2015) (15)
Decision-Support Models for Thermo-Mechanical Reliability of Leadfree Flip-Chip Electronics in Extreme Environments (2005) (15)
Comparison of Lalman-filter and extended Kalman-filter for prognostics health management of electronics (2012) (15)
Microstructural Indicators for Prognostication of Copper–Aluminum Wire Bond Reliability Under High-Temperature Storage and Temperature Humidity (2016) (15)
Prognostication of Residual Life and Latent Damage Assessment in Lead-Free Electronics Under Thermomechanical Loads (2011) (15)
A framework for reliability modeling of electronics (1995) (15)
Thermal reliability considerations for Deployment of area array packages in harsh environments (2004) (15)
Stress–Strain Behavior of SAC305 at High Strain Rates (2015) (15)
Measurements and modeling of the temperature dependent material behavior of underfill encapsulants (2003) (14)
Measurement of die stresses in microprocessor packaging due to thermal and power cycling (2012) (14)
Challenges in accelerated life testing (2004) (14)
Mechanical Characterization of Intermetallic Compounds in SAC Solder Joints at Elevated Temperatures (2018) (14)
Effects of Mechanical Cycling on the Microstructure of SAC305 Lead Free Solder (2018) (14)
Mechanical deformation behavior of SAC305 at high strain rates (2012) (14)
Evolution of the Mechanical Behavior of Lead Free Solders Exposed to Thermal Cycling (2019) (14)
Particle filter models and phase sensitive detection for prognostication and health monitoring of leadfree electronics under shock and vibration (2011) (14)
Microstructural Evolution in SAC+X Solders Subjected to Aging (2019) (13)
Time–Frequency and Autoregressive Techniques for Prognostication of Shock-Impact Reliability of Implantable Biological Electronic Systems (2008) (13)
L70 life prediction for solid state lighting using Kalman Filter and Extended Kalman Filter based models (2013) (13)
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING BOARD OF GOVERNORS (Continued on back cover) President (2004) (13)
Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics (2012) (13)
System Design Issues for Harsh Environment Electronics Employing Metal-Backed Laminate Substrates (2008) (13)
Development of Test Protocols for the Flexible Substrates in Wearable Applications (2018) (13)
Impelementatoin of a viscoelastic model for the temperature dependent material behavior of underfill encapsulants (2012) (13)
Board trace fatigue models and design guidelines for electronics under shock-impact (2010) (13)
Evolution of high strain rate and high temperature mechanical properties of SAC305 with long term storage up to 1-year (2017) (13)
Effect of 100°C Aging for Periods of up to 120-days on High Strain Rate Properties of SAC305 Alloys (2020) (12)
X-ray micro-CT and digital-volume correlation based three-dimensional measurements of deformation and strain in operational electronics (2015) (12)
Prognostication of accrued damage in board assemblies under thermal and mechanical stresses (2012) (12)
Reliability of flip chip assemblies subjected to extreme low temperatures (2006) (12)
Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling (2018) (12)
Finite Element Parametric Analysis on Fine-Pitch BGA (FBGA) Packages (2003) (12)
Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders (2018) (12)
Micro Indentation Measurements of the Creep Properties of CABGA Doped Solder Joint (2021) (12)
High temperature tensile and creep behavior of lead free solders (2017) (12)
A Comparative Study of the High Temperature Mechanical Behavior of Lead Free Solders (2018) (12)
Principal component analysis based development of Norris-Landzberg acceleration factors and Goldmann Constants for leadfree electronics (2009) (11)
The Influence of Poisson’s Ratio on the Reliability of SAC Lead Free Solder Joints (2018) (11)
High strain rate mechanical behavior of SAC-Q solder (2017) (11)
The Effect of Bi on the Mechanical Properties of Aged SAC Solder Joint (2020) (11)
Thermal Cycling Reliability Predictions for PBGA Assemblies That Include Aging Effects (2013) (11)
Effect of Aging on the Fatigue Life and Shear Strength of SAC305 Solder Joints in Actual Setting Conditions (2019) (11)
Effect of Different Thermal Cycling Profiles on the Mechanical Behavior of SAC305 Lead Free Solder (2020) (11)
Measurement of the temperature dependent constitutive behavior of underfill encapsulants (2005) (11)
Anand Parameters for Modeling Prolonged Storage on High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder at High Operating Temperature (2018) (11)
Squeezing the chip: The buildup of compressive stress in a microprocessor chip by packaging and heat sink clamping (2011) (11)
Aging induced evolution of free solder material behavior (2008) (11)
Ultra-High Reliability Flip Chip on Laminate For Harsh Environments (2005) (10)
Prognostics Health Monitoring (PHM) for Prior Damage Assessment in Electronics Equipment Under Thermo-Mechanical Loads (2011) (10)
Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging (2018) (10)
High-G shock reliability of ceramic area-array packages (2012) (10)
Test Protocol for Assessment of Flexible Power Sources in Foldable Wearable Electronics under Stresses of Daily Motion during Operation (2017) (10)
Principal component regression models for life prediction of plastic ball grid arrays on copper-core and no-core assemblies (2008) (10)
Aging induced evolution of the cyclic stress-strain behavior of lead free solders (2016) (10)
Thermomechanical failures in microelectronic interconnects (1998) (10)
Assembly-level reliability characterization of chip-scale packages (1998) (10)
Color shift analysis and modeling of high power warm white pc-LED under high temperature and high humidity environment (2017) (10)
Effects of Test Temperature and Prior Aging on the Cyclic Stress-Strain Behavior of Lead Free Solders (2019) (10)
Prognostics of Damage Accrual in SSL Luminaires and Drivers Subjected to HTSL Accelerated Aging (2013) (10)
Effect of Process Parameters on Aerosol Jet Printing of Multi-Layer Circuitry (2019) (10)
Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs (2015) (10)
Reliability characterization of the SLICC package (1996) (10)
Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping (2012) (10)
Characterization of die stresses in flip chip on laminate assemblies using (2003) (10)
Mechanical Behavior Evolution of SAC+Bi Lead Free Solder Exposed to Thermal Cycling (2020) (10)
Constitutive Behavior of SAC Leadfree Alloys at High Strain Rates (2011) (9)
Prognostication of copper-aluminum wirebond reliability under high temperature storage and temperature-humidity (2014) (9)
Effect of Shallow Cycling on Flexible Power-Source Survivability under Bending Loads and Operating Temperatures Representative of Stresses of Daily Motion (2018) (9)
Methodologies for Prognostication and Health Monitoring of Leaded and Lead Free Electronics and MEMS Packages in Harsh Environments (2005) (9)
A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures (2015) (9)
Thermo-mechanical reliability of SAC leadfree alloys (2010) (9)
Effect of Sintering Temperature on the Fatigue Life of Additively Printed Electronics During Cyclic Bending (2019) (9)
The effects of silver content and solidification profile on the Anand constitutive model for SAC lead free solders (2014) (9)
Leading indicators for prognostic health management of electrical connectors subjected to random vibration (2012) (9)
PHM-based residual life computation of electronics subjected to a combination of multiple cyclic-thermal environments (2010) (9)
Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder (2017) (9)
PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads (2017) (9)
Extreme Cold-Temperature High-Strain Rate Properties of SAC Solder Alloys (2020) (8)
Degradation mechanisms in electronic mold compounds subjected to high temperature in neighborhood of 200°C (2014) (8)
Assessment of Lumen Degradation and Remaining Life of LEDs Using Particle Filter (2013) (8)
Property-Performance Relationships for Sustained High Temperature Operation of Electronics (2020) (8)
The influence of aging on the stress-strain and creep behavior of SAC solder alloys (2010) (8)
The Degradation Mechanisms of Underfills Subjected to High Temperature Long Term Aging (2020) (8)
Fault-isolation in portable electronics subjected to drop and shock (2010) (8)
