Suresh Sitaraman
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Suresh Sitaramanengineering Degrees
Engineering
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#9417
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Mechanical Engineering
#848
World Rank
#917
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Applied Physics
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#3110
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Engineering
Suresh Sitaraman's Degrees
- PhD Mechanical Engineering University of California, Berkeley
- Masters Mechanical Engineering University of California, Berkeley
Why Is Suresh Sitaraman Influential?
(Suggest an Edit or Addition)According to Wikipedia, Suresh K Sitaraman is the Regents' Professor and Morris M. Bryan, Jr. Professor of the George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, USA. Education Dr Suresh Sitaraman received his Bachelor of Engineering degree in Mechanical Engineering from Regional Engineering College, Tiruchirappalli affiliated to University of Madras in 1982. He also obtained his Master of Applied Science degree from the University of Ottawa, Canada in 1985 and Doctor of Philosophy from the Ohio State University, USA in 1989.
Suresh Sitaraman's Published Works
Number of citations in a given year to any of this author's works
Total number of citations to an author for the works they published in a given year. This highlights publication of the most important work(s) by the author
Published Works
- Magnetic alignment of hexagonal boron nitride platelets in polymer matrix: toward high performance anisotropic polymer composites for electronic encapsulation. (2013) (333)
- Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV) (2009) (168)
- Elastic–plastic characterization of thin films using nanoindentation technique (2003) (83)
- Die cracking and reliable die design for flip-chip assemblies (1999) (73)
- Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test (2013) (73)
- Waviness reduces effective modulus of carbon nanotube forests by several orders of magnitude (2014) (61)
- Thermo-mechanical analysis of solder joint fatigue and creep in a flip chip on board package subjected to temperature cycling loading (1998) (50)
- A knowledge-based system for process-sequence design in axisymmetric sheet-metal forming (1991) (46)
- A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration (2015) (44)
- J-Springs - innovative compliant interconnects for next-generation packaging (2002) (42)
- Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC (2011) (39)
- Vibration-induced solder joint failure of a Ceramic Column Grid Array (CCGA) package (2004) (39)
- A study into the sequencing of thermal cycling and vibration tests (2008) (38)
- An integrated process modeling methodology and module for sequential multi-layered substrate fabrication using a coupled cure-thermal-stress analysis approach (2000) (37)
- Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: experimental characterization (2003) (36)
- /spl beta/-Helix: a lithography-based compliant off-chip interconnect (2003) (33)
- Effect of material and geometry parameters on the thermo-mechanical reliability of flip-chip assemblies (1998) (33)
- Solder Joint Reliability Prediction for Multiple Environments (2008) (31)
- Development of G-Helix Structure as Off-Chip Interconnect (2004) (30)
- Numerical modeling of interfacial delamination propagation in a novel peripheral array package (2001) (29)
- G-helix: lithography-based wafer-level compliant chip-to-substrate interconnects (2004) (29)
- Thermo-mechanical behavior of through silicon vias in a 3D integrated package with inter-chip microbumps (2011) (28)
- Interfacial fracture toughness measurement for thin film interfaces (2004) (28)
- Methodology for modeling substrate warpage using copper trace pattern implementation (2009) (28)
- Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power Maps (2017) (28)
- Reliability Assessment of Through-Silicon Vias in Multi-Die Stack Packages (2012) (27)
- Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package (2008) (27)
- Role of dielectric material and geometry on the thermo-mechanical reliability of microvias (2002) (26)
