Seung‐boo Jung
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Seung‐boo Jungengineering Degrees
Engineering
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Metallurgy
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Engineering
Why Is Seung‐boo Jung Influential?
(Suggest an Edit or Addition)Seung‐boo Jung's Published Works
Number of citations in a given year to any of this author's works
Total number of citations to an author for the works they published in a given year. This highlights publication of the most important work(s) by the author
Published Works
- Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing (2005) (288)
- The joint properties of copper by friction stir welding (2004) (276)
- Interfacial reaction in steel–aluminum joints made by friction stir welding (2006) (254)
- Microstructural investigation of friction stir welded pure titanium (2005) (198)
- The improvement of mechanical properties of friction-stir-welded A356 Al alloy (2003) (185)
- The joint properties of dissimilar formed Al alloys by friction stir welding according to the fixed location of materials (2003) (179)
- Joint properties of friction stir welded AZ31B– H24 magnesium alloy (2003) (127)
- Mechanical Properties Related to Microstructural Variation of 6061 Al Alloy Joints by Friction Stir Welding (2004) (126)
- Dissimilar friction stir spot welding of low carbon steel and Al–Mg alloy by formation of IMCs (2009) (125)
- Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints (2009) (119)
- Formation of intermetallic compounds in Al and Mg alloy interface during friction stir spot welding (2011) (119)
- IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate (2005) (112)
- Interfacial reactions and growth kinetics for intermetallic compound layer between In–48Sn solder and bare Cu substrate (2005) (103)
- Intermetallic compound layer growth at the interface between Sn-Cu-Ni solder and Cu substrate (2004) (102)
- Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging (2005) (101)
- Effects of copper insert layer on the properties of friction welded joints between TiAl and AISI 4140 structural steel (2004) (92)
- Microstructures and wear property of friction stir welded AZ91 Mg/SiC particle reinforced composite (2006) (91)
- Lap joint properties of FSWed dissimilar formed 5052 Al and 6061 Al alloys with different thickness (2008) (90)
- Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment (2003) (88)
- Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder (2002) (86)
- Evaluation of the microstructure and mechanical properties of friction stir welded 6005 aluminum alloy (2003) (85)
- Interfacial reactions between Sn–0.4Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction (2005) (80)
- The Joint Characteristics of Friction Stir Welded AZ91D Magnesium Alloy (2003) (79)
- Effect of friction welding parameters on mechanical and metallurgical properties of aluminium alloy 5052–A36 steel joint (2003) (79)
- Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization (2004) (78)
- Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint (2011) (77)
- IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging (2004) (77)
- Experimental and finite element analysis of the shear speed effects on the Sn–Ag and Sn–Ag–Cu BGA solder joints (2004) (75)
- Investigation of interfacial reactions between Sn-5Bi solder and Cu substrate (2003) (74)
- Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder (2004) (73)
- Characteristic evaluation of electroless nickel-phosphorus deposits with different phosphorus contents (2007) (70)
- Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn–Ag–Cu solder and ENEPIG substrate during a reflow process (2011) (67)
- The mechanical properties related to the dominant microstructure in the weld zone of dissimilar formed Al alloy joints by friction stir welding (2003) (64)
- Hydrothermally Grown In-doped ZnO Nanorods on p-GaN Films for Color-tunable Heterojunction Light-emitting-diodes (2015) (64)
- Design and fabrication of screen-printed silver circuits for stretchable electronics (2014) (64)
- Growth kinetics of Ni3Sn4 and Ni3P layer between Sn–3.5Ag solder and electroless Ni–P substrate (2004) (63)
- Behavior of β phase (Al3Mg2) in AA 5083 during friction stir welding (2013) (63)
- Effects of Cr3C2 on the microstructure and mechanical properties of the brazed joints between WC–Co and carbon steel (2006) (63)
- Frictional wear evaluation of WC–Co alloy tool in friction stir spot welding of low carbon steel plates (2009) (62)
- Effect of reflow time on interfacial reaction and shear strength of Sn–0.7Cu solder/Cu and electroless Ni–P BGA joints (2004) (61)
- Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate (2004) (60)
- Effect of surface finish material on printed circuit board for electrochemical migration (2008) (60)
- Lead-Free Electronics Packaging. Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate. (2002) (59)
- Synergistic effect of Indium and Gallium co-doping on growth behavior and physical properties of hydrothermally grown ZnO nanorods (2017) (57)
- Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder (2006) (56)
- The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders (2001) (55)
- Direct Metallization of Gold Nanoparticles on a Polystyrene Bead Surface using Cationic Gold Ligands (2007) (53)
- Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn–3.0Ag–0.5Cu solder and Ni–P UBM (2005) (48)
- Effect of Pin Shapes on Joint Characteristics of Friction Stir Spot Welded AA5J32 Sheet (2010) (47)
- Effect of SiC particles on microstructure and mechanical property of friction stir processed AA6061-T4 (2012) (46)
- Effect of substrate metallization on mechanical properties of Sn-3.5Ag BGA solder joints with multiple reflows (2005) (46)
- Fabrication of SiCp/AA5083 composite via friction stir welding (2012) (45)
- Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions (2007) (44)
- Mechanical property of the epoxy-contained Sn–58Bi solder with OSP surface finish (2014) (43)
- Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes (2009) (43)
- Effect of immersion Ag surface finish on interfacial reaction and mechanical reliability of Sn–3.5Ag–0.7Cu solder joint (2008) (43)
- Intermetallic compound layer formation between Sn–3.5 mass %Ag BGA solder ball and (Cu, immersion Au/electroless Ni–P/Cu) substrate (2003) (42)
- Enhanced electrical and mechanical properties of silver nanoplatelet-based conductive features direct printed on a flexible substrate. (2013) (41)
- Effect of surface finish on interfacial reactions of Cu/Sn-Ag-Cu/Cu(ENIG) sandwich solder joints (2008) (40)
- Interfacial reaction and intermetallic compound formation of Sn–1Ag/ENIG and Sn–1Ag/ENEPIG solder joints (2015) (40)
- Solid-state interfacial reactions between Sn–3.5Ag–0.7Cu solder and electroless Ni-immersion Au substrate during high temperature storage test (2007) (40)
- Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging (2007) (40)
- Reliability evaluation of Au–20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au (2008) (39)