Improved Submodeling Finite Element Simulation Strategies for BGA Packages Subjected to Thermal Cycling (2018) (8)
Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments (2015) (8)
Effect of Prolonged Storage on High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder at High Operating Temperature (2018) (8)
Prediction of lumen output and chromaticity shift in LEDs using Kalman Filter and Extended Kalman Filter based models (2013) (8)
Interrogation of accrued damage and remaining life in field-deployed electronics subjected to multiple thermal environments of thermal aging and thermal cycling (2011) (8)
Bayesian models for life prediction and fault-mode classification in solid state lamps (2015) (8)
FATIGUE AND SHEAR PROPERTIES OF HIGH RELIABLE SOLDER JOINTS FOR HARSH APPLICATIONS (2018) (8)
Creep Behavior of Various Materials Within PBGA Packages Subjected to Thermal Cycling Loading (2020) (8)
Effect of simultaneous high temperature and vibration on MEMS based vibratory gyroscope (2017) (8)
High strain-rate mechanical properties of SnAgCu leadfree alloys (2011) (8)
Time-frequency and auto-regressive techniques for prognostication of shock-impact reliability of implantable biological electronic systems (2008) (8)
Reliability of solid-state lighting electrical drivers subjected to WHTOL accelerated aging (2014) (8)
A comparison of temperature and humidity effects on phosphor converted LED package and the prediction of remaining useful life with state estimation (2016) (8)
Leading-Indicators Based on Impedance Spectroscopy for Prognostication of Electronics Under Shock and Vibration Loads (2009) (8)
Nanoindentation Testing of SAC305 Solder Joints Subjected to Thermal Cycling Loading (2019) (8)
Measurement of the temperature dependent constitutive behavior of underfill encapsulants (2004) (8)
Risk Management Models for Flip-Chip Electronics in Extreme Environments (2006) (8)
Mechanical Behavior Evolution of SAC305 Lead Free Solder Joints under Thermal Cycling (2019) (7)
Multiphysics-modeling of corrosion in copper-aluminum interconnects in high humidity environments (2015) (7)
Investigation of Aging Induced Microstructural Changes in Doped SAC+X Solders (2019) (7)
High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days (2021) (7)
Effect of Shock Angle on Solder-Joint Reliability of Potted Assemblies Under High-G Shock (2020) (7)
Principal Components Regression Model for Prediction of Acceleration Factors for Copper-Aluminum Wirebonds Subjected to Harsh Environments (2016) (7)
Die stress variation in area array components subjected to accelerated life testing (2008) (7)
High Strain-Rate Properties for SAC305 at Cold Operating Temperatures down to -65°C (2020) (7)
Effects of aging on the stress-strain and creep behaviors of lead free solders (2006) (7)
High strain rate stress-strain measurement of SAC105 leadfree alloy at temperatures up to 200°C (2016) (7)
Prediction of L70 lumen maintenance and chromaticity for LEDs using extended Kalman filter models (2013) (7)
Prognostication of remaining useful-life for flexible batteries in foldable wearable electronics (2016) (7)
Investigation on the Mechanical Behavior Evolution Occurring in Lead Free Solder Joints Exposed to Thermal Cycling (2020) (7)
Measurement and Prediction of Interface Crack Growth at the PCB-Epoxy Interfaces Under High-G Mechanical Shock (2018) (7)
Investigation of Microstructural Evolution in SAC Solders Exposed to Short-Term and Long-Term Aging (2018) (7)
Prognostication of the effect of mean temperature of thermal cycle on SAC305 leadfree reliability using damage pre-cursors (2014) (6)
Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability Under Vibration (2014) (6)
Experimental Characterization of the Dependence of the Poisson's Ratio of Lead Free Solder on Temperature, Strain Rate, Solidification Profile, and Isothermal Aging (2019) (6)
The Effects of Aging of the Cyclic Stress-Strain and Fatigue Behaviors of Lead Free Solders (2013) (6)
Effect of Surface Finish on the Fatigue Behavior of Bi-based Solder Joints (2019) (6)
Model for prediction of package-on-package warpage and the effect of process and material parameters (2013) (6)
Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys (2019) (6)
Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C (2020) (6)
Drop Reliability of Corner Bonded CSP in Portable Products (2003) (6)
The Poisson's Ratio of Lead Free Solder - The Often Forgotten But Important Material Property (2019) (6)
Creep test method for determination of Anand parameters for lead free solders and their variation with aging (2014) (6)
Comparison of particle filter using SIR algorithm with self-adaptive filter using ARMA for PHM of Electronics (2012) (6)
Identification of failure modes in portable electronics subjected to mechanical-shock using supervised learning of damage progression (2011) (6)
Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder (2019) (6)
EFFECTS OF MIXING SOLDER SPHERE ALLOYS WITH BISMUTH-BASED PASTES ON THE COMPONENT RELIABILITY IN HARSH THERMAL CYCLING (2018) (6)
3-D Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion (2019) (6)
Reliability of MEMS devices under multiple environments (2014) (6)
Mechanical Characterization and Microstructural Evolution of SAC and SAC+X Lead Free Solders Subjected to High Temperature Aging (2019) (6)
Evolution of Anand Parameters for SAC-Q Solder Alloy after Prolonged Storage up to 1-Year at High Strain Rate at Very High Operating Temperature (2019) (6)
Effects of moisture exposure on the mechanical behavior of flip chip underfills in microelectronic packaging (2014) (6)
Physical aging and evolving mechanical behavior of underfill encapsulants (2008) (6)
Evolution of the Mechanical Properties of Lead Free Solder Joints Subjected to Mechanical Cycling (2019) (5)
A PoF approach to addressing defect-related reliability (1994) (5)
Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Mechanical Shock Environments (2015) (5)
Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments (2007) (5)
Characterization of Moisture Induced Die Stresses in Flip Chip Packaging (2016) (5)
The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders (2018) (5)
Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging (2013) (5)
Modeling Deformation Behavior of Multiple Grained SAC305 Solder Joints (2020) (5)
Prognostics and condition monitoring of electronics (2009) (5)
Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures (2017) (5)
Deformation Behavior of SAC305 Solder Joints With Multiple Grains (2020) (5)
Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone (2017) (5)
Transient dynamics model and 3D-DIC analysis of new-candidate for JEDEC JESD22-B111 test board (2014) (5)
Characterization of Viscoelastic Response of Underfill Materials (2019) (5)
Characterization of Die Stresses in CBGA Packages due to Component Assembly and Heat Sink Clamping (2011) (5)
Effect of Elevated Storage Temperature on the High Strain Rate Mechanical Properties of SAC305 Solder (2019) (5)
Reliability Studies for Package-on-Package Components in Drop and Shock Environments (2011) (5)
Level of damage and remaining useful life assessment in leadfree electronics subjected to multiple thermo-mechanical environments (2012) (5)
Mechanical Properties and Microstructural Fatigue Damage Evolution in Cyclically Loaded Lead-Free Solder Joints (2019) (5)
Determination of Anand Parameters From Creep Testing of SAC305 Solder Joints (2020) (5)
Nanomechanical Characterization of Lead Free Solder Joints (2014) (5)
Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration (2018) (5)
Long term isothermal aging effects on the cyclic stress-strain behavior of Sn-Ag-Cu solders (2017) (5)
Effect of Thermal Cycling on Reliability of QFN Packages (2018) (5)
Evaluation of the Creep Response of Lead Free Solder Materials Subjected to Thermal Cycling (2020) (5)
Interrogation of thermo-mechanical damage in field-deployed electronics (2012) (5)
Assessment of Accrued Damage and Remaining Useful Life in Leadfree Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling (2012) (5)
Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot (2013) (5)
The influence of aging on the creep behavior of underfill encapsulants (2010) (5)
A Study on the Effect of Mean Cyclic Temperature on the Thermal Fatigue Reliability of SAC Solder Joints Using Digital Image Correlation (2015) (5)