- Flexible micro-spring interconnects for high performance probing (2000) (24)
- Thermo-mechanical failure comparison and evaluation of CCGA and CBGA electronic packages (2003) (24)
- Thermomechanical strain measurements by synchrotron x-ray diffraction and data interpretation for through-silicon vias (2013) (24)
- Study of Intermetallic Growth and Kinetics in Fine-Pitch Lead-Free Solder Bumps for Next-Generation Flip-Chip Assemblies (2013) (23)
- A bio-enabled maximally mild layer-by-layer Kapton surface modification approach for the fabrication of all-inkjet-printed flexible electronic devices (2016) (23)
- Electrical/Mechanical Modeling, Reliability Assessment, and Fabrication of FlexConnects: A MEMS-Based Compliant Chip-to-Substrate Interconnect (2009) (22)
- Design optimization of one-turn helix: a novel compliant off-chip interconnect (2003) (21)
- In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation (2014) (21)
- Magnetically actuated peel test for thin films (2012) (20)
- Experimental and numerical investigation of microvia reliability (2002) (20)
- Fixtureless superlayer-driven delamination test for nanoscale thin-film interfaces (2007) (20)
- Prevention of Cracking From RDL Stress and Dicing Defects in Glass Substrates (2016) (20)
- Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: modeling and evaluation (2003) (20)
- FlexConnects: A Cost-Effective Implementation of Compliant Chip-to-Substrate Interconnects (2007) (20)
- Mixed-mode cohesive zone parameters for sub-micron scale stacked layers to predict microelectronic device reliability (2016) (19)
- Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures (2000) (19)
- Study of Chip–Package Interaction Parameters on Interlayer Dielectric Crack Propagation (2014) (19)
- Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM) (1997) (19)
- Determination of Fracture Toughness for Metal/Polymer Interfaces (1999) (18)
- Compliant cantilevered spring interconnects for flip-chip packaging (2001) (18)
- Modeling spatial strain gradient effects in thermo-mechanical fatigue of copper microstructures (2004) (18)
- Predictive Model Development for Life Prediction of PBGA Packages With SnAgCu Solder Joints (2010) (18)
- Study of cracking of thin glass interposers intended for microelectronic packaging substrates (2015) (18)
- Experiments for Obtaining Cohesive-Zone Parameters for Copper-Mold Compound Interfacial Delamination (2016) (18)
- Dimension and liner dependent thermomechanical strain characterization of through-silicon vias using synchrotron x-ray diffraction (2013) (17)
- An experimental technique to determine critical stress intensity factors for delamination initiation (2003) (17)
- Development of virtual reliability methodology for area-array devices used in implantable and automotive applications (2000) (17)
- Flip-chip on glass (FCOG) package for low warpage (2014) (17)
- Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies (2014) (16)
- Interlayer dielectric cracking in back end of line (BEOL) stack (2012) (16)
- Accelerated thermal cycling: is it different for lead-free solder? (2004) (16)
- Next generation of package/board materials technology for ultra-high density wiring and fine-pitch reliable interconnection assembly (2004) (16)
- Investigation of the curing behavior of a novel epoxy photo-dielectric dry film (ViaLux™ 81) for high density interconnect applications (2000) (15)
- Damage Metric-Based Mapping Approaches for Developing Accelerated Thermal Cycling Guidelines for Electronic Packages (2001) (15)
- Thermal and mechanical characterization of ViaLUX/sup TM/ 81: a novel epoxy photo-dielectric dry film (PDDF) for microvia applications (2001) (15)
- Reliable Design of Electroplated Copper Through Silicon Vias (2010) (15)
- Domed and Released Thin-Film Construct—An Approach for Material Characterization and Compliant Interconnects (2012) (15)
- Cyclic magnetic actuation technique for thin film interfacial fatigue crack propagation (2016) (14)
- Multi-Physics Modeling and Characterization of Components on Flexible Substrates (2019) (14)
- Electrical design of wafer level package on board for gigabit data transmission (2003) (14)