- Microstructure and Mechanical Properties of Friction Stir Spot Welded Galvanized Steel (2010) (39)
- Reliability studies of Sn–9Zn/Cu solder joints with aging treatment (2006) (38)
- Effect of Surface Finishes on Ball Shear Strength in BGA Joints with Sn-3.5 mass%Ag Solder (2002) (38)
- Effects of number of reflows on the mechanical and electrical properties of BGA package (2006) (38)
- Investigation of interfacial reaction between Sn-Ag eutectic solder and Au/Ni/Cu/Ti thin film metallization (2001) (38)
- Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging (2006) (37)
- Hybrid Friction Stir Welding of High-carbon Steel (2011) (37)
- Void Free Friction Stir Weld Zone Of The Dissimilar 6061 Aluminum And Copper Joint By Shifting The Tool Insertion Location (2004) (37)
- Effects of cerium content on wettability, microstructure and mechanical properties of Sn–Ag–Ce solder alloys (2010) (36)
- Behavior of CaO and Calcium in pure Magnesium (2006) (36)
- Characteristics of environmental factor for electrochemical migration on printed circuit board (2008) (36)
- Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint (2008) (35)
- Microstructure and mechanical property of A356 based composite by friction stir processing (2013) (35)
- Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application (2006) (35)
- Effects of third element and surface finish on interfacial reactions of Sn–Ag–xCu (or Ni)/(Cu or ENIG) solder joints (2010) (35)
- Reaction diffusions of Cu6Sn5 and Cu3Sn intermetallic compound in the couple of Sn-3.5Ag eutectic solder and copper substrate (2003) (34)
- Effect of Microstructure on Mechanical Properties of Friction-Welded Joints between Ti and AISI 321 Stainless Steel (2004) (34)
- Reliability analysis of Au–Sn flip-chip solder bump fabricated by co-electroplating (2007) (33)
- Liquid-state and solid-state interfacial reactions of fluxless-bonded Au–20Sn/ENIG solder joint (2009) (33)
- Evaluation of solder joint reliability in flip-chip packages during accelerated testing (2005) (33)
- Direct metallization of gold patterns on polyimide substrate by microcontact printing and selective surface modification (2008) (32)
- Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications (2007) (32)
- Effect of surface finishes on electromigration reliability in eutectic Sn–58Bi solder joints (2014) (31)
- Solid state interfacial reaction and joint strength of Sn–37Pb solder with Ni–P under bump metallization in flip chip application (2005) (31)
- Interfacial reactions and joint reliability of Sn-9Zn solder on Cu or electrolytic Au/Ni/Cu BGA substrate (2005) (31)
- Investigation of interfacial reaction between Au-Sn solder and Kovar for hermetic sealing application (2007) (31)
- Mechanical properties of copper to titanium joined by friction welding (2003) (31)
- Control of interfacial reaction layers formed in Sn–3.5Ag–0.7Cu/electroless Ni–P solder joints (2009) (31)
- Characterization of direct patterned Ag circuits for RF application (2010) (31)
- Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method (2008) (30)
- Reexamination of the solder ball shear test for evaluation of the mechanical joint strength (2006) (30)
- Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints (2008) (30)
- Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package (2010) (30)
- Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C (2006) (29)
- Failure mechanism of Pb-bearing and Pb-free solder joints under high-speed shear loading (2010) (29)
- Reaction Diffusion and Formation of Cu11In9 and In27Ni10 Phases in the Couple of Indium-Substrates (2003) (29)
- Effect of laminating parameters on the adhesion property of flexible copper clad laminate with adhesive layer (2010) (28)
- Reliability of adhesive interconnections for application in display module (2007) (28)
- Solder joint reliability evaluation of Sn–Zn/Au/Ni/Cu ball-grid-array package during aging (2007) (28)
- Microstructure, Electrical Properties, and Electrochemical Migration of a Directly Printed Ag Pattern (2011) (28)
- Characterization of the shear test method with low melting point In–48Sn solder joints (2005) (28)
- Electrochemical migration behavior of silver nanopaste screen-printed for flexible and printable electronics (2013) (27)
- Effects of reflow and cooling conditions on interfacial reaction and IMC morphology of Sn–Cu/Ni solder joint (2006) (27)
- Effect of high-speed loading conditions on the fracture mode of the BGA solder joint (2008) (27)
- Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection (2006) (26)
- Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint (2011) (26)
- Electrically and mechanically enhanced Ag nanowires-colorless polyimide composite electrode for flexible capacitive sensor (2016) (25)
- Effects of silver additions on the mechanical properties and resistance to thermal shock of YBa2Cu3O7–δ superconductors (1999) (25)
- Effect of boron content in electroless Ni–B layer on plating layer properties and soldering characteristics with Sn–Ag solder (2008) (25)
- Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process (2007) (25)
- Mechanical reliability evaluation of Sn-37Pb solder joint using high speed lap-shear test (2008) (25)
- Comparison of Interfacial Stability of Pb-Free Solders (Sn—3.5Ag, Sn—3.5Ag—0.7Cu, and Sn—0.7Cu) on ENIG-Plated Cu During Aging (2010) (24)
- Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints (2008) (24)
- Characterization of ternary Ni2SnP layer in Sn―3.5Ag―0.7Cu/ electroless Ni (P) solder joint (2010) (24)
- Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test (2016) (24)
- Evaluation of solder joint reliability in flip chip package under thermal shock test (2006) (24)
- Photo-induced fabrication of Ag nanowire circuitry for invisible, ultrathin, conformable pressure sensors (2017) (24)
- Structure–Properties Relations in Friction Stir Spot Welded Low Carbon Steel Sheets for Light Weight Automobile Body (2010) (23)
- Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test (2009) (23)
- Interfacial reaction between Au–Sn solder and Au/Ni-metallized Kovar (2011) (23)
- Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates (2008) (22)
- Effect of isothermal aging on the interfacial reactions between Sn–0.4Cu solder and Cu substrate with or without ENIG plating layer (2006) (22)
- Effects of sintering conditions on microstructure and characteristics of screen-printed Ag thin film (2012) (21)
- Friction welding of TiAl and AISI4140 (2004) (21)
- High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging (2006) (21)
- Electromigration behaviors of Sn58%Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB (2019) (21)
- Kinetics of intermetallic compound layer growth and interfacial reactions between Sn–8Zn–5In solder and bare copper substrate (2005) (21)
- Failure behaviors of BGA solder joints under various loading conditions of high-speed shear test (2009) (21)
- The characteristics of Cu nanopaste sintered by atmospheric-pressure plasma (2013) (21)
- Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows (2008) (20)