Effect of Sintering Time and Sintering Temperature on the Mechanical and Electrical Properties of Aerosol-Jet Additively Printed Electronics (2019) (5)
Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours (2019) (5)
High Temperature Aging Effects in SAC and SAC+X Lead Free Solders (2019) (5)
Factors Influencing the Line Consistency of Commonly Used Geometries for Additively Printed Electronics (2019) (5)
Cost assessment for implementation of embedded prognostic health management for electronic systems (2012) (5)
Drop-Impact Reliability of Chip-Scale Packages in Handheld Products (2003) (5)
Reliability of Additively Printed Traces on Polymer Substrates Subjected to Mechanical Stretching (2019) (5)
Study on the effect of fixtures on deformation and warpage of the double-sided flexible printed circuit board through reflow using DIC (2017) (5)
Failure mechanisms and color stability in light-emitting diodes during operation in high-temperature environments in presence of contamination (2015) (5)
Multiphysics Life-Prediction Model Based on Measurements of Polarization Curves for Copper-Aluminum Intermetallics (2016) (5)
Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources (2019) (5)
Nanomechanical characterization of IMCs formed in SAC solder joints subjected to isothermal aging (2017) (5)
Nanomechanical Characterization of Intermetallic Compounds in Lead Free Solder Joints (2018) (5)
ANN based RUL assessment for copper-aluminum wirebonds subjected to harsh environments (2016) (5)
Real-Time BIST Detector for BGA Faults in Field Programmable Gate Arrays (FPGAs) (2006) (5)
Damage pre-cursor based assessment of impact of high temperature storage on reliability of leadfree electronics (2013) (4)
Health Monitoring and Feature Vector Identification of Failure for SAC305 Solder PCB’s under Shock Loads up to 10,000g (2020) (4)
Effect of Use Parameters on Fatigue-Life of Flexible Substrates under Bending Loads (2019) (4)
Thermal performance of underfilled BGAs (2004) (4)
Solid State Lighting Life Prediction Using Extended Kalman Filter (2013) (4)
Prognostication and Health Monitoring of Electronics in Implantable Biological Systems (2008) (4)
Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact (2012) (4)
Influence of Surface Segregation on Wetting of Sn-Ag-Cu (SAC) Series and Pb-Containing Solder Alloys (2011) (4)
Process-Consistency-Performance Relationships for Additively Printed Z-axis Interconnects in Multilayer Circuits (2020) (4)
Life prediction and classification of failure modes in solid state luminaires using Bayesian Probabilistic Models (2014) (4)
Capacity Degradation of Flexible Li-Ion Power Sources Subjected to Shallow Discharging (2019) (4)
High Temperature High Strain Rate Properties of SAC305 with Effect of 100°C Storage for Prolonged Duration (2021) (4)
Stress Strain Analysis on Stitch Bond of Cu-Al Wirebonds Using X-ray Micro-CT Technique (2019) (4)
Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage (2018) (4)
Evolution of the Microstructure of Lead Free Solders Subjected to Both Aging and Cyclic Loading (2019) (4)
Effect of Shallow Charging on Flexible Power Source Capacity Subjected to Varying Charge Protocols and C-Rates (2019) (4)
Resistance Spectroscopy Based Assessment of Degradation in Cu-Al Wire Bond Interconnects (2013) (4)
Degradation of thermal performance of ball grid arrays after thermal cycling (2006) (4)
Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments (2017) (4)
Degradation Mechanisms of Epoxy Molding Compound Subjected to High Temperature Long Term Aging (2021) (4)
Effects of Shear Cycling on the Mechanical Properties of SAC and SAC+X Lead Free Solder Joints (2019) (4)
A Revised Anand Constitutive Model for Lead Free Solder That Includes Aging Effects (2013) (4)
Prognostic health monitoring for a micro-coil spring interconnect subjected to drop impacts (2013) (4)
Investigation of the Mechanical Behavior of SAC305 Solder Joints at Extreme High Temperatures Using Nanoindentation (2020) (4)
Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation (2020) (4)
Remaining Useful Life Assessment of Field Deployed Electronics Using X-Ray Micro-CT Based Digital Volume Correlation and Finite-Element Analysis (2016) (4)
Electrically Conductive Adhesive Interconnections on Additively Printed Substrates (2021) (4)
Fatigue Performance of Doped SAC Solder Joints in BGA Assembly (2020) (4)
Feature Extraction and RUL Prediction of SAC Solder Alloy Packages by Different Statistical and Time-frequency Analysis Techniques under Simultaneous Temperature-Vibration Loads (2018) (4)
High Strain-Rate Constitutive Behavior of SAC305 Solder During Operation at High Temperature (2014) (4)
Evolution of Viscoelastic Properties and Interface-Fracture Toughness Under Sustained High Temperature Operation Typical of Automotive Underhood for up to 1-year (2021) (4)
Effect of Long Term Isothermal Exposure on Underfill Material Properties (2020) (4)
Mechanical Property Evolution in SAC+Bi Lead Free Solders Subjected to Various Thermal Exposures (2021) (4)
Temperature as a Reliability Factor (2020) (4)
Moisture-Induced Die Stresses in PBGA Packages Exposed to Various Environments (2018) (4)
Process-Consistency in Additive Printed Multilayer Substrates With Offset-Vias Using Aerosol Jet Technology (2020) (4)
Nanomechanical characterization of SAC305 solder joints - effects of aging (2014) (4)
FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling (2015) (4)
A study on damage progression in MEMS based Silicon oscillators subjected to high-g harsh environments (2016) (4)
Prognostication of solder-joint reliability of 0.4mm and 0.5mm pitch bgas subjected to mechanical shocks up to 10,000G (2015) (4)
Effect of Prolonged Storage Up to 1-Year on Anand Parameters for SAC105 Leadfree Alloys (2019) (4)
A Study on Die Stresses in Flip Chip Package Subjected to Various Hygrothermal Exposures (2018) (4)
High Strain Rate Properties of SAC305 Alloy at Cold Temperatures Subsequent to 100°C Storage for Periods up to 120 Days (2021) (4)
Effect of Aging on Component Reliability in Harsh Thermal Cycling (2019) (4)
Computational Methods and High Speed Imaging Methodologies for Transient-Shock Reliability of Electronics (2007) (4)
Nanomechanical Characterization of Various Materials within PBGA Packages Subjected to Thermal Cycling Loading (2020) (4)
Effect of Green EMCs on Fatigue Reliability of Molded Cu Wirebond System (2018) (4)
Effects of Aging on the Damage Accumulation in SAC305 Lead Free Solders Subjected to Cyclic Loading (2019) (4)
Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints (2015) (4)
De-bonding simulation of Cu-Al wire bond intermetallic compound layers (2016) (3)
Effect of EMCs on the high current reliability of Cu wirebonds operating in harsh environments (2017) (3)
Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion Subjected to Highly-Accelerated Stress Test (2018) (3)
Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies (2015) (3)
Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation (2021) (3)
Fatigue Performance of Ball Grid Array Components at Elevated Temperature (2021) (3)
SSL and LED life prediction and assessment of CCT shift (2014) (3)
Electronic Packaging Applications (2008) (3)
Interfacial Fracture Toughness of PCB/Epoxy Interfaces Under Three Point and Four Point Loading with Sustained High Temperature Exposure (2021) (3)
Influence of Quantifiable Extrinsic Stresses on Tin Whisker Growth (2009) (3)
High Strain Rate Properties of M758 Solder at Extreme Operating Temperatures (2021) (3)
Sustained High-Temperature Vibration Reliability of Thermally Aged Leadfree Assemblies in Automotive Environments (2020) (3)
Effect of storage on high strain rate mechanical properties of SAC105 at operating temperature up to 200°C (2017) (3)
Non-Perpendicular High-G Shock on Potted Fine Pitch Electronics Under Sustained High Temperature Aging (2021) (3)
Nano-underfills and Potting Compounds for Fine-Pitch Electronics (2018) (3)
Mechanical Design of Electronic Systems (2017) (3)
Flexure and Twist Test Reliability Assurance of Flexible Electronics (2019) (3)
LED Lumen Degradation and Remaining Life Under Exposure to Temperature and Humidity (2013) (3)
A novel Micro-CT data based Finite Element Modeling technique to study reliability of densely packed fuze assemblies (2016) (3)
Improved meshing strategy for finite element modeling of PBGA thermal cycling (2016) (3)
Models for Shock and Vibration Survivability of Electronic and MEMS Packaging (2005) (3)