- ZAP: a knowledge-based FEA modeling method for highly coupled variable topology multi-body problems (2008) (14)
- Assembly and Reliability Assessment of Lithography-Based Wafer-Level Compliant Chip-to-Substrate Interconnects (2005) (14)
- Interfacial Fracture Toughness Measurement of a Ti/Si Interface (2004) (13)
- Thin dielectric-layer-enabled low-voltage operation of fully printed flexible carbon nanotube thin-film transistors (2020) (13)
- Do chip size limits exist for DCA (1999) (13)
- Process modeling for sequential build-up of multi-layered structures (1998) (13)
- Enhanced reliability of high-density wiring (HDW) substrates through new base substrate and dielectric materials (2004) (13)
- Interfacial fracture toughness for delamination growth prediction in a novel peripheral array package (2001) (12)
- Predictive fatigue life equation for CBGA electronic packages based on design parameters (2004) (12)
- THERMOMECHANICAL CAD/CAE INTEGRATION IN THE TIGER PWA TOOLSET (1997) (12)
- Experimental and Simulation Study of Double-Sided Flip-Chip Assembly With a Stiffener Ring (2014) (12)
- The experimental measurement of effective compressive modulus of carbon nanotube forests and the nature of deformation (2013) (12)
- Design optimization of One-Turn Helix - a novel compliant off-chip interconnect (2002) (12)
- Study of Wearables with Embedded Electronics Through Experiments and Simulations (2018) (12)
- Comparison of Sn-Ag-Cu Solder Alloy Intermetallic Compound Growth Under Different Thermal Excursions for Fine-Pitch Flip-Chip Assemblies (2013) (12)
- Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages (2007) (12)
- Physics-based reliability assessment of embedded passives (2004) (11)
- Response Surface and Multiobjective Optimization Methodology for the Design of Compliant Interconnects (2014) (11)
- Low-K Dielectric Compatible Wafer-Level Compliant Chip-to-Substrate Interconnects (2008) (11)
- Design and optimization of a novel compliant off-chip interconnect One-Turn Helix (2002) (11)
- Methodology for Modeling Substrate Warpage Using Copper Trace Pattern Implementation (2008) (11)
- Thermal and mechanical characterization of ViaLux(TM) 81: a novel epoxy photo-dielectric dry film (PDDF) for microvia applications (2000) (11)
- Adaptive Curvature Flexure Test to Assess Flexible Electronic Systems (2018) (10)
- An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls (2007) (10)
- System-level reliability assessment of mixed-signal convergent microsystems (2004) (10)
- A fatigue crack propagation model with resistance curve effects for an epoxy/copper interface (2017) (10)
- Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction (2002) (10)
- Design and assembly of a double-sided 3D package with a controller and a DRAM stack (2012) (9)
- Combined finned microgap with dedicated extreme-microgap hotspot flow for high performance thermal management (2016) (9)
- Cohesive zone experiments for copper/mold compound delamination (2014) (9)
- Methodology to Predict Substrate Warpage and Different Techniques to Achieve Substrate Warpage Targets (2011) (9)
- Time evolution of temperature distribution of a flip-chip no-flow underfill package during solder reflow process (2003) (9)
- A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical Performance (2007) (9)
- TSV electrical and mechanical modeling for thermo-mechanical delamination (2013) (9)
- Framework to extract cohesive zone parameters using double cantilever beam and four-point bend fracture tests (2014) (8)
- Optical loss changes in siloxane polymer waveguides during thermal curing (2007) (8)
- Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling (2000) (8)
- Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications (2002) (8)
- Effect of thermal aging on cohesive zone models to study copper leadframe/mold compound interfacial delamination (2015) (8)
- The size effect on intermetallic microstructure evolution of critical solder joints for flip chip assemblies (2015) (8)
- Asymmetric accelerated thermal cycles: an alternative approach to accelerated reliability assessment of microelectronic packages (2003) (8)
