Yogendra Kumar Joshi
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Yogendra Kumar Joshiengineering Degrees
Engineering
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Mechanical Engineering
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Applied Physics
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Engineering
Yogendra Kumar Joshi's Degrees
- Masters Mechanical Engineering IIT Roorkee
- Bachelors Mechanical Engineering IIT Roorkee
Why Is Yogendra Kumar Joshi Influential?
(Suggest an Edit or Addition)Yogendra Kumar Joshi's Published Works
Number of citations in a given year to any of this author's works
Total number of citations to an author for the works they published in a given year. This highlights publication of the most important work(s) by the author
Published Works
- Thermal Challenges in Next-Generation Electronic Systems (2003) (358)
- Visualization of droplet departure on a superhydrophobic surface and implications to heat transfer enhancement during dropwise condensation (2010) (249)
- Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices (2007) (175)
- Hybrid micro-nano structured thermal interfaces for pool boiling heat transfer enhancement (2006) (174)
- Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls (2011) (160)
- Melting in a side heated tall enclosure by a uniformly dissipating heat source (2001) (155)
- Energy Efficient Thermal Management of Data Centers (2012) (154)
- Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components (2000) (147)
- Characterization of nanostructured thermal interface materials – A review (2012) (145)
- Single-phase liquid cooled microchannel heat sink for electronic packages (2005) (142)
- Thermodynamic analysis of an absorption refrigeration system with ionic-liquid/refrigerant mixture as a working fluid (2012) (125)
- VPM tokens: virtual machine-aware power budgeting in datacenters (2009) (114)
- Modeling of data center airflow and heat transfer: State of the art and future trends (2007) (109)
- Design and performance evaluation of a compact thermosyphon (2002) (106)
- Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux (2010) (101)
- High-speed visualization of boiling from an enhanced structure (2002) (98)
- Effect of Tip Clearance on the Thermal and Hydrodynamic Performance of a Shrouded Pin Fin Array (2003) (92)
- Energy efficient thermal management of electronic components using solid-liquid phase change materials (2004) (87)
- A Brief Overview of Recent Developments in Thermal Management in Data Centers (2015) (87)
- Thermal issues in next-generation integrated circuits (2004) (85)
- Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface (2007) (78)
- Thermal challenges in next generation electronic systems - summary of panel presentations and discussions (2002) (77)
- Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study (1997) (76)
- Interfacial transport of evaporating water confined in nanopores. (2011) (74)
- Enhanced Boiling of a Dielectric Liquid on Copper Nanowire Surfaces (2010) (73)
- Heat transfer enhancement from enclosed discrete components using pin-fin heat sinks (2002) (73)
- A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling (2001) (72)
- Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering (2016) (72)
- Electrical conductivity and Joule heating of polyacrylonitrile/carbon nanotube composite fibers (2014) (70)
- Effects of Varying Geometrical Parameters on Boiling From Microfabricated Enhanced Structures (2003) (68)
- Thermal Management of an Avionics Module Using Solid-Liquid Phase-Change Materials (1998) (66)
- The Thermal Design of a Next Generation Data Center: A Conceptual Exposition (2007) (61)
- Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants (2012) (61)
- Thermal Characteristics of Open and Contained Data Center Cold Aisle (2013) (59)
- Semi-analytical model for boiling from enhanced structures (2003) (59)
- An absorption based miniature heat pump system for electronics cooling (2008) (57)
- Flower-Like CuO Nanostructures for Enhanced Boiling (2012) (55)
- Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes (2018) (55)
- Development of liquid cooling techniques for flip chip ball grid array packages with High Heat flux dissipations (2005) (55)
- An Approach to Robust Design of Turbulent Convective Systems (2006) (53)
- Thermal Issues in Next Generation Integrated Circuits (2003) (50)
- Thermal performance of microchannels with wavy walls for electronics cooling (2010) (50)
- Fluid flow and heat transfer in liquid cooled foam heat sinks for electronic packages (2005) (49)
- Gas-Assisted Thin-Film Evaporation from Confined Spaces for Dissipation of High Heat Fluxes (2009) (49)
- Rack Level Modeling of Air Flow Through Perforated Tile in a Data Center (2012) (48)
- Heat transfer and fluid flow in shrouded pin fin arrays with and without tip clearance (2009) (48)
- Pressure drop and heat transfer characteristics of square pin fin enhanced microgaps in single phase microfluidic cooling (2013) (47)
- Effect of pressure stress work and viscous dissipation in some natural convection flows (1981) (45)
- Proper Orthogonal Decomposition for Reduced Order Thermal Modeling of Air Cooled Data Centers (2010) (45)
- Thermal modeling of gas tungsten arc welding process with nonaxisymmetric boundary conditions (1995) (44)
- A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration (2015) (44)
- Determination of gas tungsten arc welding efficiencies (1994) (43)
- Heat and mass transfer during evaporation of thin liquid films confined by nanoporous membranes subjected to air jet impingement (2013) (43)
- Natural Convection Liquid Cooling of a Substrate-Mounted Protrusion in a Square Enclosure: A Parametric Study (1992) (42)