Effects of aging on shear cyclic stress strain and fatigue behaviors of lead free solder joints (2014) (3)
Additively Printed Multilayer Substrate Using Aerosol-Jet Technique (2020) (3)
Comparison of FEA Modeling Techniques for Plastic Ball Grid Array Assemblies (2018) (3)
Effect of Fatigue on Individual SAC305 Solder Joints Reliability at Elevated Temperature (2020) (3)
Prognostic indicators for Cu-Al wirebond degradation under operation at elevated temperature and combined temperature humidity (2014) (3)
Effect of Print Parameters on Print Consistency of Aerosol Jet Printed Electronics (2019) (3)
DIC Based Investigation Into the Effect of Mean Temperature of Thermal Cycle on the Strain State in SnAgCu Solder Joint (2015) (3)
Improved finite element modeling strategies with multipoint constraints for BGA packages subjected to thermal cycling (2017) (3)
Evolution of Prony Parameters for Underfills Subjected to High Temperature Long Term Aging (2021) (3)
Development of FE Models and Measurement of Internal Deformations of Fuze Electronics Using X-Ray MicroCT Data with Digital Volume Correlation (2017) (3)
KEYNOTE PRESENTATION Prognostics and Health Monitoring of Electronic Systems (2011) (3)
Fatigue Performance of Aged SAC-Bi Solder Joint under Varying Stress Cycling (2021) (3)
Health Monitoring of PCB’s Under Mechanical Shock Loads (2019) (3)
Flexible Wearable Biometric Band and Smartphone Application for Prevention of Sudden Causes of Death (2018) (3)
Low Temperature High Strain Rate Material Properties for SAC-Q Leadfree Alloys (2020) (3)
Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads (2008) (3)
PBGA package Finite Element Analysis based on the physical geometry modeling using X-ray micro CT digital volume reconstruction (2016) (3)
Model for Inverse Determination of Process and Material Parameters for Control of Package-on-Package Warpage (2015) (3)
Transactions on Components and Packaging Technologies Editors CPMT Transactions Editor-in-Chief (2009) (3)
Effect of Shock Pulse Variation on Surface Mount Electronics under High-G Shock (2019) (3)
Effect of Process Parameters on the Long-Run Print Consistency and Material Properties of Additively Printed Electronics (2019) (3)
Particle swarm optimization with extended Kalman filter for prognostication of accrued damage in electronics under temperature and vibration (2012) (3)
Latent damage assessment and prognostication of residual life in airborne lead-free electronics under thermo-mechanical loads (2008) (3)
Stress measurements in large area array flip chip microprocessor chips (2008) (3)
Reliability of SAC Leadfree Solders in Automotive Underhood Temperature-Vibration (2018) (3)
Comparison of Thermal Cycling Induced Mechanical Property Evolutions in Bulk Solder and Solder Joints (2021) (3)
RUL Estimations of SAC305 Solder PCB's under Different Conditions of Temperature and Vibration Loads (2020) (3)
Measurement of die stress distributions in flip chip CBGA packaging (2010) (3)
Low-Temperature High Strain Rate Constitutive Behavior of Doped and Undoped SnAgCu Solder Alloys after Prolonged Storage at High Temperature (2021) (3)
Prognostication of Damage in Automotive Underhood Electronics Subjected to Temperature and Vibration (2018) (3)
Characterization of die stresses in microprocessor packages subjected to thermal cycling (2012) (3)
Damage pre-cursor based life prediction of the effect of mean temperature of thermal cycle on the SnAgCu solder joint reliability (2014) (3)
Experimental Characterization of Underfill Materials Exposed to Moisture Including Preconditioning (2015) (3)
PHM of Leadfree Interconnects Using Resistance Spectroscopy Based Particle Filter Models for Shock and Vibration Environments (2011) (3)
Effect of Thermal Aging on the Evolution of Anand Parameters for SAC105 Leadfree Alloys Operating at Cold Temperatures down to -55 °C (2020) (3)
Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT (2017) (3)
X-ray micro-CT and DVC based analysis of strains in metallization of flexible electronics (2017) (3)
Package-level multiphysics simulation of Cu-Al WB corrosion under high temperature/humidity environmental conditions (2017) (3)
Correlation of Accelerated Tests with Human Body Measurements for Flexible Electronics in Wearable Applications (2020) (3)
Finite element models for simulation of wear in electrical contacts (2008) (2)
A Novel Numerical Multiphysics Framework for the Modeling of Cu-Al Wire Bond Corrosion under HAST Conditions (2018) (2)
PHM of state-of-charge for flexible power sources in wearable electronics with EKF (2018) (2)
Effect of reflow process on glass transition temperature of printed circuit board laminates (2012) (2)
Mechanical Characterization of Solder Mask Materials (2018) (2)
Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment (2021) (2)
Models for Reliability of Fine-Pitch BGAs and CSPs in Shock and Drop Impact (2004) (2)
Development of survivability envelopes for SnAg leadfree packaging architecures under shock and vibration (2008) (2)
Mechanical Behavior and Reliability of SAC+Bi Lead Free Solders with Various Levels of Bismuth (2021) (2)
Accrued Damage and Remaining Life in Field Extracted Assemblies Under Sequential Thermo-Mechanical Loads (2011) (2)
Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning (2021) (2)
Measurement of Stress and Delamination in Flip Chip on Laminate Assemblies (2003) (2)
Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics (2013) (2)
Influence of Tempemture on Microelectronics and System Reliability (2020) (2)
Anand Parameters for Eutectic Tin-Bismuth Solder (2021) (2)
Aging Effects on the Mechanical Behavior and Reliability of SAC Alloys (2009) (2)
Model for Interaction of EMC Formulation with Operating Current and Reliability of Cu-Al Wirebonds Operating in Harsh Environments (2017) (2)
A Life-Cycle Approach To Design And Manufacturing Simulation Of Multichip Modules (1996) (2)
A Physics-of-Failure Approach to IC Burn-In (2020) (2)
Experimental characterization of underfill materials exposed to different moisture conditions (2017) (2)
Evolution of the Properties of SAC-Bi-Ni-Sb Lead Free Solder During Mechanical Cycling (2020) (2)
Prognostics Health Management Model for LED Package Failure Under Contaminated Environment (2015) (2)
LED Chip Deformation Measurement During the Operation Using the X-Ray CT Digital Volume Correlation (2015) (2)
Sintering Process Conditions for Additive Printing of Multi-Layer Circuitry Aerosol-Jet Process in Conjunction with Nanoparticle Ink (2020) (2)
Prognostication of LED remaining useful life and color stability in the presence of contamination (2015) (2)
Investigation and Comparison of Aging Effects in SAC+X Solders Exposed to High Temperatures (2020) (2)
Low Temperature Solder Interconnection of Surface Mount Devices with Additively Printed Pads on Flexible Substrate (2021) (2)
Thermo-mechanical Deformation in Flexible-Board Assemblies During Reflow and Post-Assembly Usage (2018) (2)
Interconnection of Passive Components using Printed Aerosol-Jet Traces (2021) (2)
Evolution of High Strain Rate Mechanical Properties of SAC-R with High Temperature Storage at 50°C with High and Low Operating-Temperatures (2020) (2)
Accuracy, Hysteresis and Extended Time Stability of Additively Printed Temperature and Humidity Sensors (2020) (2)
PCR for Derivation of Parameter Dependencies, Thermo-Mechanical Norris-Landzberg Acceleration Factors, Goldmann Fatigue Constants for Leadfree Electronics (2009) (2)
Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads (2021) (2)
Low Operating-Temperature High Strain Rate Constitutive Behavior of SnAgCu Solder Alloys after Prolonged Storage at High Temperature (2021) (2)
Classification of location of damage in package-on-package (PoP) assemblies using ANN with feature vectors for progression of accrued damage (2012) (2)
Thermal Cycling Reliability of Chip Resistor Lead Free Solder Joints (2003) (2)
Surfaces of mixed formulation solder alloys at melting (2011) (2)
Effects of Physical Aging on the Stress-Strain and Creep Behaviors of Lead Free Solders (2006) (2)
Effect of Bismuth Content on the Mechanical Cyclic Properties of SAC+Bi Lead Free Solders (2021) (2)
Reliability of Leadfree Solders in High Temperature Vibration in Automotive Environments (2019) (2)
Damage Evolution in MEMS Pressure Sensors during High Temperature Operating Life and Prolonged Storage at Sub-Zero Temperature (2018) (2)