- Compliance analysis of multi-path fan-shaped interconnects (2013) (8)
- Three-path electroplated copper compliant interconnects — Fabrication and modeling studies (2013) (8)
- Flow boiling of R245fa in a microgap with integrated staggered pin fins (2016) (8)
- Multi-path fan-shaped compliant off-chip interconnects (2011) (8)
- The fabrication of ultra long metal nanowire bumps and their application as interconnects (2012) (8)
- Four-laser bending beam measurements and FEM modeling of underfill induced wafer warpage (2004) (8)
- Effect of underfill on BGA reliability (2001) (8)
- Effect of adhesive layer properties on interfacial fracture in thin-film high-density interconnects (2002) (7)
- Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly (2010) (7)
- Study of Electrical and Mechanical Characteristics of Inkjet-Printed Patch Antenna Under Uniaxial and Biaxial Bending (2019) (7)
- Ag3Sn Compounds Coarsening Behaviors in Micro-Joints (2018) (7)
- Effect of temperature and humidity conditioning on copper leadframe/mold compound interfacial delamination (2020) (7)
- Thermo-mechanical design of microelectronic packages through Design-of-Simulations methodology (1999) (7)
- Double-Side Process and Reliability of Through-Silicon Vias for Passive Interposer Applications (2014) (7)
- Study of coupled thermal electric behavior of compliant micro-spring interconnects for next generation probing applications (2003) (7)
- Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission (2004) (7)
- Recent Advances in Ceramic Composite Substrate Materials for High-Density and High Reliability Packaging Applications (2005) (7)
- Reliability study of micro-pin fin array for on-chip cooling (2015) (7)
- Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment (2004) (7)
- Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates (2007) (7)
- FEM modeling of temperature distribution of a flip-chip no-flow underfill package during solder reflow process (2004) (7)
- Thermo-mechanical modeling of a novel MCM-DL technology (1996) (6)
- Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials (2006) (6)
- New Method to Measure Tensile Strength of Low Modulus Thin Films (2011) (6)
- Design and Fabrication of FlexConnects: A Cost-Effective Implementation of Compliant Chip-to-Substrate Interconnects (2008) (6)
- Experimental and Theoretical Assessment of Thin Glass Substrate for Low Warpage (2017) (6)
- Electroplated copper nanowires as Thermal Interface Materials (2016) (6)
- Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages (2015) (6)
- Area-Array of 3-Arc-Fan Compliant Interconnects as Effective Drop-Impact Isolator for Microsystems (2016) (6)
- Mechanical and High-Frequency Electrical Study of Printed, Flexible Antenna Under Deformation (2020) (6)
- Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics (2020) (6)
- Mechanical and Electrical Behavior of Printed Silver Conductor in Adaptive Curvature Flexure Test (2020) (6)
- New Reworkable High Temperature Low Modulus (in Excess of 400–500 °C) Adhesives for MCM-D Assembly (2000) (6)
- Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates (2005) (6)
- Micro-scale plasticity effects in microvia reliability analysis (2002) (6)
- Study of inkjet-printed serpentine structure on flexible substrates deformed over sculptured surfaces (2020) (6)
- Twist Testing for Flexible Electronics (2019) (6)
- Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon Vias (2016) (5)
- Flexible and Ultra-Thin Glass Substrates for RF Applications (2021) (5)
- Multigated Carbon Nanotube Field Effect Transistors-Based Physically Unclonable Functions As Security Keys (2019) (5)
- Enhanced Reliability of High Density Wiring (HDW) Substrates Through New Dielectric and Base Substrate Materials (2002) (5)
- Shear test on hard coated flip-chip bumps to measure back end of the line stack reliability (2017) (5)
- Process Innovations to Prevent Glass Substrate Fracture From RDL Stress and Singulation Defects (2016) (5)
- Materials, processes and reliability of mixed-signal substrates for SOP technology (2004) (5)
- Stress engineered metal interconnects (2001) (5)
- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging (2008) (5)