- Multi-parameter model reduction in multi-scale convective systems (2010) (41)
- Visualization study of pool boiling from thin confined enhanced structures (2005) (41)
- Optimizing thermal design of data center cabinets with a new multi-objective genetic algorithm (2007) (40)
- Liquid Immersion Cooling of a Substrate-Mounted Protrusion in a Three-Dimensional Enclosure: The Effects of Geometry and Boundary Conditions (1994) (39)
- Comparison of thermal performance between glass and silicon interposers (2013) (39)
- Size Effect on the Thermal Conductivity of Thin Metallic Films Investigated by Scanning Joule Expansion Microscopy (2008) (38)
- Transition of transient vertical natural-convection flows in water (1987) (38)
- Boiling Performance of Single-Layered Enhanced Structures (2005) (38)
- Multi-Scale Modeling of High Power Density Data Centers (2003) (37)
- Comparison of data driven modeling approaches for temperature prediction in data centers (2019) (37)
- Issues in validating package compact thermal models for natural convection cooled electronic systems (1997) (37)
- Error estimation in POD-based dynamic reduced-order thermal modeling of data centers (2013) (36)
- Convective Transport Processes in Data Centers (2006) (36)
- Natural convection arising from a heat generating substrate-mounted protrusion in a liquid-filled two-dimensional enclosure (1991) (36)
- Co-design of signal, power, and thermal distribution networks for 3D ICs (2009) (35)
- Reduced Order Thermal Modeling of Data Centers via Distributed Sensor Data (2012) (35)
- Challenges in thermal modeling of electronics at the system level: summary of panel held at the Therminic 2000 (2001) (34)
- Comparison of electro-thermal performance of advanced cooling techniques for electric vehicle motors (2021) (34)
- Wire-bonding process monitoring using thermopile temperature sensor (2005) (33)
- Heat transfer in discretely heated side-vented compact enclosures by combined conduction, natural convection, and radiation (1999) (33)
- Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics (2004) (33)
- Three-Dimensional Study of Combined Conduction, Radiation, and Natural Convection From Discrete Heat Sources in a Horizontal Narrow-Aspect-Ratio Enclosure (1999) (33)
- CHARACTERIZATION OF NANOSTRUCTURED THERMAL INTERFACE MATERIALS - A REVIEW (2011) (32)
- Hydraulic and thermal performances of metal foam and pin fin hybrid heat sink (2020) (32)
- Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management (2009) (32)
- Computations of liquid immersion cooling for a protruding heat source in a cubical enclosure (1993) (32)
- Impact of Copper Through-Package Vias on Thermal Performance of Glass Interposers (2015) (32)
- High-Quality Vertically Aligned Carbon Nanotubes for Applications as Thermal Interface Materials (2014) (31)
- Multiscale Thermal Modeling Methodology for Thermoelectrically Cooled Electronic Cabinets (2007) (31)
- Co-design of multicore architectures and microfluidic cooling for 3D stacked ICs (2013) (31)
- A numerical study of three-dimensional laminar natural convection in a vented enclosure (1997) (31)
- Computational Fluid Dynamics Modeling of Flow Boiling in Microchannels With Nonuniform Heat Flux (2018) (31)
- Vertical natural convection flows in porous media: Calculations of improved accuracy (1984) (31)
- On-chip thermal management of hotspots using a perspiration nanopatch (2010) (31)
- Reduced-order modeling of turbulent forced convection with parametric conditions (2007) (30)
- Reduced order thermal modeling of data centers via proper orthogonal decomposition: a review (2010) (30)
- Adaptable Robust Design of Multi-Scale Convective Systems Applied to Energy Efficient Data Centers (2010) (29)
- Experimental Investigation of Air Flow Through a Perforated Tile in a Raised Floor Data Center (2015) (29)
- COMPACT THERMOSYPHONS EMPLOYING MICROFABRICATED COMPONENTS (1999) (29)
- Modeling Strategies for Air Flow Through Perforated Tiles in a Data Center (2013) (29)
- Thermal Performance of a Compact Two-phase Thermosyphon: Response to Evaporator Confinement and Transient Loads (1999) (29)
- THERMAL MANAGEMENT OF HIGH TEMPERATURE PULSED ELECTRONICS USING METALLIC PHASE CHANGE MATERIALS (2002) (29)
- A compact approach to on-chip interconnect heat conduction modeling using the finite element method (2008) (28)
- Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power Maps (2017) (28)
- Experimental investigations on the effect of perforated tile air jet velocity on server air distribution in a high density data center (2010) (28)
- Performance characterization of a novel flat plate micro heat pipe spreader (2002) (28)
- Thermal characterization of a liquid cooled AlSiC base plate with integral pin fins (2001) (27)
- Reduced Order Thermal Models of Multiscale Microsystems (2012) (27)
- Experimental and numerical study of sidewall profile effects on flow and heat transfer inside microchannels (2007) (27)
- Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger Arrangement (2011) (27)
- SPATIALLY-AWARE OPTIMIZATION OF ENERGY CONSUMPTION IN CONSOLIDATED DATA CENTER SYSTEMS (2011) (26)
- Parametric thermal modeling of heat transfer in handheld electronic devices (2008) (26)
- A new general model for phase-change heat transfer of waxy crude oil during the ambient-induced cooling process (2017) (26)
- Flow regimes and convective heat transfer of refrigerant flow boiling in ultra-small clearance microgaps (2017) (26)
- Experimental Characterization of Various Cold Aisle Containment Configurations for Data Centers (2015) (26)
- Mixed convection in porous media adjacent to a vertical uniform heat flux surface (1985) (25)