Process Recipes for Additively Printed Copper-Ink Flexible Circuits using Direct Write Methods (2021) (2)
Prognosis Methodologies for Health Management of Electronics and MEMS Packaging (2004) (2)
Effect of Drop Angle Variation and Restraint Mechanisms on Surface Mount Electronics Under High G Shock (2019) (2)
Damage Progression Using Speckle‐Correlation and High‐Speed Imaging for Survivability of Leadfree Packaging Under Shock (2009) (2)
Micromechanical Modeling of SAC305: Homogenization and Effect of IMC Particles on Deformation Behavior (2021) (2)
Material Characterization and Die Stress Measurement of Low Expansion PCB for Extreme Environments (2005) (2)
Temperature and Time-dependent Property Prediction and Validation for Nano-Underfills using RSA based RVE Algorithms (2006) (2)
Prognostic and RUL Estimations of SAC105, SAC305,and SnPb Solders under Different Drop and Shock Loads using Long Short-Term Memory (LSTM) Deep Learning Technique (2021) (2)
Modeling of Effect of Underfill Properties on Flip Chip Bumps and Solder Balls of FCBGA Package in Automotive Underhood Applications (2021) (1)
Bayesian probabilistic model for life prediction and fault mode classification of solid state luminaires (2014) (1)
Effect of Thermal Aging on the Interface Fracture Toughness of the PCB-UF Interface (2020) (1)
Study of the Effect of Solder-Joint Voiding using X-ray MicroCT Data-based FE Models with Experimental Validation (2019) (1)
Evolution of the Stress-Strain and Creep Behavior of Underfill Encapsulants With Aging (2009) (1)
Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages (2015) (1)
Process Development for Printed Copper with Surface Mount Devices On Inkjet Metallization (2022) (1)
Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics (2017) (1)
Cooling in Electronic Applications (1999) (1)
Time-Frequency Analysis and Built-In Reliability Test for Health Monitoring of Electronics Under Shock Loads (2007) (1)
Novel Flexible Bioelectronics Device and Software Application for Prevention of Sudden Causes of Death (2018) (1)
Effect of Dynamic Folding with Varying Fold Orientations and C-rates on Flexible Power Source Capacity Degradation (2020) (1)
Effect of Charging Cycle Elevated Temperature Storage and Thermal Cycling on Thin Flexible Batteries in Wearable Applications (2019) (1)
Computer Aided Design And Reliability Assessment Of Microelectronic Packages (1970) (1)
Effectiveness of potting methods and underfills on the enhancement of survivability of fine pitch electronics at 25,000g shock loads (2017) (1)
Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink (2020) (1)
Die Stress Variation During Thermal Cycling Reliability Tests (2007) (1)
Extended-Time Process Consistency and Process-Property Relationships for Flexible Additive-Printed Electronics (2020) (1)
Thermal Cycling Reliability of Lead-Free Solder Alloys using Surface Mount Resistors Considering Aging (2021) (1)
Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment (2021) (1)
Prognostics health management of electronic systems — A reliability physics approach (2018) (1)
Mechanical Property and Microstructure Evolution in SAC and $\text{SAC} +\mathrm{X}$ Lead Free Solders Exposed to Various Thermal Cycling Profiles (2021) (1)
Folding-Reliability of Flexible Electronics in Wearable Applications (2019) (1)
Flexible Power-Source Survivability Assurance under Bending Loads and Operating Temperatures Representative of Stresses of Daily Motion (2018) (1)
Effect of Evolution of High Strain Rate Properties on Plastic-Work of SAC305 Alloy with 100°C Aging for Periods up to 240-days (2022) (1)
WARPAGE OF FLEXIBLE-BOARD ASSEMBLIES WITH BGAS DURING REFLOW AND POST-ASSEMBLY USAGE (2018) (1)
Evolution of Viscoelastic Properties of Underfills Exposed to High Temperature (2021) (1)
Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments (2018) (1)
Reliability and die stress measurements in flip chip assemblies with carbon fiber core laminate substrates (2006) (1)
Mechanics of Wirebond Interconnects (1993) (1)
Reliability study of the laminate-based flip-chip chip scale package (1998) (1)
An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions (2015) (1)
Study of electromigration in Cu and Ag wirebonds operating at high current in extreme environments (2017) (1)
Health monitoring of implantable biological electronic systems by statistical pattern recognition techniques (2008) (1)
Development of Model for Identification of Process Parameters for Wet Decapsulation of Copper–Aluminum Wirebond in PEMs (2017) (1)
High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging (2020) (1)
SOH Modelling of Li-Ion Coin Cells Subjected to Varying C-Rates, Depths of Charge, Operating Temperatures and Custom Charge Profiles (2021) (1)
Shock and Vibration Survivability Prediction Using Failure Envelopes for Electronic and MEMS Packaging (2005) (1)
Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate (2021) (1)
Application of Nanoindentation and Microdiffraction to Study Aging Effects in Lead Free Solder Interconnects (2016) (1)
Stresses in Area Array Assemblies Subjected to Thermal Cycling (2009) (1)
A study on the effect of aging on thermal cycling reliability of Sn-Ag-Cu interconnects using Digital Image Correlation (2016) (1)
Effect of Dielectric Material on the Reliability of 3640 MLCC Capacitors under High-G Shock Loads (2019) (1)
Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies (2020) (1)
Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements (2019) (1)
Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures (2021) (1)
Microstructural Study of Lead Free Solder Joints Subjected to Mechanical Cyclic Loading Under Various Conditions (2021) (1)
Anomaly detection and fault-mode isolation for prognostics health monitoring of electronics subjected to drop and shock (2010) (1)
Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for QSAC10 and QSAC20 (2021) (1)
Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature (2017) (1)
Isothermal Aging Dependent Anand Parameters of SAC305 Lead Free Solder at Extreme High Temperatures (2020) (1)
High Temperature Storage and HAST Reliability of Copper-Aluminum Wirebond Interconnects (2014) (1)
HighSpeedDigital ImageCorrelation forTransient-Shock Reliability ofElectronics (2007) (1)
Reliability modeling of electronic systems subjected to high strain rates (2012) (1)
Analysis of Progressive Damage in Fuze Electronics using Micro-Computed Tomography and Finite Element Models (2018) (1)
Visualization and Modeling of Microstructural Evolution in SAC305 BGA Joints during Extreme High Temperature Aging (2020) (1)
Sensitivity of Sensor Location and Use Conditions on the Detectability of Accrued Damage for PHM under Combined Temperature Vibration (2019) (1)
Mechanical Behavior and Microstructure Evolution in Lead Free Solders Subjected to Mechanical Cycling at Elevated Temperatures (2021) (1)
High Temperature-Vibration Reliability of SnAgCu Leadfree Assemblies in Automotive Environments (2021) (1)
Causes of Degradation of Thermal Performance of Ball Grid Arrays After Thermal Cycling (2007) (1)
Cohesive Zone Modeling and Damage Prediction of Interfacial Delamination in Potted Electronics Subjected to High-G Mechanical Shock (2019) (1)
Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing (2020) (1)
Explicit FE Failure Prediction of Interfaces and Interconnect in Potted Electronics Assemblies Subject to High-g Acceleration Loads (2019) (1)
Effect of Varying Amplitude Cycling on SAC-Bi Solder Joint Fatigue (2020) (1)
Measurement of the Constitutive Behavior of Underfill Encapsulants (2003) (1)
Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage (2021) (1)
Multiphysics Model for Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages (2015) (1)
Feature Vector Identification and Prognostics of SAC305 PCBs for Varying G-Levels of Drop and Shock Loads (2021) (1)
High Cycle Fatigue Life-Prediction for Lead-Free Interconnects Under Simultaneous High Temperature and Vibration (2013) (1)
Transient-Response Spectral Analysis Based Feature Extraction for Built-In Reliability Test of Electronics Under Shock Loads (2007) (1)
Process Development for Printing Z-Axis Interconnects in Multilayered Flexible Substrates (2020) (1)
Fault-Detection and Isolation Algorithms for Health Monitoring of Electronics Subjected to Shock and Vibration (2009) (1)