- Bladder Inflation Stretch Test Method for Reliability Characterization of Wearable Electronics (2019) (5)
- In-process measurement of the interfacial fracture toughness for a sub-micron titanium thin film and silicon interface using a single-strip decohesion test (2004) (5)
- Numerical study of interfacial delamination in a system-on-package (SOP) integrated substrate under thermal loading (2000) (5)
- Cohesive Zone Parameters for a Cyclically Loaded Copper-Epoxy Molding Compound Interface (2016) (5)
- A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface (2015) (5)
- Effect of out-of-plane material behavior on in-plane modeling (1998) (5)
- Reliable Design of TSV in Free-Standing Wafers and 3D Integrated Packages (2011) (5)
- Fabrication of Second-Level TriDelta Interconnects Using Negative Dry-Film Photoresist (2014) (5)
- Fracture-mechanics based delamination growth prediction in the very small periphery array (VSPA/sup TM/) package (1998) (4)
- Visualization of Delamination in Encapsulated Flexible Electronics Fabricated using Slot Die Coating (2020) (4)
- Cure kinetics modeling and process optimization of the vialux 81 epoxy photodielectric dry film (PDDF) material for microvia applications (2002) (4)
- Cyclic Bending Effects on Resistance of Screen-Printed Silver Conductors (2021) (4)
- Microstructure-Evolution and Reliability Assessment Tool for Lead-Free Component Insertion in Army Electronics (2008) (4)
- Acceleration Factor to relate Thermal Cycles to Power Cycles for Ceramic Ball Grid Area Array Packages (2006) (4)
- Multi-physics Modeling Characterization of Aerosol Jet Printed Transmission Lines (2018) (4)
- High-temperature, low-modulus adhesive attach for large-area thin-film processing on silicon and alumina tiles (1999) (4)
- Thermal annealing effects on copper microstructure in Through-Silicon-Vias (2016) (4)
- Material Interaction Effects in the Reliability of High Density Interconnect (HDI) Boards (2003) (4)
- Mechanical and Electrical Study of Linear Spring and J-Spring (2002) (4)
- Comparison of IMC growth in flip-chip assemblies with 100- and 200-μm-pitch SAC305 solder joints (2013) (4)
- Characterization of Mechanical Properties of Thin Films by Nanoindentation Technique and Finite Element Simulation (2002) (4)
- Analytical model to study interfacial delamination propagation in a multi-layered electronic packaging structure under thermal loading (2000) (4)
- System-Design-for-Reliability Tools for Highly Integrated Electronic Packaging Systems (2007) (4)
- Modeling methodologies to study PWB assembly reliability (2002) (4)
- Studies on design, fabrication and reliability assessment of embedded passives on a high-density interconnect (HDI) organic substrate using a sequential build-up process (2006) (4)
- 2004 proceedings, 9th International Symposium on Advanced Packaging Materials : processes, properties and interfaces, March 24-26, 2004, Atlanta, Georgia, USA (2004) (3)
- Determination of Energy Release Rate Through Sequential Crack Extension (2017) (3)
- Effect of underfill on BGA reliability (2001) (3)
- Modified Decohesion Test (MDT) for Interfacial Fracture Toughness Measurement in Microelectronic/MEMS Applications (2002) (3)
- Evaluation of the Quality of BGA Solder Balls in FCBGA Packages Subjected to Thermal Cycling Reliability Test Using Laser Ultrasonic Inspection Technique (2021) (3)
- Three-Mask Fabrication and Optimized Design of First-Level Free-Standing Interconnect for Microelectronics Application (2003) (3)
- Measurement of the Mode Mix Dependent Interfacial Fracture Toughness for a Ti/Si Interface Using a Modified Decohesion Test (2003) (3)
- Scaling effect on Ag3Sn growth behaviours in micro-joints for flip chip assemblies (2018) (3)
- Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction (2020) (3)
- Printed circuit board (PCB) miniaturization by embedded passives and sequential build-up (SBU)process methodology (2013) (3)
- Board-Level Reliability of 3D through Glass via Filters During Thermal Cycling (2016) (3)
- Nano-spring arrays for high-density interconnect (2000) (3)
- Coupled thermal electric-modeling of flexible nanospring interconnects for high-performance probing (2001) (3)
- Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials (2008) (3)
- Design, microfabrication and thermal characterization of a hotspot cooler testbed for convective boiling experiments in extreme-microgap with integrated micropin-fins (2016) (3)
- Do chip size limits exist for DCA? (1999) (3)
- Use of Birefringence to Determine Redistribution Layer Stresses to Create Design Guidelines to Prevent Glass Cracking (2017) (3)
- Use of compliant interconnects for drop impact isolation (2013) (3)
- Fatigue crack propagation in a copper/epoxy molding compound interface as impacted by mode-mixity (2019) (3)
- Biaxial Inflation Stretch Test for Flexible Electronics (2021) (3)
- Cure kinetics modeling of ViaLux/sup TM/ 81: a novel epoxy photodielectric dry film (PDDF) for microvia applications (2000) (2)
- The effect of substrate materials on the thermo-mechanical behavior of multilayered structures (1997) (2)
- Random vibration analysis of 3-Arc-Fan compliant interconnects (2018) (2)
- Single-substrate decohesion test (SSDT) for interfacial fracture toughness measurement (2003) (2)
- Use of compliant adhesives in the large area processing of MCM-D substrates (1998) (2)
- Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics (2015) (2)
- Screen-Printed Flexible Coplanar Waveguide Transmission Lines: Multi-physics Modeling and Measurement (2019) (2)
- Microstructure evolution based acceleration factor determination for SnAgCu solder joints during thermal cycling (2008) (2)
- A Lithography-Based Compliant Chip-to-Substrate Wafer-Level Interconnect (2002) (2)
- Mechanical Deformation Study of Flexible Leadset Components for Electromechanical Reliability of Wearable Electrocardiogram Sensors (2020) (2)
- Role of base substrate material on dielectric and copper interlayer separation (2002) (2)
- Single-sample decohesion test: mechanics and implementation (2004) (2)
- Stress-induced birefringence in siloxane polymer waveguides (2007) (2)
- Compliant Stress-Engineered Interconnects for Next-Generation Packaging (2004) (2)
- Novel nanospring interconnects for high-density applications (2001) (2)
- In-situ strain measurement with metallic thin film sensors (2012) (2)
- Parallel-Path Compliant Structures as Electrical Interconnects (2010) (2)
- Biaxial Inflation Stretch Test for Printed Electronics (2020) (2)
- Stretchability of Serpentine Interconnect on Polymer Substrate for Flexible Electronics: A Geometry and Material Sensitivity Analysis (2020) (2)
- Thermal Cycling Guidelines for Automotive, Computer, Portable, and Implantable Medical Device Applications (2000) (2)
- Cyclic Magnetic Actuation for Potential Characterization of Interfacial Fatigue Fracture (2010) (2)
- A Characterization Method for Interfacial Delamination of Copper/Epoxy Mold Compound Specimens under Mixed Mode I/III Loading (2017) (2)
- Microcontact Spring Reliability: Design Against Interfacial Fracture (2009) (2)
- A Modeling Method For The Study Of Thermomechanical Behavior Of High Density Interconnect (HDI) Vias (1998) (2)
- Development of Reliability Allocation and Assessment Algorithms for Designing Multilevel Microelectronic Systems (2008) (2)
- Reliability assessment of hydrofoil-shaped micro-pin fins (2016) (2)
- Using Carrier Fringes to Study the High Temperature Deformation Behavior of a BGA Package Under Extended Dwell Times (2008) (2)
- Wafer-Level, Compliant, Off-Chip Interconnects for Next-Generation Low-K Dielectric/Cu IC’s (2006) (2)
- Interfacial Fracture Characterization of Nano-Scale Thin Films Using Single-Strip Stress-Engineered Superlayer (2006) (2)
- Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages (2021) (1)
- Nano-Cantilevers for an Ultra-Sensitive Bio-Assay (2005) (1)
- Low-Temperature Assembly of Surface-Mount Device on Flexible Substrate Using Additive Printing Process (2018) (1)
- Mechanical Characterization of Anodic Bonding Using Chevron Microchannel (2017) (1)
- Thermal Aging Reliability of Package-Level Polymer Optical Waveguides (2008) (1)
- ROM: a reliability knowledge representation for collaborative system design (2010) (1)
- Sequential process modeling of SLIM substrate fabrication (1998) (1)