- CoolIT: coordinating facility and it management for efficient datacenters (2008) (25)
- Nonaxisymmetric convection in stationary gas tungsten arc weld pools (1997) (25)
- Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center (2010) (24)
- Hybrid Solid State/Fluidic Cooling for Hot Spot Removal (2009) (24)
- Enhancing the performance of aluminum foam heat sinks through integrated pin fins (2020) (24)
- Flow boiling of R245fa in a microgap with staggered circular cylindrical pin fins (2018) (23)
- Enhanced boiling heat transfer simulation from structured surfaces : Semi-analytical model (2006) (23)
- Reduced order modeling and experimental validation of steady turbulent convection in connected domains (2008) (23)
- Room Level Modeling of Air Flow in a Contained Data Center Aisle (2014) (23)
- A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete Heating (2005) (23)
- Artificial Neural Network Based Prediction of Temperature and Flow Profile in Data Centers (2018) (23)
- Effect of server load variation on rack air flow distribution in a raised floor data center (2011) (23)
- Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet (2005) (22)
- Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles (2017) (22)
- Airflow Management in a Contained Cold Aisle Using Active Fan Tiles for Energy Efficient Data-Center Operation (2016) (22)
- Evaluation of analytical models for thermal analysis and design of electronic packages (2003) (22)
- Thermal resistance of thermal conductive adhesive anchored carbon nanotubes interface material (2015) (21)
- Heat Transfer in Microchannels With Suspended Solid Particles: Lattice-Boltzmann Based Computations (2010) (21)
- Performance of a Compact Two-Chamber Two-Phase Thermosyphon : Effect of Evaporator Inclination , Liquid Fill Volume and Contact Resistance (1998) (21)
- Novel heat transfer fluids for direct immersion phase change cooling of electronic systems (2012) (21)
- Experimental investigation of hotspot removal using superlattice cooler (2010) (20)
- Experimental characterization of cold aisle containment for data centers (2013) (20)
- Comparison of Single-Phase Convection in Additive Manufactured Versus Traditional Metal Foams (2020) (20)
- Energy efficient liquid-thermoelectric hybrid cooling for hot-spot removal (2012) (19)
- Natural Convection Heat Transfer From an Array of Rectangular Protrusions in an Enclosure Filled With Dielectric Liquid (1994) (19)
- Effect of rack server population on temperatures in data centers (2012) (19)
- Thermal management of power electronics with liquid cooled metal foam heat sink (2021) (19)
- IC test structures for multilayer interconnect stress determination (2000) (19)
- An Experimental Study of Natural Convection From an Array of Heated Protrusions on a Vertical Surface in Water (1989) (19)
- Forced convection air-cooling of a commercial electronic chassis: an experimental and computational case study (1996) (19)
- Fundamentals of Data Center Airflow Management (2012) (18)
- Infrared Imaging Microscope as an Effective Tool for Measuring Thermal Resistance of Emerging Interface Materials (2011) (18)
- Coordinated Optimization of Cooling and IT Power in Data Centers (2010) (18)
- Transient Natural Convection From a Leadless Chip Carrier in a Liquid Filled Enclosure: A Numerical Study (1992) (17)
- Physical Models in Data Center Airflow Simulations (2003) (17)
- A new technique for three-dimensional transient heat transfer computations of autogenous arc welding (1990) (17)
- How well can we assess thermally driven reliability issues in electronic systems today? Summary of panel held at the Therminic 2002 (2003) (16)
- Thermally dependent characteristics and spectral hole burning of the double-lasing, edge-emitting quantum-dot laser (2010) (16)
- EFFECT OF CONDENSER LOCATION AND IMPOSED CIRCULATION ON THE PERFORMANCE OF A COMPACT TWO-PHASE THERMOSYPHON (2003) (16)
- Parametric thermal modeling of 3D stacked chip electronics with interleaved solid heat spreaders (2006) (16)
- Introduction to Data Center Energy Flow and Thermal Management (2012) (16)
- Thermal Modeling of Technology Infrastructure Facilities: A Case Study of Data Centers (2009) (16)
- Dynamics of cold aisle air distribution in a raised floor data center (2010) (16)
- Natural convection liquid immersion cooling of a heat source flush mounted on a conducting substrate in a square enclosure (1993) (16)
- Rapid modeling of air flow through perforated tiles in a raised floor data center (2014) (16)
- A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling (2020) (16)
- Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems (2016) (15)
- Numerical modeling and experimental validation of two-phase microfluidic cooling in silicon devices for vertical integration of microelectronics (2019) (15)
- Impact of active tiles on data center flow and temperature distribution (2016) (15)
- Thermal properties of particulate TIMs in squeeze flow (2010) (15)
- Rapid Temperature Predictions in Data Centers using Multi-Parameter Proper Orthogonal Decomposition (2014) (15)
- Integrated thermal analysis of natural convection air cooled electronic enclosure (1999) (15)
- Numerical study of conjugate heat transfer in stacked microchannels (2004) (15)
- Boiling of Water at Subatmospheric Conditions With Enhanced Structures: Effect of Liquid Fill Volume (2008) (15)
- Energy reduction in server cooling via real time thermal control (2012) (15)
- Air Flow Management in Raised Floor Data Centers (2015) (15)
- A semianalytical solution for the 3ω method including the effect of heater thermal conduction (2008) (14)
- Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps (2017) (14)