- Reliability of Conductive Adhesives as a Pb-free Alternative in Flip-Chip Applications (2008) (20)
- Reliability of In-48Sn solder/Au/Ni/Cu BGA packages during reflow process (2005) (20)
- Flexibility of silver conductive circuits screen-printed on a polyimide substrate. (2011) (20)
- Analysis of Failure Mechanism in Anisotropic Conductive and Non-Conductive Film Interconnections (2008) (20)
- Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests (2020) (20)
- Electrochemical migration of directly printed Ag electrodes using Ag paste with epoxy binder (2013) (20)
- Fabrication and adhesion strength of Cu/Ni-Cr/polyimide films for flexible printed circuits (2011) (20)
- Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions (2014) (19)
- Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications (2020) (18)
- Mechanical strength test method for solder ball joint in BGA package (2005) (18)
- Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness (2009) (18)
- Enhancing Adhesion of Screen‐Printed Silver Nanopaste Films (2015) (18)
- Investigations of the test parameters and bump structures in the shear test of flip chip solder bump (2006) (18)
- Effect of CaO on AZ31 Mg Strip Castings (2008) (18)
- Fabrication of Ag-MWNT nanocomposite paste for high-power LED package (2015) (17)
- Mechanical, electrical, and thermal reliability of Sn-58wt.%Bi solder joints with Ag-decorated MWCNT for LED package component during aging treatment (2020) (17)
- Effects of Ag content on the reliability of LED package component with Sn–Bi–Ag solder (2015) (17)
- Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package (2010) (17)
- Fabrication of the hybrid Ag paste combined by Ag nanoparticle and micro Ag flake and its flexibility (2017) (17)
- Surface finishes of rolled copper foil for flexible printed circuit board (2008) (17)
- Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package (2007) (17)
- Effect of thermal treatment on adhesion strength of Cu/Ni-Cr/polyimide flexible copper clad laminate fabricated by roll-to-roll process (2011) (17)
- Effect of plasma treatment on adhesion characteristics at interfaces between underfill and substrate (2007) (17)
- Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test (2007) (17)
- Effect of surface finish metallization on mechanical strength of Ag sintered joint (2018) (16)
- Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages (2019) (16)
- Optimal Ni(P) thickness and reliability evaluation of thin-Au/Pd(P)/Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints (2019) (16)
- Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/thin-Au/Pd/Ni(P) solder joints (2020) (16)
- Microstructural Characterizations Following Friction Stir Welding of Dissimilar Alloys of Low- and High-Carbon Steels (2011) (16)
- Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density (2009) (16)
- Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes (2015) (16)
- A UV-responsive pressure sensitive adhesive for damage-free fabrication of an ultrathin imperceptible mechanical sensor with ultrahigh optical transparency (2019) (16)
- Interfacial reactions and intermetallic compound growth between indium and copper (2004) (15)
- Atmospheric Pressure Plasma Cleaning of Gold Flip Chip Bump for Ultrasonic Flip Chip Bonding (2008) (15)
- Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints (2018) (15)
- In situ TEM characterization of interfacial reaction in Sn–3.5Ag/electroless Ni(P) solder joint (2011) (15)
- Effects of heat treatment and film thickness on microstructure and critical properties of YBCO film processed by TFA-MOD (2007) (15)
- Electromigration effect on Sn-58 % Bi solder joints with various substrate metallizations under current stress (2016) (15)
- Behaviour of electrochemical migration with solder alloys on printed circuit boards (PCBs) (2008) (15)
- Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB (2016) (15)
- Effects of electromigration on microstructural evolution of eutectic SnPb flip chip solder bumps (2006) (15)
- Microstructure and mechanical properties of a B4C particle-reinforced Cu matrix composite fabricated by friction stir welding (2017) (15)
- Application of Underfill for Flip-Chip Package Using Ultrasonic Bonding (2008) (15)
- MORPHOLOGY, THERMAL STABILITY, AND SOLDERABILITY OF ELECTROLESS NICKEL–PHOSPHORUS PLATING LAYER (2007) (15)
- Intense pulsed light surface treatment for improving adhesive bonding of aluminum and carbon fiber reinforced plastic (CFRP) (2020) (14)
- Effect of adding Ce on interfacial reactions between Sn–Ag solder and Cu (2011) (14)
- Initial interfacial reaction layers formed in Sn–3.5Ag solder/electroless Ni–P plated Cu substrate system (2008) (14)
- Characterization of low speed shear test reliability of Sn–1.0Ag–XCe/ENEPIG solder joint (2013) (14)
- Effect of Process Parameters on TSV Formation Using Deep Reactive Ion Etching (2010) (14)
- Electrical Characterization of Screen-Printed Conductive Circuit with Silver Nanopaste (2009) (14)
- Microstructure and adhesion characteristics of a silver nanopaste screen-printed on Si substrate (2012) (14)
- Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis (2001) (14)
- Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging (2007) (14)
- Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions (2015) (14)
- Effect of Ni-Cr seed layer thickness on the adhesion characteristics of flexible copper clad laminates fabricated using a roll-to-roll process (2010) (14)
- Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersant (2019) (14)
- Fabrication of two-layer flexible copper clad laminate by electroless-Cu plating on surface modified polyimide (2009) (14)
- Microstructure Evaluation of Friction Stir Welded AZ91 with CaO Mg Alloy (2011) (13)
- Investigation of interfacial reactions between Sn–Ag–Bi–In solder and (Cu, electroless Ni–P/Cu) substrate (2003) (13)
- Thermal degradation of anisotropic conductive film joints under temperature fluctuation (2008) (13)
- Effects of Different Kinds of Underfills and Temperature–Humidity Treatments on Drop Reliability of Board-Level Packages (2011) (13)
- Evaluation of drop reliability of Sn-37Pb solder/Cu joints using a high speed lap-shear test (2012) (13)
- Activation energies of intermetallic compound growth at interface between Sn–5Bi–3.5Ag solder and Cu substrate (2003) (13)
- Effect of Ni-Cr Layer on Adhesion Strength of Flexible Copper Clad Laminate (2009) (13)
- Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy (2005) (12)
- Thermo-Mechanical Reliability of Lead-Free Surface Mount Assemblies for Auto-Mobile Application (2006) (12)
- Characterization of Failure Behaviors in Anisotropic Conductive Interconnection (2007) (12)
- Mechanical Reliability of Sn-Ag BGA Solder Joints With Various Electroless Ni-P and Ni-B Plating Layers (2010) (12)
- Effect of Additives on Microstructure and Mechanical Properties of Nickel Plate/Mask Fabricated by Electroforming Process (2009) (12)
- Characterization of flexible copper laminates fabricated by Cu electro-plating process (2009) (12)