The Effect of Bismuth Content on Mechanical Properties of SAC+Bi Lead Free Solder Materials and Determination of Anand Parameters (2021) (1)
Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading (2019) (1)
Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition (2020) (1)
High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C (2019) (1)
Flexible Batteries Under Dynamic Folding and Flex-to-Install with Varying C-Rates and Temperatures (2020) (1)
Damage Accumulation and Life-Prediction Models for SnAgCu Leadfree Electronics Under Shock-Impact (2009) (1)
Measurement of Electronic Packaging Material Behavior and Flip Chip Die Stresses at Extreme Low Temperatures (2005) (1)
Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability (2013) (1)
Investigation of the Effects of High Temperature Aging on Mechanical Behavior and Microstructural Changes in Lead Free Solders (2019) (1)
Study of Lead Free Solder Joints Subjected to Isothermal Mechanical Shear Cycling (2020) (1)
Principal components regression model for prediction of life-reduction in SAC leadfree interconnects during long-term high temperature storage (2015) (1)
Shock Angle Variation on High-G Impact Reliability of Electronics Potted Assemblies (2021) (0)
Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150c to 200c (2021) (0)
Component Attachment to Inkjet Additive Printed Circuits to Achieve Flexible Signal Filters using Silver and Copper Nanoparticle Metal Inks (2022) (0)
Process Development and Performance Analysis of Additively Printed Humidity Sensor using Aerosol Jet Printing (2020) (0)
Sustained High Temperature Fracture Toughness Evolution of Chip-UF and Substrate-UF Interfaces in FCBGAs for Automotive Applications (2022) (0)
Effect of Lamination Parameters and Mechanical Folding on Li-Ion Battery Capacity Deterioration and SOH Degradation Rate (2021) (0)
High Strain Rate Mechanical Properties of Sac-Q Between -65c and +200c After Exposure to Isothermal Aging (2021) (0)
Guidelines for Temperature-Tolerant Design and use of Electronic Packages (2020) (0)
Guidelines for Temperature-Tolerant Design and use of Microelectronic Devices (2020) (0)
Interfacial Fracture Toughness of EMC/Substrate Interface Under Mode–I Dynamic Loading with Long-Term High Temperature Aging (2022) (0)
News Nsf Center for Advanced Vehicle and Extreme Environment Electronics Samuel Ginn College of Engineering (0)
Characterization of Hysteresis Loop Evolution in Aged Lead Free Solders (2011) (0)
High Strain Rate Properties for Sac-R After Exposure to Isothermal Aging for Operating Temperature Ranging From -65 C to 200 C (2021) (0)
Feature Vector Based Failure Mode Identification and Prognostication of Electronics Subjected to Shock and Vibration (2009) (0)
Effects of β-Sn Crystal Orientation on the Deformation Behavior of SAC305 Solder Joints (2022) (0)
Aging Induced Mechanical Property Degradation and Microstructure Evolution of SAC+X Lead Free Solder Alloys (2013) (0)
Folding Reliability of Flexible Wearable Band With Vital Sign Acquisition Sensors (2021) (0)
Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep (2017) (0)
Effect of Thermal Aging on the Interface Fracture Toughness of the PCB-UF Interface (2021) (0)
Leading indicator based assessment of operational readiness in electronics subjected to multiple environments (2012) (0)
Methodologies for System-State Interrogation for Prognostication of Electronics Under Thermo-Mechanical Loads (2007) (0)
Remaining Useful-Life Based on Damage Pre-Cursors for Leadfree Electronics Subjected to Multiple Thermal-Environments (2009) (0)
PHM of Flexible Li-ion Batteries Subjected to Sustained Elevated-Temperature Storage and Thermal Cycling (2019) (0)
Improved predictions of cyclic stress-strain curves for lead free solders using the Anand viscoplastic constitutive model (2016) (0)
Twist Reliability Assessment of Flexible Batteries in Wearable Applications (2020) (0)
Effect of SAC105 Solder Alloys High Strain Rate Property Evolution on Plastic Work at Low Operating Temperatures (2022) (0)
Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures (2022) (0)
Development of a Test Methodology to Design an Overnight Charging Profile to Reduce the SOH Degradation Rate of Li-ion Batteries (2021) (0)
Effect of Combining Solder Pastes with SAC305 Spheres on Component Reliability in Harsh Thermal Cycling (2020) (0)
Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage (2021) (0)
High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C (2022) (0)
Effect of Mean Temperature on the Evolution of Strain-Amplitude in SAC Ball-Grid Arrays during Operation under Thermal Aging and Temperature Excursions (2017) (0)
Effect of Lamination Parameters and Mechanical Folding on SOH Degradation of Li-ion Battery Subjected to Accelerated Life Testing (2021) (0)
The Effect of Bismuth Content on Mechanical Property Evolution of SAC+Bi Lead Free Solders Subjected to Long Term Thermal Exposures (2022) (0)
Reliability of a CBGA miroproessor package incorpoating a decoupling capacitor array (2016) (0)
Damage Pre-Cursors Based Assessment of Accrued Thermo-Mechanical Damage and Remaining Useful Life in Field Deployed Electronics (2015) (0)
Reliability Assessment of Cu-Al WB Under High Temperature and Voltage Bias (2021) (0)
Thermal Cycling Induced Evolution of the Creep Behavior of Lead Free Solder Materials (2021) (0)
Effect of Storage on Reliability of Thin-Flexible Laminated and Unlaminated Batteries in Wearable Applications (2022) (0)
Life Prediction of Thin Flexible Batteries under U-Flex-to-Install, Dynamic Folding, Dynamic Twisting and Battery Lamination (2021) (0)
AI and Feature-Vector Based Damage Monitoring and Remaining Useful-Life Assessment for Electronics Assemblies in Mechanical Shock and Vibration (2023) (0)
Effect of Prolonged Storage on High strain rate Mechanical properties of QSAC10 and QSAC20 Solders after Exposure to Isothermal Aging of 50°C (2022) (0)
Effect of Long-Term Isothermal Exposure on Chip/Underfill Interfacial Crack Growth Under Mode – I Fatigue Loading (2022) (0)
Indentation Creep Properties Evolution of Lead-Free Solder Joints Subjected to Thermal Cycling (2022) (0)
Material behavior changes in underfill encapsulants exposed to isothermal aging (2006) (0)
Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging (2022) (0)
Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder (2022) (0)
Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days (2022) (0)
A Crystal Plasticity Finite Element Modeling to Explain the Effects of β-Sn Crystal Orientation on SAC305 Solder Ball Deformation (2022) (0)
Failure-Mode Clustering for Electronics Under Shock and Vibration Using Neural-Net Based Self-Organized Maps (2010) (0)
Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging (2020) (0)
Microstructural Evolution of SAC305 BGA Joints during Extreme High Temperature Aging (2020) (0)
Performance of Component Interconnection Methods on Direct Write Additive Silver Circuits (2022) (0)
Study on Folding-Reliability of Wearable Biometric Band (2020) (0)
Keynote Presentation Prognostics and Condition Monitoring of Electronics (2009) (0)
Flex-to-Install Application Performance of Power Sources Subjected to Varying Fold Orientations, C-Rates and Depths of Charge (2020) (0)
Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties (2019) (0)
State of Health Estimation of Li-Ion Battery Subjected to Flex-to-Install and Dynamic Folding With Varying Orientations, Folding Speeds, Depths of Charge and C-Rates (2021) (0)
The Effects of Dopants on the Aging Behavior of Lead Free Solders (2011) (0)
Improved Approaches for FEA Analyses of PBGA Packages Subjected to Thermal Cycling (2018) (0)
Chapter 2 Nanomechanical Characterization of Lead Free Solder Joints (2019) (0)
Damage mechanisms in copper-aluminum wirebond under high temperature operation (2014) (0)
Effect of Underfill Property Evolution on Solder Joint Reliability in Automotive Applications (2022) (0)
Mechanical Behavior of Sn1Ag0.5Cu and Sn3Ag0.5Cu Alloys at High Strain Rates (2012) (0)
High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging (2020) (0)
Effect of Manufacturing Process Parameters on Property Evolution of Printed Circuit Board Laminates (2012) (0)
High Strain Rate Mechanical Properties of Sac-Q Between -65 C and +200 C After Exposure to Iso-Thermal Aging Up to 90 Days (2021) (0)
Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform (2022) (0)
Challenges in modeling of accelerated life testing ITHERM 2004 panel discussion (2004) (0)
Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation (2022) (0)
Reliability and SOH Degradation of Thin Li-ion Batteries Under Various Flexing Conditions (2021) (0)
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging (2021) (0)
CHARACTERIZATION OF STRESS IN HIGH PERFORMANCE SERVER MICROPROCESSORS (2008) (0)
Prediction of Electrical Performance and Print Geometry for Inkjet Additive Circuits via Statistical Modeling (2022) (0)
Investigation of the Effect of Isothermal Mechanical Shear Cycling on Lead Free Solder Joints (2021) (0)
Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates (2020) (0)
Evolution of Lead Free Solder Material Behavior Under Elevated Temperature Aging (2007) (0)
Impact of Environmental Preconditioning and Composition Parameters on Constitutive Behavior of Underfills (2003) (0)
Evaluation of Directional Properties of SAC305 Solder Joints Using the Nanoindentation Technique (2022) (0)
Mechanical Property Evolution in SAC+Bi Lead-Free Solders Subjected to Various Thermal Exposure Profiles (2022) (0)
Flexible Encapsulation Process-Property Relationships for Flexible Hybrid Electronics (2021) (0)
Interaction of Photonic Curing Process Parameters on Additively Printed Copper Circuits (2022) (0)
A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration (2013) (0)
High Reliability Flip Chip Using Low CTE Laminate Substrates (2005) (0)
Prediction of Stress-Strain Behavior of Thermally Cycled SAC305 Solder Joints by Finite Element Modeling and Nanoindentation Characterization (2021) (0)
CORROSION AND CONTAMINANT DIFFUSION MULTI-PHYSICS MODEL FOR COPPER-ALUMINUM WIREBONDS IN HIGH TEMPERATURE HIGH HUMIDITY ENVIRONMENTS (2015) (0)
Measurement of Microprocessor Die Stress due to Thermal Cycling, Power Cycling, and Second Level Assembly (2013) (0)
Passive Components (2018) (0)
Electrical Parameter Variations in Mosfet Devices (2020) (0)
Statistical Pattern Recognition andBuilt-in Reliability TestforFeature Extraction andHealthMonitoring ofElectronics underShockLoads (2007) (0)
Additively Printed Multi-Material Temperature Sensor Realized using Screen Printing (2020) (0)
Characterization of Fatigue Crack Growth of Epoxy Molding Compounds Under High-Temperature Long-Term Aging (2022) (0)
COMPARISON OF RELIABILITY OF COPPER , GOLD , SILVER , AND PCC WIREBONDS UNDER SUSTAINED OPERATION AT 200 C (2018) (0)
Air Cooling Technologies For Electronic Equipment [Book Reviews] (1998) (0)
SIF Evaluation Using XFEM and Line Spring Models Under High Strain Rate Environment for Leadfree Alloys (2011) (0)
Microstructural Indicators for Assessment of Effect of Prolonged and Intermittent Storage on Reliability of Lead-free Electronics (2016) (0)
Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability (2022) (0)
Interrogation of damage-state in leadfree electronics under sequential exposure to thermal aging and thermal cycling (2011) (0)
Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months (2021) (0)
The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials (2018) (0)
Conclusions (2020) (0)
Damage Progression in Electronic Molding Compounds under Sustained High Temperature for up to 1-year in Automotive Underhood Environments (2022) (0)
Models for Component Selection and Thermo-Mechanical Reliability Trade-Offs to Address Component Obsolescence in Military Electronics (2008) (0)
High Strain Rate Materials Characterization at Low Test Temperatures for Thermally Aged SAC-Q Solder Alloys (2022) (0)
Influence of Sustained High Temperature Exposure on the Interface Bond Strength between TIM-Copper Substrates (2022) (0)
Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies (2009) (0)
Evolution of SAC305 Mechanical Behavior Due to Damage Accumulation During Cycling (2022) (0)
Remaining Useful Life Estimation using a combined Physics of Failure and Deep Learning-based approach on SAC305 Solder PCBs subjected to Thermo-Mechanical Vibration Loads (2022) (0)
Study of Interface Strength of Flexible Encapsulation for FHE Applications (2021) (0)
Evolution of Lead Free Solder Material Behavior During Isothermal Aging (2006) (0)
Method for Assessment of Prolonged and Intermittent Storage on Reliability of Leadfree Electronics Using Leading Indicators (2013) (0)
Study of Interface Reliability of PCB-UF Interface in FCBGAs under Sustained High Temperature Operation in Automotive Underhood Environments (2022) (0)
Multi-Layer Circuitry Process Development With Z-Axis Interconnects Using Aerosol-Jet Technology (2021) (0)
Folding Reliability of Flexible Batteries in Wearable Applications (2021) (0)
Outstanding Papers—2005 (2005) (0)
Effect of High and Low Storage Temperatures, Storage Duration and Varying Depth of Discharge on Coin Cell SOH Degradation (2022) (0)
ANN Based Assessment of State-of-Health Reliability of Flexible Li-Ion Batteries Under Dynamic Flexing and Calendar Aging (2022) (0)
Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions (2021) (0)
Feature Vector Identification and Prognostics of Sac305 Pcb\u2019s for Varying Conditions of Temperature and Vibration Loads (2021) (0)
Deformation Behavior Sac305 Solder Joints With Multiple Grains (2021) (0)
Effect of Material Anisotropy on Deformation Behavior of Multiple Grained Sac305 Solder Joints (2021) (0)
SOH Degradation of Curved and Flat Li-ion Thin Flexible Batteries Subjected to Flex-to-Install Testing at Various Fold Diameters (2022) (0)
Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year (2017) (0)
Thermal Stability and Viscoelasticity Behavior of Underfill Encapsulants in Sustained High Temperature Environment up to 1-year (2022) (0)
Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements (2020) (0)
Electronic Components (2018) (0)
Reliability Characterization and Modeling of Flexible LCO battery Under Flexing and Calendar Aging for SOH degradation analysis (2022) (0)
Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation (2021) (0)
Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries (2022) (0)
Evolution of Sac Leadfree Alloys at High Strain Rate at Low Operating Temperatures (2021) (0)
Mechanical Behavior and Microstructure Evolution in SAC+Bi Lead Free Solders Subjected to Mechanical Cycling (2022) (0)
Evolution of the Creep Behavior for SAC305 Lead Free Solder Exposed to Various Thermal Profiles (2022) (0)
High Strain Rate Mechanical Properties of M758 Solder at Extreme Surrounding Temperatures, with 100°C Isothermal Aging for up to 180 Days (2022) (0)
Evaluation of the Creep Response of Lead-Free Solder Materials Subjected to Thermal Cycling (2021) (0)
Characterization of Viscoelastic Behavior of Epoxy Molding Compounds Subjected to Sustained High Temperature Environment up to 1 year (2022) (0)
Nano-Underfills for Fine-Pitch Electronics (2008) (0)
Fault-Mode Classification of Solid State Luminaires Using Bayesian Probabilistic Models (2014) (0)
Failure Modes of Flexible Electronics Under Mechanical Vibration (2019) (0)
Evolution of Fatigue Reliability of UF-Substrate Interfaces under High Temperature Exposure (2022) (0)
Evolution of Anand Parameters and High Strain Rate Mechanical Properties of Sac Solder Alloy at Low and High Operating Temperatures (2021) (0)
Testing and Reliability Characterization Methods for Flexible Hybrid Electronics (2020) (0)
Reliability of Component Attachment using ECA and LTS on Flexible Additively Printed Ink-Jet Circuits for Signal-Filtering in Wearable Applications (2022) (0)
Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration (2022) (0)
Health Monitoring and Prognostics of Sac305 Pcb\u2019s for Dynamic Loading Conditions of Temperature and Vibration (2021) (0)
Multilayer Substrates With Additively Printed Micro-Vias Using Aerosol Jet Technology (2021) (0)
Fe Modelling and Experimental Study of Crack Propagation at the Pcb/underfill Interface Due to Thermal Aging (2021) (0)
Process Development for Additive Fabrication of Z-Axis Interconnects In Multilayer Circuits (2020) (0)
Drop Shock Performance of SAC-Bi Compared to SnPb (2022) (0)
Classification of multiple failure modes in package-on-package (PoP) assemblies using feature vectors for progression of accrued damage (2012) (0)
Damage Relationships for BGA Reliability in Harsh Environments (2003) (0)
Guest Editorial (2011) (0)
Process Development for Fabrication of Copper Additive-Multilayer Circuits with Component Attachment using ECA and LTS (2022) (0)