- Cooling power optimization for hybrid solid-state and liquid cooling in integrated circuit chips with hotspots (2012) (14)
- Capillary Performance of Micropillar Arrays in Different Arrangements (2018) (14)
- Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell (2009) (14)
- Further study on the thermal characteristic of a buried waxy crude oil pipeline during its cooling process after a shutdown (2017) (14)
- MICRO AND MESO SCALE COMPACT HEAT EXCHANGERS IN ELECTRONICS THERMAL MANAGEMENT-A REVIEW (2005) (14)
- Enhancement in CMOS chip performance through microfluidic cooling (2014) (14)
- Development of a prototype thermal management solution for 3-D stacked chip electronics by interleaved solid spreaders and synthetic jets (2007) (14)
- An integrated methodology for multiobjective optimal component placement and heat sink sizing (2005) (14)
- Transport phenomena in material processing (1990) (14)
- Transient response of a steady vertical flow subject to a change in surface heating rate (1988) (14)
- Flow boiling heat transfer in silicon microgaps with multiple hotspots and variable pin fin clustering (2019) (14)
- Computations for a Three-by-Three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity (1995) (13)
- Cold Aisle Air Distribution in a Raised Floor Data Center With Heterogeneous Opposing Orientation Racks (2011) (13)
- Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors (2016) (13)
- Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux (2012) (13)
- Orientation independent two-phase heat spreaders for space constrained applications (2003) (13)
- Capillary-assisted evaporation/boiling in PDMS microchannel integrated with wicking microstructures. (2020) (13)
- Performance assessment of thermoelectric coolers for use in high temperature electronics applications (1999) (13)
- Single chamber compact two-phase heat spreaders with microfabricated boiling enhancement structures (2002) (13)
- Dynamic thermal characterization of raised floor plenum data centers: Experiments and CFD (2019) (13)
- Thermal management of a 3D chip stack using a liquid interface to a synthetic jet cooled spreader (2009) (13)
- Rack level transient CFD modeling of data center (2018) (13)
- A novel conduction-convection based cooling solution for 3D stacked electronics (2010) (13)
- Experimental characterization of a micro-scale thin film evaporative cooling device (2010) (13)
- Measurement of Air Flow Rate Through Perforated Floor Tiles in a Raised Floor Data Center (2017) (12)
- Energy and Exergy Analysis of Modular Data Centers (2017) (12)
- Vertical transient natural convection flows in cold water (1984) (12)
- Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors (2007) (12)
- Reduced Order Modeling of Steady Turbulent Convection Flows Using the POD (2005) (12)
- Experimental demonstration of the effect of copper TPVs (Through package vias) on thermal performance of glass interposers (2014) (12)
- Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications (2016) (12)
- Two-Phase Heat Spreaders Utilizing Microfabricated Boiling Enhancement Structures (2004) (11)
- Coupled inviscid-viscous solution method for bounded domains: Application to data-center thermal management (2015) (11)
- Compact, Low Temperature Refrigeration of Microprocessors (2006) (11)
- Thermal Modeling of Data Centers for Control and Energy Usage Optimization (2018) (11)
- Numerical simulation of electron transport through constriction in a metallic thin film (2004) (11)
- Time scale matching of dynamically operated devices using composite thermal capacitors (2014) (11)
- Thermal Performance Analysis of Biporous Metal Foam Heat Sink (2017) (11)
- Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials (2015) (11)
- An Experimental Study of Natural Convection Cooling of an Array of Heated Protrusions in a Vertical Channel in Water (1989) (11)
- Robust Design of Air-Cooled Server Cabinets for Thermal Efficiency (2005) (11)
- ESEM Imaging of Condensation on a Nanostructured Superhydrophobic Surface (2010) (11)
- Pool Boiling of HFE 7200–C4H4F6O Mixture on Hybrid Micro-Nanostructured Surface (2012) (10)
- A Field Investigation Into the Limits of High-Density Air-Cooling (2013) (10)
- Boiling at sub-atmospheric conditions with enhanced structures (2006) (10)
- Algebraic Multigrid Preconditioned Krylov Subspace Methods for Fluid Flow and Heat Transfer on Unstructured Meshes (2006) (10)
- Single phase liquid cooling of hotspots in a heterogeneous pin-fin-enhanced microgap with non-uniform fin array (2017) (10)
- Hybrid Liquid Immersion and Synthetic Jet Heat Sink for Cooling 3-D Stacked Electronics (2012) (10)
- Wire bond temperature sensor (2001) (10)
- Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional IC With Non-Uniform Heat Flux (2009) (9)
- Coupled Electro-Thermal Analysis of Permanent Magnet Synchronous Motor for Electric Vehicles (2020) (9)
- Leakage power characterization and minimization in 3D stacked multi-core chips with microfluidic cooling (2014) (9)
- Server Heat Load Based CRAC Fan Controller Paired With Rear Door Heat Exchanger (2011) (9)
- Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber (2019) (9)
- Cryogenic/sub-ambient cooling of electronics: revisited (2004) (9)
- Modified Body Force Model for Air Flow Through Perforated Floor Tiles in Data Centers (2016) (9)
- Experimental Characterization of Hybrid Solid-State and Fluidic Cooling for Thermal Management of Localized Hotspots (2015) (9)
- Combined finned microgap with dedicated extreme-microgap hotspot flow for high performance thermal management (2016) (9)
- Single phase laminar flow and heat transfer characteristics of microgaps with longitudinal vortex generator array (2017) (9)