- Reliability of Au bump flip chip packages with adhesive materials using four-point bending test (2009) (12)
- Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliability of Sn–3.0Ag–0.5Cu solder joints during current-stressing (2021) (12)
- Effect of Cr Thickness on Adhesion Strength of Cu/Cr/Polyimide Flexible Copper Clad Laminate Fabricated by Roll-to-Roll Process (2010) (12)
- Effect of Gold on the Corrosion Behavior of an Electroless Nickel/Immersion Gold Surface Finish (2011) (12)
- Phase analysis and kinetics of solid‐state ageing of Pb‐free Sn3.5Ag solder on electroless NiP substrate (2004) (11)
- Effects of Underfill Materials and Thermal Cycling on Mechanical Reliability of Chip Scale Package (2009) (11)
- Solder joint reliability in flip chip package with surface treatment of ENIG under thermal shock test (2009) (11)
- Effect of Zn addition on mechanical properties of brass hollow spheres (2008) (11)
- Effect of Pd thickness on wettability and interfacial reaction of Sn-1.0Ag-Ce solders on ENEPIG surface finish (2013) (11)
- The microstructures and mechanical properties of friction stir welded AZ31 with CaO Mg alloys (2013) (11)
- Regulation in Shear Test Method for BGA of Flip-chip Packages (2010) (11)
- Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip-Chip Bump on Glass Substrate (2008) (11)
- Effects of nodule treatment of rolled copper on the mechanical properties of the flexible copper-clad laminate (2007) (11)
- A New Non-PRM Bumping Process by Electroplating on Si Die for Three Dimensional Packaging (2010) (11)
- Analysis on thermal resistance of LED module with various thermal vias (2011) (10)
- Facet-controlled anatase TiO2 nanoparticles through various fluorine sources for superior photocatalytic activity (2016) (10)
- Effect of Sn-Decorated MWCNTs on the Mechanical Reliability of Sn–58Bi Solder (2019) (10)
- Evaluation of the flexibility of silver circuits screen-printed on polyimide with an environmental reliability test. (2011) (10)
- Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging (2005) (10)
- Effects of Plasma Polymerized Acrylic Acid Film on the Adhesion of Ag Tracks Screen-Printed on Polyimide (2012) (10)
- Optimization of shear test for flip chip solder bump using 3-dimensional computer simulation (2005) (10)
- Effects of a phosphorous-containing Pd layer in a thin-ENEPIG surface finish on the interfacial reactions and mechanical strength of a Sn–58Bi solder joint (2020) (10)
- High frequency characteristics of printed Cu conductive circuit. (2011) (10)
- Fast formation of Ni–Sn intermetallic joints using Ni–Sn paste for high-temperature bonding applications (2020) (9)
- Board Level Drop Reliability of Epoxy-Containing Sn-58 mass% Bi Solder Joints with Various Surface Finishes (2016) (9)
- Solid state intermetallic compound layer growth between Sn-8Zn-3Bi solder and bare copper substrate (2005) (9)
- Thermal fatigue performance of Sn–Ag–Cu chip-scale package with underfill (2008) (9)
- Evaluation of mechanical properties of low-Ag ball grid array solder joints using a high-speed ball shear test (2014) (9)
- The effect of isothermal aging on the thickness of intermetallic compound layer growth between low melting point solders and Ni-plated Cu substrate (2004) (9)
- Solderability of thin ENEPIG plating Layer for Fine Pitch Package application (2017) (9)
- The influence of MWNT composite on the stretchability of conductive nanopaste screen-printed on elastomeric substrate (2012) (9)
- Synthesis of Ag nanowires for the fabrication of transparent conductive electrode. (2013) (9)
- Effects of fine fiber structures on the mechanical and electrical properties of cold rolled Cu-Ag sheet (2003) (9)
- Interfacial reactions between In–48Sn solder and electroless nickel/immersion gold substrate during reflow process (2006) (9)
- Reliability evaluations of flip chip package under thermal shock test (2005) (9)
- Variation of Thermal Resistance of LED Module Embedded by Thermal Via (2010) (8)
- Evaluation of Joint Resistance Between Bi-2223/Ag Superconducting Tapes (2006) (8)
- Effects of Welding Parameters on the Friction Stir Weldability of 5052 AI alloy (2004) (8)
- Electrochemical migration of Ag nanoink patterns controlled by atmospheric-pressure plasma (2013) (8)
- Microstructure and Mechanical Properties of Sn-0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method (2005) (8)
- Electrical characterization of differential stretchable transmission line (2011) (8)
- Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages (2008) (8)
- Microstructures and Mechanical Properties of Double-Friction Stir Welded 2219 Al Alloy (2008) (8)
- The critical role of Ag nanowires in the improvement of conductivity and flexibility of circuits fabricated with hybrid Ag nanopaste (2015) (8)
- Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method (2007) (8)
- Correlation between the interfacial reaction and mechanical joint strength of the flip chip solder bump during isothermal aging (2005) (8)
- Microwave Sintering of Silver Nanoink for Radio Frequency Applications. (2015) (8)
- Transparent and flexible high frequency transmission lines based on composite structure comprising silver nanowires and polyvinyl butyral (2018) (8)
- Enhancing adhesion strength of photonic sintered screen-printed Ag circuit by atmospheric pressure plasma (2018) (8)
- The Joint Characteristics of Friction Stir Welded Mg-Zn-Y Alloy (2005) (8)
- Electromigration Behavior of Cu Core Solder Joints Under High Current Density (2020) (8)
- Effect of Aging treatment and Epoxy on Bonding Strength of Sn-58Bi solder and OSP-finished PCB (2014) (7)
- Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards (2008) (7)
- Effect of Reflow Number on Mechanical and Electrical Properties of Ball Grid Array (BGA) Solder Joints (2007) (7)
- Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test (2013) (7)
- Microstructure of interfacial reaction layer in Sn–Ag–Cu/electroless Ni (P) solder joint (2011) (7)
- Influence of current density on mechanical reliability of Sn-3.5Ag BGA solder joint (2011) (7)
- Thermal and Mechanical Properties of Flip Chip Package with Au Stud Bump (2013) (7)
- Pressureless transient liquid phase sintering bonding in air using Ni and Sn–58Bi for high-temperature packaging applications (2019) (7)
- Effect of bonding conditions on conduction behavior of anisotropic conductive film interconnection (2008) (7)
- Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock (2018) (7)
- Characterization of the thermal conductivity and mechanical properties of sheath alloy materials for Bi-2223 superconductor tapes (2001) (7)
- Fabrication of IPL-Sintered Ag-MWCNT composite circuits and their flexibility characteristics (2019) (7)
- Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding (2020) (7)
- Overview on Thermal Management Technology for High Power Device Packaging (2014) (7)
- Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package (2020) (7)
- Screen-printed Cu circuit for low-Cost fabrication and its electrochemical migration characteristics. (2014) (7)