RT 184: Electronic Survivability in Harsh Environments (2018) (0)
Determination of Anand Parameters From Shear Creep Tests of Lead Free Solder Joints (2021) (0)
Process-Consistency in Printed Layers in Multi-Layer Substrate Using Aerosol Jet Technology (2020) (0)
Feature Vector Based Remaining Useful-Life Assessment in Mechanical Shock and Vibration for Leadfree Electronics (2022) (0)
EFFECTS OF VOIDS ON REACTIVITY AND REACTOR STABILITY. (1971) (0)
BallGridArray(BGA)Solder Joint Intermittency (2008) (0)
Reliability Evaluation of Cu-Al WB in High Temperature and High Current Applications (2021) (0)
Material Behavior of Mixed Formulation Solder Joints (2009) (0)
Leading Prognostic Indicators for Health Management of Electronics Under Thermo-Mechanical Stresses (2007) (0)
Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure (2022) (0)
Multilayer Conductive Metallization with Offset Vias Using Aerosol Jet Technology (2022) (0)
Packaging Reliability, Chip‐Scale Semiconductor (1999) (0)
Feature Vector Identification and Prognostics of SAC305 PCB’s for Varying Conditions of Temperature and Vibration Loads (2020) (0)
Improvements to the IES TM-28-14 Lumen Maintenance Standard: A Generalized Acceleration Factor Approach for Solid-State Lighting (2016) (0)
Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications (2021) (0)
Aging Effects in Sac+x Solders Exposed to High Temperatures (2021) (0)
Influence of Component Interconnect with Printed Copper Circuits on Realized Mechanical and Electrical Characteristics in FHE Applications (2022) (0)
Assessment of reliability of missile fuze using micro-CT data based finite element technique with digital volume correlation (2017) (0)
Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for SAC-R after Sustained Exposure to 50°C (2021) (0)
Reliability Assessment of Cu-Al WB under Automotive Temperatures in Presence of Ionic Contamination and Voltage Bias (2022) (0)
Development of Process-Recipe for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink (2021) (0)
Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for SAC-R after Sustained Exposure to 50°C (2022) (0)
Prognostication of Accrued Damage and Impending Failure Under Temperature-Vibration in Leadfree Electronics (2019) (0)
Evolution of Interfacial Properties under Long Term Isothermal Aging of PCB/Potting Compound Interfacial Samples under Pure Mode-I Loading (2022) (0)
High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C (2020) (0)
SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates (2022) (0)
Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments (2022) (0)
Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints (2021) (0)
Study of Interface Monotonic and Fatigue Fracture Measurements at the Substrate Potting Compound Interfaces Under Flexure Loading (2022) (0)
KL Transform and Neural-Net Based Framework for Failure Modes Classification in Electronics Subjected to Mechanical-Shock (2011) (0)
TheInfluence ofElevated Temperature AgingonReliability ofLeadFreeSolder Joints (2007) (0)
PHM of Leadfree Electronic Assemblies Using Resistance Spectroscopy With Sequential Importance Resampling (2011) (0)
Leading Indicators of Damage for Prognostication of Leadfree Electronics Subjected to Multiple Thermo-Mechanical Environments (2009) (0)
Process-Recipe Development for Printing of Multi-Layer Circuitry with Z-Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias (2022) (0)
Condition-Based Assessment of Damage Progression During Mechanical Shock in Electronic Assemblies (2006) (0)
Creep and Microstructure Evolutions in SAC305 Lead Free Solder Subjected to Different Thermal Exposure Profiles (2022) (0)
Accelerated Life Cycling of Additively Printed Flexible Linear Charging Circuits and its Effect on Evolution of Line Resistance and Charging Current (2022) (0)
Extreme Low-Temperature High Strain-Rate Constitutive Behavior Evolution of Doped and Undoped Leadfree Solders under Sustained High Temperature Exposure (2022) (0)
Investigation and Comparison of Microstructural Changes in SAC and SAC+X Solders Exposed to Short-Term Aging (2020) (0)
Life Prediction and RUL Assessment of Fine Pitch Solder Joint Fuze Electronics Under Mechanical Shock Loads Up to 50,000g (2016) (0)
The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages (2017) (0)
Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components (2022) (0)
Process Development for Printing Copper Conductible Ink on Flexible Substrates using Aerosol Jet Printing Technology (2021) (0)
Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging (2020) (0)
Prognostic Health Monitoring of Damage Progression in Leadfree Electronics Under Sequential Exposure to Thermal Aging and Thermal Cycling (2010) (0)
Electrical Parameter Variations in Bipolar Devices (2020) (0)
Investigation and Comparison of Aging Effects in SAC+Bi Solders Exposed to High Temperatures (2021) (0)
Prognostication of Cu-Al WB system subjected to high temperature-humidity condition (2016) (0)
Process-Consistency in Additively Printed Multi-Layer Substrates With Offset Vias Using Aerosol Jet Technology (2021) (0)
Reliability of State-of-health of the Flexible Li-ion Batteries Under Various Flexing Conditions and Calendar Aging (2022) (0)
Experimental and Fe Modelling Study of Crack Propagation at the Pcb/underfill Interface Due to Iso-Thermal Aging (2021) (0)
Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration (2009) (0)
Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads (2021) (0)
RT 186: Product Assurance for Electronics in Harsh Environments (2018) (0)
Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics (2011) (0)
Failure Mode Clustering is Electronic Assemblies Using Sammon’s Mapping With Supervised Training of Perceptrons (2011) (0)
Reliability Assessment of Cu-Al WB Under High Temperature and High Voltage Bias Application (2020) (0)
Effect of Voids on Thermo-Mechanical Reliability of QFN Solder Joints (2020) (0)
Remaining Useful Life Estimation and Prognostication of SAC305 PCB's for Dynamic Conditions of Temperature and Vibration Loads (2021) (0)
Printed Wiring Board Design and Fabrication (2018) (0)
Nanomechanical Characterization of Aging Effects in Solder Joints in Microelectronic Packaging (2013) (0)
Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits (2022) (0)
Reliability of Silver Wire Bonds in Harsh Environments (RT 190) (2018) (0)
Undoped and Doped Solder Performance under High Strain Rates and Wide Operating Temperatures after Prolonged Storage (2023) (0)
Process-Reliability Relationships of SnBiAg and SnIn Solders for Component Attachment on Flexible Direct-Write Additive Circuits in Wearable Applications (2022) (0)
Printed flexible LC filter using the micro-dispensing technique using silver conductive pasted and ECA for component attachment (2021) (0)
Method for Assessment of Folding-Reliability of Flexible Electronics in Wearable Applications (2019) (0)
Evolution of Die Stress and Delamination During Thermal Cycling of Flip Chip Assemblies (2005) (0)
Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys (2021) (0)
Interconnections and Connectors (2018) (0)
Characterization of Die Stress Distributions in Area Array Flip Chip Packaging (2009) (0)
Evolution of Creep Response of Various Materials Within Pbga Packages Exposed to Thermal Cycling Loading (2021) (0)
Modeling Effect of Underfill Property Evolution on the FCBGA Reliability at Sustained Automotive Underhood Temperatures (2022) (0)
LEADING INDICATORS FOR PROGNOSTICATION OF IMPENDING FAILURES ON CU-AL INTERCONNECTS (2013) (0)
Anand Viscoplasticity Model for the Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temperature (2015) (0)
Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Exposed to High Temperature (2021) (0)
Effect of U-Flex-to-Install and Dynamic U-Flexing On Li-Ion Battery SOH Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates and Temperatures (2021) (0)
Deep Learning Neural Network Approach for Correlation between Print Parameters and Realized Electrical Performance and Geometry on Ink-Jet Platform (2022) (0)
Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock Using X-Ray Digital Volume Correlation (2017) (0)
Evolution of Mechanical Properties of Sac305 Lead Free Solder Materials Subjected to Different Thermal Cycling Profiles (2021) (0)
Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications (2022) (0)

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