- Two phase convective cooling for ultra-high power dissipation in microprocessors (2014) (8)
- Dynamic thermal management of high heat flux devices using embedded solid-liquid phase change materials and solid state coolers (2012) (8)
- Flow visualization of two phase flow of R245fa in a microgap with integrated staggered pin fins (2016) (8)
- On the use of second law based cost functions in plate fin heat sink design (2011) (8)
- CFD Analysis of Flow Boiling in a Silicon Microchannel With Non-Uniform Heat Flux (2015) (8)
- Comparison of the VOF and CLSVOF Methods for the Assessment of Flow Boiling in Silicon Microgaps (2017) (8)
- Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell (2013) (8)
- Fluid-to-fluid spot-to-spreader (F2/S2) hybrid heat sink for integrated chip-level and hotspot-level thermal management (2008) (8)
- Flow boiling of R245fa in a microgap with integrated staggered pin fins (2016) (8)
- Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin Heatsinks (2016) (8)
- Proper Orthogonal Decomposition-Based Modeling Framework for Improving Spatial Resolution of Measured Temperature Data (2014) (8)
- Two-Phase Flow and Heat Transfer in Pin-Fin Enhanced Micro-Gaps With Non-Uniform Heating (2013) (8)
- Natural convection cooling of a ceramic substrate mounted leadless chip carrier in dielectric liquids (1991) (8)
- A Modular Stackable Concept for Heat Removal From 3-D Stacked Chip Electronics by Interleaved Solid Spreaders and Synthetic Jets (2009) (8)
- Performance of an Air-Cooled Heat Sink Channel With Microscale Dimples Under Transitional Flow Conditions (2013) (8)
- Transient characterization of data center racks (2016) (8)
- EFFECTS OF ORTHOTROPIC THERMAL CONDUCTIVITY OF SUBSTRATES IN NATURAL CONVECTION COOLING OF DISCRETE HEAT SOURCES (1997) (7)
- Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method (2017) (7)
- Microfabricated thin silicon vapor chamber for low profile thermal management (2017) (7)
- DYNAMIC REDUCED ORDER THERMAL MODELING OF DATA CENTER AIR TEMPERATURES (2011) (7)
- Rack level forecasting model of data center (2017) (7)
- Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water (1990) (7)
- APPLICATION OF BLOCK-IMPLICIT MULTIGRID APPROACH TO THREE-DIMENSIONAL HEAT TRANSFER PROBLEMS INVOLVING DISCRETE HEATING (1999) (7)
- Hybrid solid state/fluidic cooling for hotspot removal (2008) (7)
- Comparison of Numerical Modeling to Experimental Data in a Small, Low Power Data Center Test Cell (2009) (7)
- Waste-Heat Driven Miniature Absorption Refrigeration System Using Ionic-Liquid as a Working Fluid (2011) (7)
- 3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications (2015) (7)
- Selection and Evaluation of Organosilicon Coolants for Direct Immersion Cooling of Electronic Systems (2012) (7)
- Prediction of Transient Thermal Behavior of Planar Interconnect Architecture Using Proper Orthogonal Decomposition Method (2011) (7)
- Forced Convection in a Microchannel Heat Sink Using Carbon Nanotubes for Heat Transfer Enhancement (2004) (7)
- Design and Parametric Study of Microfluidic Cooling Manifold for 2.5D-SICs with Dielectric Coolant (2018) (6)
- Scaling Analysis of Performance Tradeoffs in Electronics Cooling (2009) (6)
- Boiling of Water at Sub-Atmospheric Conditions With Enhanced Structures: Effect of Liquid Fill Volume (2006) (6)
- Rapid multi-scale transient thermal modeling of packaged microprocessors using hybrid approach (2012) (6)
- Scanning Joule Expansion Microscopy of a Constriction in Thin Metallic Film (2005) (6)
- Screening and Evaluation of Mixture Formulations for Electronics Thermal Management Using Pool Boiling (2011) (6)
- Modeling Thermal Mass of a Data Center Validated With Actual Data due to Chiller Failure (2011) (6)
- Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation (2015) (6)
- Exergy Analysis of an Absorption Refrigeration System Using an Iconic Liquid as a Working Fluid in the Chemical Compressor (2012) (6)
- Reduced order modeling of power electronics cabinet with double-sided cooling (2008) (6)
- Data Center Cooling Optimization: Ambient Intelligence Based Load Management (AILM) (2009) (6)
- Wall plume at extreme prandtl numbers (1987) (6)
- A Reduced Order Modeling Framework for Thermal Modeling of Shipboard Power Electronics Cabinets (2006) (6)
- Performance analysis of air-cooled microchannel absorber in absorptionbased miniature electronics cooling system (2008) (6)
- Interconnect thermal management of high power packaged electronic architectures (2004) (5)
- CFD study of flow boiling in silicon microgaps with staggered pin fins for the 3D-stacking of ICs (2016) (5)
- A Proper Orthogonal Decomposition Based System-Level Thermal Modeling Methodology for Shipboard Power Electronics Cabinets (2008) (5)
- Thermal Performance of Metal Foam Heat Sink with Pin Fins for Non-Uniform Heat Flux Electronics Cooling (2019) (5)
- Anemometric tool for air flow rate measurement through perforated tiles in a raised floor data center (2015) (5)
- Numerical and Experimental Investigation of Shell-and-Tube Phase-Change Material Thermal Energy Storage Unit (2016) (5)
- Thermal Issues in Emerging Technologies (2011) (5)
- Performance and Integration Implications of Addressing Localized Hotspots Through Two Approaches: Clustering of Micro Pin-Fins and Dedicated Microgap Coolers (2015) (5)
- Application of Thermoelectric-Adsorption Cooler for Harsh Environment Electronics Under Varying Heat Load (2010) (5)
- Multi-scale thermal modeling of glass interposer for mobile electronics application (2016) (5)
- Single-Phase Microfluidic Cooling of 2.5D-SICs for Heterogeneous Integration (2020) (5)
- Evaluation of modified body force (MBF) model for rapid air flow modeling through perforated tiles (2015) (5)