- Fabrication of SiCp / AA 5083 composite via friction stir welding (2013) (7)
- A study on μBGA solder joints reliability using lead-free solder materials (2002) (7)
- Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test (2012) (7)
- Ultrasonic Bonding Technology for Flip Chip Packaging (2008) (7)
- Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior (2021) (6)
- Interfacial reactions and mechanical properties of In–48Sn solder joint with electroplated Au/Ni ball grid array (BGA) substrate after multiple reflows (2008) (6)
- Dynamic t–Tdyn–Tg diagram analysis of thermal isomerization of polyisoimide using complex electric modulus properties (2007) (6)
- Electrical Characteristics of Copper Circuit using Inkjet Printing (2010) (6)
- Electrochemical migration characteristics of screen-printed silver patterns on FR-4 substrate. (2012) (6)
- Fabrication and electrical characterization of through-Si-via interconnect for 3-D packaging (2009) (6)
- Reliability Assessment for Electronic Assemblies with Electrical and Electrochemical Properties Measurement (2007) (6)
- Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders (2011) (6)
- Induction Brazing of γ-TiAl to Alloy Steel AISI 4140 Using Filler Metal of Eutectic Ag-Cu Alloy Coated with Ti Film (2005) (6)
- The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature (2020) (6)
- The effect of pH on synthesizing Ni-decorated MWCNTs and its application for Sn-58Bi solder (2019) (6)
- Analysis of thermo-mechanical behavior of ITO layer on PET substrate (2011) (6)
- Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni–Cr)/PI interfaces in flexible printed circuits (2011) (6)
- Interfacial reactions between Sn-58 mass% Bi eutectic solder and (Cu, electroless Ni-P/Cu) substrate : Lead-free electronics packaging (2002) (6)
- Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes (2018) (6)
- Effect of sintering temperature on electrical characteristics of screen-printed Ag nanopaste on FR4 substrate. (2011) (6)
- Diffusion of manganese in Ni and Ni3Al (1999) (6)
- Flip-chip Bonding Technology and Reliability of Electronic Packaging (2007) (6)
- Effect of PWHT on Behaviors of Precipitates and Hardness Distribution of 6061 Al Alloy Joints by Friction Stir Welding Method (2004) (6)
- RF characteristics of flexible circuits patterned with hybrid Ag paste (2018) (6)
- Study on Characteristics of Sn-0.7wt%Cu-Xwt%Re Solder (2007) (6)
- Fabrication of Ni Metal Mask by Electroforming Process Using Wetting Agents (2007) (5)
- The reliability of ultrasonic bonded Cu to Cu electrode for 3D TSV stacking (2017) (5)
- Effect of rare earth metal Ce addition to Sn-Ag solder on interfacial reactions with Cu substrate (2014) (5)
- Electrical characteristics of printed Ag nanopaste on polyimide substrate. (2011) (5)
- Effect of surface treatment on the high-speed drop reliability of Pb-free solder interconnect (2013) (5)
- Effects of CaO and Ca additions on Microstructure and Ignition Resistance of Pure Mg (2006) (5)
- Effect of Ag nanowire addition into nanoparticle paste on the conductivity of Ag patterns printed by gravure offset method. (2014) (5)
- Drop reliability evaluation of Sn-3.0Ag-0.5Cu solder joint with OSP and ENIG surface finishes (2009) (5)
- Fabrication of Through-hole Interconnect in Si Wafer for 3D Package (2006) (5)
- Fast formation of Cu-Sn intermetallic joints using pre-annealed Sn/Cu/Sn composite preform for high-temperature bonding applications (2020) (5)
- Recent progress of Ti3C2Tx-based MXenes for fabrication of multifunctional smart textiles (2022) (5)
- Microstructures and Mechanical Properties of Friction Stir Welded 2.25Cr1Mo Steel (2012) (5)
- Transmission property of flip chip package with adhesive interconnection for RF applications (2009) (5)
- Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding (2021) (5)
- Interfacial Reaction and Joint Strength of the Sn-58Bi Solder Paste with ENIG Surface Finished Substrate (2012) (5)
- Fabrication of YBCO coated conductor by TFA-MOD method in route of dissolving Y211 and Ba3Cu5O8 powders in TFA (2005) (5)
- Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package (2020) (5)
- Characterization of Ag-Pd nanocomposite paste for electrochemical migration resistance. (2013) (5)
- Joint Characteristics of Spot Friction Stir Welded A 5052 Alloy Sheet (2006) (5)
- Microstructures and Mechanical Properties of the Sn58wt.%Bi Composite Solders with Sn Decorated MWCNT Particles (2019) (5)
- 1.4 µm-Thick Transparent Radio Frequency Transmission Lines Based on Instant Fusion of Polyethylene Terephthalate Through Surface of Ag Nanowires (2018) (5)
- Design of Solder Joint Structure for Flip Chip Package with an Optimized Shear Test Method (2007) (5)
- Characteristic analysis of electroless Ni plating layer for electronic packaging (2006) (4)
- Effect of gold immersion time on the electrochemical migration property of electroless nickel/immersion gold surface finishing. (2012) (4)
- Behavior of Anisotropic Conductive Film Joints Bonded with Various Forces under Temperature Fluctuation (2007) (4)
- Oxidation behavior of CaO added Mg and Mg-Al alloys (2007) (4)
- Characteristics of Nanophase WC and WC-3 wt% (Ni, Co, and Fe) Alloys Using a Rapid Sintering Process for the Application of Friction Stir Processing Tools (2015) (4)
- High-Temperature Oxidation of Ti–44Al–6Nb–2Cr–0.3Si–0.1C Alloy (2016) (4)
- Interfacial reactions and mechanical strength ofSn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint (2017) (4)
- Effect of high temperature storage test on reliability of eutectic Sn–Cu/ENIG solder joint (2007) (4)
- Recent Advances in Conductive Adhesives for Electronic Packaging Technology (2009) (4)
- Effect of black residue on the mechanical properties of Sn-58Bi epoxy solder joints (2019) (4)
- Adhesion characteristics of silver tracks screen-printed on polyimide with an environmental reliability test. (2012) (4)
- Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for Cu Ni bonding (2021) (4)
- Enhancement of Cu pillar bumps by electroless Ni plating (2017) (4)
- Reliability of nickel flip chip bumps with a tin-silver encapsulation on a copper/tin-silver substrate during the bonding process (2007) (4)
- Characteristic of Underfill with Various Epoxy Resin (2006) (4)
- Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy (2010) (4)
- Fabrication of Novel Ag Flake Composite Films Using a CMC/PEI Cross-Linking Process (2020) (3)
- Pressureless transient liquid phase bonding using SAC305 with hybrid Ag particles and its reliability under high-temperature storage test (2020) (3)
- Microstructures and thermal properties of Ag-CNT/Cu composites fabricated by friction stir welding (2019) (3)
- Microwave Performance of Flip Chip Interconnects With Anisotropic and Non-conductive Films (2008) (3)
- Joint properties and Interface Analysis of Friction Stir Welded Dissimilar Materials between Austenite Stainless Steel and 6013 Al Alloy (2005) (3)
- The Effects of the Humidity and Thickness on YBCO Film Prepared Using the TFA-MOD Method (2007) (3)