- Use of stress-engineered material layers for the measurement of interfacial fracture toughness of nanoscale thin films (2009) (1)
- Chip scale polymer stud grid array packaging and reliability based on low cost flip chip processing (2000) (1)
- Encyclopedia of Packaging Materials, Processes, and Mechanics (2019) (1)
- Non-contact magnetic actuation test technique to characterize interfacial fatigue fracture of thin films (2009) (1)
- Laser moiré interferometry for fatigue life prediction of lead-free solders (2010) (1)
- Reliability Objects Model: A Knowledge Model of System Design for Reliability (2005) (1)
- Acceleration Factor to Relate Thermal Cycles to Power Cycles for CBGA Packages (2009) (1)
- Correction to "Die-cracking and reliable die design for flip-chip assemblies" (2000) (1)
- Thermo-mechanical evaluation of embedded optical interconnects on board (2004) (1)
- Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects (2013) (1)
- Micro and Nano Thin Film Devices as Bio-Assays for Cancer Diagnosis (2006) (1)
- Biaxial Inflation Stretch Test for Printed Flexible Electronics (2021) (1)
- A hybrid computer-aided engineering system for process sequence design in axisymmetric sheet metal forming / (1989) (1)
- Mechanics Issues at Micro-Scale Modeling of Electronic Packages (2001) (1)
- An Efficient Implementation of Polymer Viscoelastic Behavior Through a Pseudo Viscoelastic Model (2011) (1)
- Anti‐ICAM‐1 –Conjugated Quantum Dots as Target in Intestinal Inflammation (2006) (1)
- Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies (2020) (1)
- Two and three-dimensional modeling of VSPA butt solder joints (1997) (1)
- Thermal Cycling Simulation and Sensitivity Analysis of Wafer Level Chip Scale Package with Integration of Metal-Insulator-Metal Capacitors (2019) (1)
- Contact Reliability of Innovative Compliant Interconnects for Next Generation Electronic Packaging (2003) (1)
- Damage Evolution of Double-Sided Copper Conductor on Multi-layer Flexible Substrate Under Bending (2022) (1)
- Chip Package Co-Design: Effect of Substrate Warpage on BEOL Reliability (2013) (1)
- Microneedle Insertion into Visco-Hyperelastic Model for Skin for Healthcare Application (2021) (1)
- Mechanical and Ka-Band Electrical Reliability Testing of Interconnects in 5G Wearable System-on-Package Designs Under Bending (2022) (1)
- Novel board material technology for next-generation packaging (2004) (1)
- Fully Additively Manufactured Flexible Dual-Band Slotted Patch Antenna for 5G/mmwave Wearable Applications (2022) (0)
- A Monobit Built-In Test and Diagnostic System for Flexible Electronic Interconnect (2018) (0)
- Crowbar Loading-A New Test Technique to Characterize Interfacial Delamination (2023) (0)
- Universal Predictive Fatigue Life Equation and the Effect of Design Parameters (2009) (0)
- Embedded Thin Film Resistors on BCB by Low-Cost PWB Compatible Electroless Plating by Direct Foil Lamination Transfer Processes (2006) (0)
- Challenges in modeling of accelerated life testing ITHERM 2004 panel discussion (2004) (0)
- mcruRE-mcmNIcs BASED DELAMINATION GROWTH PREDICTION IN THE VERY SMALL PERIF'HERY ARRAY (VSPAm) PACKAGE (1998) (0)
- Low-cost mixed mode module: Computer-aided mechanical design (MCAD) (1999) (0)
- Strain Monitoring Near Through Silicon Vias Using Metal Piezoresistive Sensors (2014) (0)
- Validation of Unified FEM for Thermal Cycling and Power (2009) (0)
- Alternative Compliant Interconnects: Thermo-Mechanical Reliability, Design and Testing (2001) (0)
- Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls (2021) (0)
- An automatic numerical approach to optimize flexible serpentine structure design (2022) (0)
- Biaxial Stretching Leads to Abrupt Electrical Failure in Printed Inks on Stretchable Polymer Substrates (2022) (0)
- Crowd-Funding for Inspiring Graduate Students to Educate K12 Students About STEM (2014) (0)
- Solder Joint Fatigue Failure under Sequential Thermal and Vibration Environments (2009) (0)
- Predictive solder joint reliability assessment of board-on-chip package for DDR-II DRAM application (2005) (0)
- Process-Induced Stress Effect on Reliability of ChipSeal (2002) (0)
- Innovative off-chip interconnects for 45-nm and sub-45-nm node ICs (2009) (0)