- Active Fluidic Cooling on Energy Constrained System-on-Chip Systems (2017) (5)
- Multiscale Transient Thermal Analysis of Microelectronics (2015) (5)
- Boiling of Water at Sub-Atmospheric Conditions With Enhanced Structures (2005) (5)
- Effect of Supply Air Temperature on Rack Cooling in a High Density Raised Floor Data Center Facility (2011) (5)
- An Experimental Study of Plane Plumes in Cold Water (1983) (5)
- Application of Compact Model Methodologies to Natural Convection Cooling of an Array of Electronic Packages in a Low Profile Enclosure (1997) (5)
- MITIGATING HOT SPOTS IN PLANAR AND THREE-DIMENSIONAL (3D) HETEROGENEOUS MICROSYSTEMS USING LIQUID COOLING (2017) (5)
- Measurement of Air Flow Rate Sensitivity to the Differential Pressure Across a Server Rack in a Data Center (2015) (5)
- Reduced-order modeling framework for improving spatial resolution of data center transient air temperatures (2013) (4)
- Thermal characterization of planar interconnect architectures under different rapid transient currents using the transmission line matrix and finite element methods (2010) (4)
- Use of Computational Fluid Dynamics in the Design and Optimization of Microchannel Heat Exchangers for Microelectronics Cooling (2005) (4)
- Emerging Data Center Thermal Management and Energy Efficiency Technologies (2012) (4)
- Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap (2021) (4)
- Errata: A new technique for three-dimensional transient heat transfer computations of autogenous arc welding (1990) (4)
- Assessments of Single-Phase Liquid Cooling Enhancement Techniques for Microelectronic Systems (2005) (4)
- Boiling Performance of Flourinert PF 5060 on Confined and Unconfined Wire Meshes Soldered to the Substrate (2005) (4)
- Effect of Condenser Location and Tubing Length on the Performance of a Compact Two-Phase Thermosyphon (2001) (4)
- Multi-Scale Transient Thermal Analysis of Microelectronics (2012) (4)
- Pool Boiling Using Thin Enhanced Structures Under Top-Confined Conditions (2006) (4)
- Heat Out of Small Packages (2001) (4)
- Thermal Characterization of Planar Interconnect Architectures Under Transient Currents (2009) (4)
- Flow boiling of water at sub-atmospheric pressure in staggered micro pin-fin heat sink (2016) (4)
- Passive and Active Thermal Technologies: Modeling and Evaluation (2019) (3)
- Design, microfabrication and thermal characterization of a hotspot cooler testbed for convective boiling experiments in extreme-microgap with integrated micropin-fins (2016) (3)
- Performance of two-step thermoelectric-adsorption heat pump for harsh environment electronics cooling (2010) (3)
- Single Phase Liquid Cooling of High Heat Flux Devices With Local Hotspot in a Microgap With Nonuniform Fin Array (2020) (3)
- Thermal Modeling of Air Cooled Outdoor Digital Displays (2019) (3)
- Computational and Experimental Investigation of Thermal Coupling Between Superlattice Coolers (2014) (3)
- Fluid flow and heat transfer characteristics of liquid cooled foam heat sinks (2004) (3)
- Reduced Order Thermal Models of Multi-Scale Microsystems (2010) (3)
- Measurements and visualizations of transient and steady-state vertical natural convection flow in cold water (1986) (3)
- Novel heat transfer fluids using mixture formulations for electronics thermal management (2010) (3)
- Heat Transfer Characteristics of Suspension Flow Inside a Microchannel (2007) (3)
- Rapid modeling tools for energy analysis of modular data centers (2016) (3)
- Thermal capacitance matching in 3D many-core architectures (2011) (3)
- Extreme-microgap (x-µgap) based hotspot thermal management with refrigerant flow boiling (2016) (3)
- Performance of Thermoelectric Based Regenerative Adsorption Cooling System for Harsh Environment (2009) (3)
- Air cooling of a vented enclosure by combined conduction, natural convection and radiation (1996) (3)
- Thermoelectric Assisted Adsorption Cooling Systems for Harsh Environment Electronics: Issues With Heat Regeneration (2009) (3)
- Thermoelectric Cooler Based Regenerative Adsorption Refrigeration System for High Temperature Electronics (2007) (3)
- Controller to Regulate Maximum Server CPU Temperatures in a Rack by Varying CRAC Supply Air Temperatures (2012) (3)
- Transactions on Components and Packaging Technologies Editors CPMT Transactions Editor-in-Chief (2009) (3)
- Special section on components and packaging technologies with contributions from ITherm 2002 thermal management track (2003) (3)
- On the termination of one-dimensional transport in transient buoyancy induced flow adjacent to a vertical surface (1987) (3)
- EFFECT OF SURFACE WETTABILITY ON FLOW BOILING IN A MICROCHANNEL (2015) (2)
- Multi-scale thermal modeling methodology for electronics cabinets (2006) (2)
- Thermodynamic Design of Compact Thermal Compressor for Sorption Assisted Cryogenic Cooling of Electronics (2005) (2)
- Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method (2012) (2)
- Package Geometry Considerations in Thermal Compact Modeling Strategies (1997) (2)
- Reliability assessment of hydrofoil-shaped micro-pin fins (2016) (2)
- Heat Transfer in Hot Pressing of Saturated Fiber Suspensions (2010) (2)
- Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap (2015) (2)
- Shutter control for cooling air flow management in data center servers (2016) (2)
- Cold Plate Pin-Fin Optimization for Multi-Die Systems Using Design of Experiment (2019) (2)
- Impact of a rotary regenerative heat exchanger on energy efficiency of an air cooled data center (2016) (2)
- Thermal Performance Enhancement of Glass Interposer (2015) (2)
- Computations of solid/liquid phase change in a three-dimensional enclosure by a uniformly dissipating heat source (1995) (2)