- Thermal Resistance Analysis of Light-Emitting Diode Modules with Thermal Via Structure (2018) (3)
- Effect of atmospheric-pressure plasma treatment on the adhesion characteristics of screen-printed Ag nanoparticles on polyimide. (2014) (3)
- Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi (2020) (3)
- Fabrication and characterization of Ag flake hybrid circuits with IPL-sintering (2020) (3)
- Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications (2016) (3)
- Ultrasonic Bonding of Au Flip Chip Bump for CMOS Image Sensor (2007) (3)
- Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding (2020) (3)
- Effect of PVP on fabrication of Cu nanoparticles using an electrical wire explosion method (2019) (3)
- Friction Stir Welding of Stainless Steels (2008) (3)
- Mechanical reliability of Sn-37Pb BGA solder joints with high-speed shear test (2008) (3)
- Reliability of chip on glass module fabricated with direct printing method (2013) (3)
- FAILURE BEHAVIORS OF FLIP CHIP SOLDER JOINTS UNDER VARIOUS LOADING CONDITIONS OF HIGH-SPEED SHEAR TEST (2009) (3)
- Joinability of Tool Steels by TLP Bonding (2003) (3)
- Fabrication of Ag circuit embedded in PDMS substrate and its mechanical and electrical property with variations of photonic energy (2018) (3)
- Effects of Polyvinylpyrrolidone Molecular Weight on Adhesion Strength of Screen-Printed Cu Circuits to Polyimide Substrate (2015) (3)
- Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder Joint on the OSP Surface Finished PCB Substrate (2018) (3)
- Effect of peak current density on the mechanical and electrical properties of copper/polymide fabricated by a pulsed electrodeposition process (2011) (3)
- Effect of Dispersed SiC Nano-particles in Eutectic Sn58Bi Solder Micro-Bumps of Wafer Level Package by Electroplating (2008) (3)
- Evaluation of Thermal Property and Fluidity with Underfill for BGA Package (2006) (3)
- Effects of the local microstructures on the mechanical properties in FSWed joints of a 7075-T6 Al alloy (2005) (3)
- Interfacial reactions and mechanical properties of Sn–3.0Ag–0.5Cu solder with pure Pd or Pd(P) layers containing thin-Au/Pd/Ni(P) surface-finished PCBs during aging (2020) (2)
- Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish (2020) (2)
- Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85°C/85% Relative Humidity Environmental Conditions (2019) (2)
- Study on Wettability of Sn-Xwt%Cu Solder (2007) (2)
- Reliability Evaluation of Electronic Circuit Printed Using Metallic Ink (2008) (2)
- A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM (2004) (2)
- A Study of the Growth Rate of Cu-Sn Intermetallic Compounds for Transient Liquid Phase Bonding during Isothermal Aging (2018) (2)
- Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics (2009) (2)
- Fabrication of SiCp/2024 Composite Alloys Using Friction Stir Welding and Its Mechanical Properties (2015) (2)
- Effect of Radio Frequency Plasma Treatment on Evaporation Behavior and Characteristics of RuCr Alloy Powder. (2015) (2)
- Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF) (2009) (2)
- Electrical and electrochemical migration characteristics of Ag/Cu nanopaste patterns. (2014) (2)
- Thermo-compression bonding of electrodes between FPCB and RPCB (2010) (2)
- Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder (2019) (2)
- SURFACE MODIFICATION OF PLASMA TREATMENT ON SiO2 LAYER WITH UNDERFILL (2007) (2)
- Design and analysis of Cu circuit for stretchable electronic circuits using finite element analysis (2021) (2)
- Effects of atmospheric pressure plasma surface treatments on the patternability and electrical property of screen-printed Ag nanopaste (2013) (2)
- Development of textured Ni substrates prepared by powder metallurgy and casting (2006) (2)
- High-temperature stability of Ni-Sn intermetallic joints for power device packaging (2022) (2)
- Interfacial Reaction of Cu/Sn-Ag/ENIG Sandwich Solder Joint during Aging (2006) (2)
- Ultrasonic bonding for multi-chip packaging bonded with non-conductive film (2011) (2)
- Ductile fracture mechanism of low-temperature In-48Sn alloy joint under high strain rate loading. (2012) (2)
- Fabrication and Characterization of the ${\rm MgB}_{2}$ Bulk Superconductors Doped by Carbon Nanotubes (2009) (2)
- Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test. (2018) (2)
- Areal and Structural Effect on Oxide based RRAM cell for Improving Resistive Switching Characteristics (2011) (2)
- Fabrication of high quality carbonaceous coating on Cu nanoparticle using poly(vinyl pyrrolidone) and its application for oxidation prevention (2016) (2)
- The effect of heat treatment on flexibility of silver nanopaste circuit screen-printed on polyimide (2010) (2)
- Analysis of the Test Parameters in the Shear Test of BGA Solder Joints (2005) (2)
- Thermo-Mechanical Behavior of Die Attach Film on Flexible PCB Substrate for Multi-Chip Package (2017) (2)
- Electrical characterization of adhesive flip chip interconnects for microwave application (2008) (2)
- Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing (2006) (2)
- Effects of Chemical Etching and Functionalization Times on the Properties of Cu/Polyimide Films (2010) (2)
- Effect of underfill on bending fatigue behavior of chip scale package (2008) (2)
- TEM study on the interfacial reaction between electroless plated Ni−P/Au UBM and Sn−3.5Ag solder (2007) (2)
- Friction Stir Welding of Duplex Stainless Steel (2010) (2)
- Ultrafast Photonic Soldering with Sn–58Bi Using Intense Pulsed Light Energy (2020) (2)
- The Effect of Environmental Test on the Shear Strength of the Ultrasonic bonded Cu Terminal for Power Module (2019) (1)
- Effect of Atmospheric-Pressure Plasma Treatment on the Adhesion Characteristics of a Flexible Copper Clad Laminate (2009) (1)
- Effects of Pd layer thickness on mechanical properties and microstructures of Sn-3.0 Ag-0.5 Cu solder joints (2014) (1)
- Effect of Multiple Reflows on Mechanical and Electrical Properties of ENIG/Sn-3.5Ag/ENIG Ball Grid Array (BGA) Solder Joint (2009) (1)
- Transmission property of adhesive interconnect for high frequency applications (2007) (1)
- Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental Conditions. (2018) (1)
- Novel Low Power RRAM with a U-type Cell Structure for Improving Resistive Switching Characteristics (2010) (1)
- Thermo-compression Bonding of Electrodes between RPCB and FPCB using Sn-Pb Solder (2010) (1)
- Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability (2021) (1)
- Characteristics of Reliability for Flip Chip Package with Non-conductive paste (2007) (1)
- Study on microstructure and mechanical properties of friction stir welded 9% Ni steel (2009) (1)
- Mechanical strength of chip scale package with various underfills under accelerated thermal condition (2007) (1)
- Characterization of reliability of printed indium tin oxide thin films. (2013) (1)
- Microstructures and Mechanical Properties of AA6061-T4 Composites Containing SiC and B4C Particles Fabricated by Friction Stir Processing (2020) (1)