- Study of Electroplated Compliant G-Helix Chip-to-Substrate Interconnects (2003) (0)
- Experiments in turbulent bundle flows. (1986) (0)
- Thermomechanical Reliability Investigation of Carbon Nanotube Off-Chip Interconnects for Electronic Packages (2022) (0)
- Superlayer Test for Interfacial Fracture Toughness Measurements (2004) (0)
- Selection of base substrate material for design against interfacial delamination for a multilayered system-on-package (SOP) structure (2001) (0)
- System-Level Reliability Assessment of Mixed-Signal (2004) (0)
- Novel Ceramic Composite Substrates for High-Density and High Reliability Packaging (2007) (0)
- Interfacial Delamination Propagation in Multi-Layered High-Density Wiring Electronic Packaging Structures (2000) (0)
- Single-Strip Decohesion Test to Characterize Nano-Scale Thin Film Delamination (2005) (0)
- A Fracture Mechanics Analysis of Underfill Delamination in Flip Chip Packages (2005) (0)
- Mandrel Bend Test of Screen-Printed Silver Conductors (2022) (0)
- Design, Fabrication and Reliability Assessment of Embedded Resistors and Capacitors in a Multilayered Organic Substrate with Microvias (2006) (0)
- Design, Fabrication, and Assembly of 3-Arc-Fan Compliant Interconnects (2019) (0)
- Reliability Assessment and Failure Analysis of G-Helix, a Free-Standing Compliant Off-Chip Interconnect (2009) (0)
- Cohesive Zone Models to Predict Multiple White Bumps in Flip-Chip Assemblies (2014) (0)
- Cohesive fracture measurement technique for free-hanging thin films using highly stressed superlayer (2022) (0)
- Fabrication and Bioconjugation of Micro- and Nanoscale Structures Intended for Cancer-Specific Antigen Detection (2009) (0)
- Solder Joint Reliability Assessment for Desktop and Space Applications (2009) (0)
- Solder shock test modeling (1997) (0)
- Unified Finite Element Modeling for Prediction of Solder Joint Fatigue (2009) (0)
- Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging (2017) (0)
- The Characterization of Underfill-Passivation Interface Under Monotonic and Fatigue Loading and Its Application to Flip Chip Reliability Prediction (2005) (0)
- Development of Fatigue Life Equations Under Low-Cycle Thermal and Power Cycling (2009) (0)
- Magnetically Actuated Test Method for Interfacial Fracture Reliability Assessment (2021) (0)
- Modeling Flexible Electronics Under Biaxial Strain (2021) (0)
- Magnetic-Based Interfacial Adhesion Measurement Technique with Environmental Conditions (2022) (0)
- Manufacturing Technology (MATES) II. Task Order 0006: Air Force Technology and Industrial Base Research Sub-Task 07: Future Advances in Electronic Materials and Processes-Flexible Hybrid Electronics (2016) (0)
- Process Modeling and Interfacial Behavior in the VSPA Package (1997) (0)
- Design-for-Reliability Tools for Highlyintegrated System-on-Package Technology (2007) (0)
- Thermomechanical reliability of high density wiring substrates (2002) (0)
- Qualification guidelines for automotive packaging devices (2000) (0)
- EFFECT OF INTERMETALLIC COMPOUNDS ON THERMOMECHANICAL RELIABILITY OF LEAD-FREE SOLDER INTERCONNECTS (2004) (0)
- Interfacial Delamanination of Mold Compound in Fan-Out Packages (2017) (0)
- Multi-layered structure: adhesive selection and process mechanics [HDI] (1999) (0)
- Mechanical Characterization of Ultra-Thin, Flexible Glass Substrates for RF Applications (2022) (0)
- Thermo-Mechanical Fatigue Life Estimation of Organic BGA Packages Using Laser Moire Interferometry (2006) (0)
- FRONT MATTER (2019) (0)
- Mechanical Reliability Assessment of 3-Arc-Fan Compliant Interconnects (2019) (0)
- Validation of Unified FEM and Development of Fatigue-life Equations for Vibration (2009) (0)
- Correction to "High-temperature, low-modulus adhesive attach for large-area thin-film processing on silicon and alumina tiles" (2000) (0)
- SOP Embedded Thin Film Resistors on High and Low Loss Thin Film Dielectrics (2005) (0)
- Novel Board Material Technology for Next-Generation Microelectronic Packaging (2012) (0)
- Selection of optimal materials and geometry for reliability of high density wiring substrates (2002) (0)
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