- Exploring the Advantages of Materials Design in a Product Design Process (2006) (2)
- Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling (2018) (2)
- Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux (2013) (2)
- Thermal Management of Power Electronics Using Stochastic, Open-Cell Metal Foams (2019) (2)
- Augmented PEEC for direct time-domain thermal and power estimation of Integrated Voltage Regulator architectures arising in Heterogeneous Integration (2020) (2)
- SATURATED AND SUBCOOLED POOL BOILING OF HFE-7200 MIXTURES ON A COPPER NANOWIRE SURFACE (2012) (2)
- Data Center Temperature Control using PI System and MATLAB (2019) (2)
- Characterization of steady and transient heating of interconnects - a review (2011) (2)
- Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches (2021) (2)
- Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor (2014) (2)
- Design of an Absorption Based Miniature Heat Pump System for Cooling of High Power Microprocessors (2007) (2)
- Validation and Parametric Investigations Using a Lumped Thermal Parameter Model of an Internal Permanent Magnet Motor (2020) (2)
- Thermal simulations in support of multi-scale co-design of energy efficient information technology systems (2015) (2)
- Single- and Multiphase Flow for Electronic Cooling (2017) (2)
- Heat Spreading and Heat Removal Needs of a Novel Power Electronics Package with Integrated Cooling (2021) (1)
- Multi-physics Modeling of a Power Electronics Package with Integrated Cooling (2021) (1)
- TRANSIENT NATURAL CONVECTION FLOWS AND NATURAL CONVECTION FLOWS IN POROUS MEDIA (1984) (1)
- Contributions from Thermal Challenges inNext Generation Electronic Systems (THERMES) (2002) (1)
- Dynamics of a liquid plug in a capillary duct powered by vapor explosion (2003) (1)
- Foreword contributions from thermal challenges in next generation electronic systems (THERMES) (2002) (1)
- Performance of an air-cooled heat sink with microscale dimples under transitional flow conditions (2012) (1)
- S3-P9: Thermal and electrical performance of microfluidically cooled 3D ICs with non-uniform power dissipation (2014) (1)
- APPLICATION OF PHASE CHANGE MATERIALS (PCMS) TO THE PASSIVE THERMAL CONTROL OF A PLASTIC QUAD FLAT PACKAGE: EFFECT OF ORIENTATION OF THE PACKAGE (1997) (1)
- Numerical Simulation of Flow and Heat Transfer Inside a Micro-Channel With One Dimpled Surface (2002) (1)
- Three-Dimensional Study of Combined Conduction, Radiation, and Natural Convection From Discrete (1999) (1)
- Regenerative fluid loop concept for performance enhancement of adsorption refrigeration system (2006) (1)
- A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects (2005) (1)
- Two-Phase Heat Transfer and Flow Regimes in Pin Fin-Enhanced Microgaps—Effect of Pin Spacing (2021) (1)
- Design, Characterization, and Application of a Field-Programmable Thermal Emulation Platform (2016) (1)
- Thermal performance analysis of bi-porous metal foam heat sink (2016) (1)
- A23-016 MICRO-FABRICATED THERMAL MANAGEMENT SYSTEMS FOR LIQUID COOLING OF HIGH POWER CHIPS (2003) (1)
- Natural Convection from an Array of Electronic Packages Mounted on a Horizontal Board in a Narrow Aspect Ratio Enclosure (1996) (1)
- Rapid Transient Thermal Analysis of Three-Dimensional Interconnect Structures Using Proper Orthogonal Decomposition Method (2012) (1)
- Mixed Convection Liquid Cooling of Discrete Heat Sources in a Vertical Channel (1993) (1)
- Thermal Modeling of Outdoor Digital Displays Under Different Brightness Outputs (2020) (1)
- Some Aspects of Microchannel Heat Transfer (2021) (1)
- Carbon Nanotube (CNT) Fins for Forced Convection Cooling of High Power Microprocessors (2006) (1)
- Dielectric Fluids for the Direct Forced Convection Cooling of Power Electronics (2021) (1)
- Thermal Management of Outdoor Digital Displays - A Review (2019) (1)
- Energy Simulations of Data Centers With Hybrid Liquid/Air Cooling and Waste Heat Re-Use (2016) (1)
- Experimental Investigations of Natural Convection in Vented Compact Enclosures (1998) (1)
- Gas Assisted Thin-Film Evaporation for Hotspot Thermal Management (2010) (1)
- Liquid Cooling of Electronic Devices by Single-Phase Convection; Frank P. Incropera (2001) (1)
- Multiphysics challenges with Heterogeneous Integrated Voltage Regulator based Power Delivery Architectures (2020) (1)
- Thermal characteristics of TIMs with elliptical particles (2010) (1)
- Perspiration Nano-Patch for Hot Spot Thermal Management (2007) (1)
- Performance of a Thermoelectric Adsorption Heat Pump Vis-à-Vis Thermoelectric Device and Adsorption Heat Pump for Electronics Cooling Applications (2012) (1)
- Genetic algorithm based cooling energy optimization of data centers (2021) (1)
- A Comprehensive CFD Study of Tile Flow Rate Distribution in a Compact Data Center Laboratory (2020) (1)
- A Numerical Investigation of Additive Manufactured Foam Structures for Single Phase Hotspot Thermal Management (2019) (1)
- A Novel Compact Method for Thermal Modeling of On-Chip Interconnects Based on the Finite Element Method (2003) (1)
- Dynamic Load Balancing Using Actual Workload Traces Based on Central Processing Unit Temperatures (2019) (1)
- Experimental characterization of in-package microfluidic cooling on a System-on-Chip (2015) (1)
- Predicting Thermal Characteristics of Particle Laden Thermal Interface Materials (2009) (1)
- Erratum: “An Experimental Study of Natural Convection Cooling of an Array of Heated Protrusions in a Vertical Channel in Water” (Journal of Electronic Packaging, 1989, 111, pp. 33–40) (1989) (0)
- Compact SiC Power Module With Integrated Power Delivery and Cooling (2022) (0)