- Bending reliability of Ni–MWCNT composite solder with a differential structure (2020) (1)
- Reset Current Reduction with Excellent Filament Controllability by using Area Minimized and Field Enhanced Unipolar RRAM structure (2011) (1)
- Thermal Characteristic of Sn-MWCNT Nanocomposite Solder in LED Package (2017) (1)
- Technical Trends of Stretchable Electrodes (2019) (1)
- Friction Stir Spot Welding of Light Non Ferrous Metal for Automobile (2011) (1)
- Effects of Bonding Conditions on Mechanical Strength of Sn-58Bi Lead-Free Solder Joint using Thermo-compression Bonding Method (2013) (1)
- High-Temperature Oxidation of AZ91D/Y 2 O 3 Magnesium Composites in Air (2015) (1)
- Application of the Taguchi Method to Optimize Graphene Coatings on Copper Nanoparticles Formed Using a Solid Carbon Source (2016) (1)
- Fabrication of Sn–58Bi–xCe Solder Paste Using Electrical Wire Explosion Method and its Mechanical Property (2017) (1)
- Electromigration Behavior of through-Si-via (TSV) Interconnect for 3-D Flip Chip Packaging (2010) (1)
- Development and evaluation of a Cu composite sheet with embedded high electric conduction path for new interconnect material (2011) (1)
- Microstructures and mechanical properties of MgOp/SPHC metal matrix composites joint by friction stir welding (2016) (1)
- Effect of SDBS on the oxidation reliability of screen-printed Cu circuits (2020) (1)
- Recent Studies on Friction Stir Welding of High Carbon Steels (2009) (1)
- Thermal resistance of light emitting diode PCB with thermal vias. (2012) (1)
- Effect of Oxidation Amount on Gradual Switching Behavior in Reset Transition of Al/TiO 2 based Resistive Switching Memory and its Mechanism for MLC Operation (2011) (1)
- Application of MEMS Technology in Microelectronic Packaging (2006) (1)
- Effect of heat treatment on physical and electrical characteristics of conductive circuits printed on Si substrate (2011) (1)
- Effect of Non-conductive Film on the Reliability of Multi-chip Package Bonded Using Ultrasonic Energy (2011) (1)
- Assessment of Investment Process for Producing Copper Hollow Spheres (2002) (1)
- Growth kinetics of intermetallic compound layers at the interface during laser-assisted bonding depending on surface finish (2020) (1)
- Friction Stir Welding of 7055 Al Alloy (2005) (1)
- Pressureless Transient Liquid Phase Sintering Bonding of Sn-58Bi with Ni Particles for High-Temperature Packaging Applications (2019) (1)
- Friction Stir Spot Welding of Steel Alloy (2008) (1)
- Thermal and hygroscopic reliability of flip-chip packages with an anisotropic conductive film (2007) (1)
- Effect of Time and Pressure on Ultrasonic Bonding Strength of Flexible Printed Circuit Board to Glass with Nonconductive Film (2009) (1)
- Reliability of Cu-Cu direct interconnections using ultrasonic bonding process between RPCB and FPCB (2011) (1)
- Effects of Bonding Conditions on Joint Property between FPCB and RPCB using Thermo-Compression Bonding Method (2011) (1)
- Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn–58Bi solder joints during aging (2020) (1)
- Adhesion of PDMS substrates assisted by Plasma Graft Polymerization (2016) (1)
- Fabrication of Cu–MWNT nanocomposite and its electrochemical migration behaviors (2016) (1)
- Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging (2019) (1)
- Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test (2020) (1)
- Interfacial reaction and shear strength of Sn–0.7Cu solder/electrolytic Ni joints with reflow time (2005) (1)
- Investigation of Cu–Cu Ultrasonic Bonding in Multi-Chip Package Using Non-Conductive Adhesive (2012) (1)
- Wire Sweep Characterization in System-in-Package (SiP) Component with Au Wire Bonding During Epoxy Molding Compounds Molding Process (2015) (1)
- Standardization of the Important Test Parameters in the Solder Ball Shear Test for Evaluation of the Mechanical Joint Strength (2005) (1)
- Effects of Silane Coupling Agents on the Adhesion Strength of a Printed Cu Circuit on Polyimide (2020) (1)
- Friction Stir Welding of Ferritice Stainless Steel (2014) (0)
- Electrical and mechanical characterization of lead-free solder with different surface finishes (2008) (0)
- Microstructures and Mechanical Property of SiCp/SPHC Metal Matrix Composite Joint by Friction Stir Welding (2012) (0)
- Evaluation of bonding characteristics of thermal compression bonded solder joints via nanoindentation test (2021) (0)
- The transient liquid phase bonding by ultrasonic-assisted soldering of Cu contained Sn-58Bi solder paste for high-temperature packaging applications (2022) (0)
- Thermomechanical Properties of Fan-Out Wafer Level Package Fabricated with Various Epoxy Mold Compound (2019) (0)
- Role of Current Density on the Cu Electro-plating Process for FCCL (2008) (0)
- Reliability of Flip Chip Package with Underfills under Thermal Shock (2006) (0)
- Variation of peel strengths of copper circuit layer on anodic aluminum oxide layer (2013) (0)
- AEM observation of interfacial reaction layers formed between Sn-3.5Ag solder and ENIG plated Cu substrate (2006) (0)
- [P3-65] Physicochemical and SEM Studies on Capsosiphon fulvescens Powders Prepared Using Different Drying Methods (2010) (0)
- Silver Hybrid Paste for Improvement of Radio Frequency Characteristics (2016) (0)
- Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test (2021) (0)
- Modeling of flip-chip interconnects using novel neural network approaches (2005) (0)
- Fabrication of the YBCO Films Made by TFA-MOD Using the 211-Process (2007) (0)
- Evaluation of Thermal and Hygro-Thermal Behaviors of Flip Chip Packages With a Non-conductive Paste (2008) (0)
- Effect of Atmospheric Pressure Plasma Treatment on Joint Strength between Flip Chip Bump and Flexible Printed Circuit Board (FPCB) Bonded Using Ultrasonic (2007) (0)
- Evaluation of the Long-Term Reliability of the Epoxy-Contained SAC305 Solder with Organic Solderability Preservative Surface Finish (2017) (0)
- Effect of Atmospheric Pressure Plasma Treatment on Au Flip Chip Bumps Bonded with Cu Circuit on Glass Using Ultrasonic Energy (2008) (0)
- Characteristics of ultrasonic bonding joint between metal PCB and flexible PCB (2010) (0)
- Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging (2008) (0)
- Estimation of Machinability of Lead Brass Based on In-Situ Observation in Scanning Electron Microscope (1994) (0)
- Effect of Sintering Temperature on Electrical Properties of Chip on Glass Module with Direct Printing Method (2012) (0)
- Microstructural evolution and mechanical properties of SAC305 with the intense pulsed light soldering process under high-temperature storage test (2021) (0)
- Effect of Atmospheric-Pressure Plasma Treatment on the Joint Strength between Au Flip Chip Bumps and Cu-Finished Si Wafer Substrates Bonded Using Ultrasonic Energy (2009) (0)
- Effects of Cu Opening Size on the Mechanical Properties of Epoxy-Contained Sn-58Bi Solder Joints. (2019) (0)
- Effect of Sodium Dodecylbenzene Sulfonate Contents on Oxide Behavior in Cu Nanopaste (2017) (0)
- Transmission property of flip chip package with adhesive interconnection for high frequency applications (2007) (0)
- Electromigration Behavior of Sn58Bi and Sn58Bi Epoxy Solder Joint (2020) (0)
- Ultrasonic Bonding of Au Stud Flip Chip Bump on Flexible Printed Circuit Board (2007) (0)
- THE EFFECT ON B₄C PARTICLES ON THE MICROSTRUCTURE AND MECHANICAL PROPERTIES FRICTION STIR PROCESSED A356 ALLOY (2012) (0)
- Pressureless transient liquid phase sintering bonding using SAC305 with hybrid Ag particles for high–temperature packaging applications (2020) (0)
- Modifying of Tin based solder composition with optimized Bi, Ni and Cu contents for high TC and drop shock reliability (2022) (0)
- Mechanical Properties and Microstructure of Cu Core Solder Ball (CCSB) Compared with SAC305 Solder for 2.5D and 3D Structure Package (PKG) (2020) (0)
- Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints (2018) (0)
- Effect of tool rotation speed on microstructures and mechanical properties of friction stir welded steels with different carbon contents (2012) (0)
- Effect of Atmospheric Pressure Plasma Treatment on Adhesion Characteristic of Flexible Copper Clad Laminate (2008) (0)
- The Effect of Heat Treatment And SiC Particles On the Microstructure And Corrosion Property of Friction Stir Welded Al 5083 Alloy (2012) (0)
- Effect of isothermal aging on the intermetallic compound layer growth in BGA joints with Sn-Ag-Cu solder (2003) (0)
- Texture Evolution in Ni Substrate Prepared by Powder Metallurgy and Casting Methods (2007) (0)
- Analysis on Characterization of Ag Circuits Fabricated by Direct Printing and Electron Beam Evaporation (2012) (0)
- Thermomechanical Properties of Fan-Out Wafer Level Package with Various Chip and Mold Thickness (2018) (0)
- Effects of Tool Materials on Corrosion Properties of Friction Stir Welded 409 Stainless steel (2009) (0)
- Thermal Resistivity Properties of LED Packages with Thermal via (2010) (0)
- Variation of Thermal Resistance in LED Modules with Thermal Via (2010) (0)
- Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps (2006) (0)
- Fabrication of YBCO coated conductor by TFA-MOD using the “211 process” (2006) (0)
- Effects of Temperature–Humidity Treatment on Bending Reliability of Epoxy Sn–58Bi Solder with Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finishes (2020) (0)
- Fabrication and Characterization of the � Bulk Superconductors Doped by Carbon Nanotubes (2009) (0)
- Mechanical properties and microstructures of Cu/In-48Sn alloy/Cu with low temperature TLP bonding (2022) (0)
- Fabrication and Characterizations of Nickel Metal Mask with fine Pitch by Additive Process (2007) (0)
- Manufacturing and Properties of Metal Based Composite Produced By Friction Stir Processing (2012) (0)
- RF Characterization in Range of 18GHz in Fan-out Package Structure Molded by Epoxy Molding Compound with EMI Shielding Property (2022) (0)
- Bondability and Reliability of Multi-Chip Packages Bonded with Non-Conductive Paste Using Thermal Compression Energy and Ultrasonic Energy (2017) (0)
- Electrical Characterization of Electronic Package (2008) (0)
- Atmospheric-Pressure Plasma Sintering of Silver Nanopaste Screen-Printed on PI (2012) (0)
- Development of YBCO film approached by TFA-MOD method using the Y2Ba1Cu1Ox and Ba3Cu5O8 powders (2006) (0)
- Thermal and Thermomechanical Behaviors of the Fan-Out Package With Embedded Ag Patterns (2020) (0)
- Role of Oxygen in the Ti3AlC2 MAX Phase in the Oxide Formation and Conductivity of Ti3C2-Based MXene Nanosheets. (2023) (0)
- Effect of Zn content on Shear Strength of Sn-0.7Cu-xZn and OSP surface finished Joint with High Speed Shear Test (2017) (0)
- Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints (2016) (0)
- Effect of Different Surface Finishes on Bending Reliability of the Rigid Printed Circuit Board and Flexible Printed Circuit Board Substrate Joints with the Transverse Ultrasonic Bonding Process (2019) (0)
- Bonding Strength of the Sn-58Bi Jointed IC Card Component Bonded by Ultrasonic Energy (2017) (0)
- Researches in Corrosion Resistance of Friction Stir Welded Aluminum alloys (2013) (0)
- Effect of Underfill and Cornerfill on the 3-Point Bending Reliability of BGA Package Under Thermal Shock Test (2020) (0)
- Bonding Characteristic of Nanopaste for Direct Bonding in Electronic Package Systems (2013) (0)
- Environmental Reliability Evaluation of the Ultrasonic Bonded Metal with High- Temperature Test (2022) (0)
- 2P4-3 Evaluation of high ductile ENIG plated electrodes bonded with transverse ultrasonic(Poster Session) (2009) (0)
- 1Pb-49 Thermal characterization of lead-free epoxy solder on ultrasonically bonded flip chip package(Poster Session) (2010) (0)
- Characteristics of High-Speed Shear Test Parameters for Brittle Interfacial Fracture of Solder Joint (2008) (0)
- Thermal Conductivity Measurement Method for the Thin Epoxy Adhesive Joint Layer (2021) (0)
- Development of Heat Shielding Part for RFID Tag using Porous Aluminum Alloy (2011) (0)
- Peel strengths of the Composite Structure of Metal and Metal Oxide Laminate (2013) (0)
- The Study on Chip Surface Treatment for Embedded PCB (2012) (0)
- Evaluation on bonding reliability of SAC305/Sn-57.5Bi-0.4Ag BGA solder joints with drop impact test (2022) (0)
- Study on Fabrication of 3-Dimensional Stacked Chip Package with Anisotropic Conductive Film (2009) (0)
- Analysis of peel strength of consisting of an aluminum sheet, anodic aluminum oxide and a copper foil laminate composite (2017) (0)
- Fabrication of Electroless-plated Cu Layer on Surface Modified Polyimide for 2-layer FCCL (2008) (0)
- Ultrasonic bonding of fine-pitch Au stud flip chip bump with flexible printed circuit board (2007) (0)
- Effect of Surface Finish Material on Wetting Property of Sn-Xwt.%Ag Solder (2008) (0)
- Characterization of Ag nanoparticles formed by encapsulation method with vacuum oil (2011) (0)
- Microstructures and Mechanical Properties of Friction Stir Welded 2 . 25 Cr 1 (2012) (0)
- A Study on Adhesive Properties of a Damascene Electroplated Cu Composite Sheet (2011) (0)
- Mechanical Reliability Evaluation of Sn-37Pb/Cu and Sn-37Pb/ENIG Solder Joints by using High Speed Lap-shear Test (2008) (0)
- Characterizations of the Mechanical Properties and Wear Behavior of Ni Plate Fabricated by the Electroforming Process (2007) (0)
- Electrical properties and interfacial reaction of BGA package with underfill (2008) (0)
- Numerical analysis and experimental verification of ISC(Integrated Smart Card) during bending and twist test (2011) (0)
- Microstructure and mechanical property of A 356 based composite by friction stir processing (2013) (0)
- Mechanical Reliability of Epoxy Sn–58wt.%Bi Composite Solder Under Temperature-Humidity Treatment with Organic Solderability Preservatives (OSP) Surface Finish (2020) (0)
- Intense Pulsed Light Soldering of Sn–3.0Ag–0.5Cu Ball Grid Array Component on Au/Pd(P)/Ni(P) Surface Finished Printed Circuit Board and Its Drop Impact Reliability (2023) (0)
- Adhesion Improvement of Copper Nanopaste on Glass Surface Modified by Atmospheric-Pressure Plasma (2015) (0)
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