- Integrated Thermal Analysis of an Automotive Electronic System (2000) (0)
- Convective Heat Transfer in a Channel in the Presence of Solid Particles (2007) (0)
- Foreword Special Issue of Components and Packaging Technologies With Contributions From ITherm 2004 Thermal Management Track (2005) (0)
- Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model (2021) (0)
- Experimental and numerical studies on three dimensional GTA weld pool convection: Non-axisymmetric effects (1995) (0)
- A General-Purpose Finite-Difference Code for Solving Steady-State Three- Dimensional Fluid-Flow and Heat Transfer Problems. (1991) (0)
- Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices (2022) (0)
- Evaporative Cooling of High Power Density Motors: Design and Analysis (2022) (0)
- A Multigrid Based Multi-Scale Thermal Analysis Approach for Conjugate Problems Involving Discrete Heating (2003) (0)
- Numerical and Experimental Investigation of Shell-and-Tube Phase Change Material Thermal Storage Unit (2015) (0)
- Compact Model Based Microfluidic Controller for Energy Efficient Thermal Management of Single Tier and 3D Chips (2012) (0)
- Three-Dimensional Study of Combined Conduction, Radiation, and Natural Convection from an Array of Discrete Heat Sources on a Horizontal Board in a Narrow-Aspect-Ratio Enclosure (1999) (0)
- Synthesized Experiments and Analysis of Microchannel Heat Sinks in Electronics Packaging (2006) (0)
- Simulation and Experimental Investigation of Single and Two-phase Cold Plate Using HFE-7200 with Discrete Heat Sources (2022) (0)
- Thermal-Fluid Structural Interaction Modeling of Outdoor Digitial Displays (2021) (0)
- Joule Heating and Thermal Conductivity Determination of Nanoscale Metallic Thin Films and Interconnects (2005) (0)
- CFD simulations of a data center to train an artificial neural network model (2018) (0)
- Keynote Lecture: Micro and Meso Scale Compact Heat Exchangers in Electronics Thermal Management – Review (2005) (0)
- Visualization of Flow Boiling of R 245 fa in a Microgap with Integrated Staggered Pin Fins (2016) (0)
- Augmented finite element method (AFEM) for the linear steady-state thermal and thermomechanical analysis of heterogeneous integration architectures (2021) (0)
- Welcome to ITHERM 2006 (2006) (0)
- Closure to “Discussion of ‘Effect of Tip Clearance on the Thermal and Hydrodynamic Performance of a Shrouded Pin Fin Array’ ” (2006, ASME J. Heat Transfer, 128, pp. 855–856) (2006) (0)
- OPTIMAL LIQUID COOLING PERFORMANCE OF 2.5D-SICS WITH PIN-FIN ENHANCED MICRO-GAPS USING DESIGN OF EXPERIMENT (2018) (0)
- Comparison between Direct Winding Heat Exchanger and Slot-liner Confined Evaporative Cooling of Electric Motor (2022) (0)
- Compact Model Based Microfluidic Controller for Energy Efficient Thermal Management Using Pin-Fin Enhanced Micro Gap (2013) (0)
- MULTISCALE TRANSIENT THERMAL ANALYSIS OF MICROELECTRONICS FEATURE (2015) (0)
- Improved compact thermal model for studying 3-D interconnect structures with low-k dielectrics (2008) (0)
- CYTOP for bonding highly oriented pyrolytic graphite to be used as heat spreader in mobile devices (2022) (0)
- GAS-ASSISTED EVAPORATION HEAT AND MASS TRANSFER (2016) (0)
- Electrical-Thermal Co-Design of Microsystems (2014) (0)
- Selected papers from ThermaComp 2016, July 6-8, 2016, Georgia Tech, Atlanta, USA (2018) (0)
- Other Air Delivery Schemes (2016) (0)
- CRAC Heat Exchanger Response to Step Change in Chilled Water Flowrate (2009) (0)
- Crossing the length scale divide to address thermal challenges for sustainable data centers (2012) (0)
- Packaging Environmental Sensors for Monitoring Urban-Microclimates (2020) (0)
- Pool Boiling of Mixtures for Electronics Thermal Management (2010) (0)
- Hybrid Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots (2010) (0)
- A Study on Thermal Performance of Simulated Chip using a Two Phase Cooling System in a Laptop Computer (2011) (0)
- ENERGY EFFICIENT SOLID-STATE COOLING FOR HOT SPOT REMOVAL (2014) (0)
- Book Review Corner (2002) (0)
- ITherm 2004 Organizing Committee (2004) (0)
- Numerical Simulation of Pool Boiling from Artificial Cavities Using the Phase Field Method (2014) (0)
- Corrections to “Selection and Evaluation of Organosilicon Coolants for Direct Immersion Cooling of Electronic Systems” (2013) (0)
- THERMAL MANAGEMENT TECHNOLOGIES FOR 3D STACKED ICS (2015) (0)
- Cold Aisle Containment (2016) (0)
- Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components (2019) (0)
- Novel Immersion Cooling Technique for a 3D Chip Stack (2013) (0)
- A New Tile Model for Air Flow Distribution in a Full-Featured Data Center with Raised Floor Plenum (2021) (0)
- Hierarchical multiscale simulations for data center cooling (2016) (0)
- Electrification Annual Progress Report (FY2019) (2020) (0)
- Data Driven Modeling Advancements for Thermal Predictions in Data Center Applications (2022) (0)
- a Cabinet Level Thermal Test Vehicle to Evaluate Hybrid Double-Sided Cooling Schemes (2015) (0)
- Visualization of Pool Boiling From Plain and Enhanced Structures (2005) (0)
- REDUCED-ORDER MODELING OF TURBULENT FLOWS IN MULTISCALE DOMAINS (2006) (0)
- MEMS-Based Test Structures for IC Technology (1998) (0)
- Boiling at Subatmospheric Pressures with Enhanced Structures (2009) (0)
- Energy-Efficient Task Distribution Using Neural Network Temperature Prediction in a Data Center (2019) (0)
- Effects of power pulsations on natural convection from discrete heat sources. (1993) (0)
- Special Issue With Contributions From ITherm 2004 (2006) (0)
- Cooling Air Delivery Through Perforated Tiles (2016) (0)
- Application of Block-Implicit Multigrid Approach to Heat Transfer Problems Involving Discrete Heating (1998) (0)
- Flow Boiling in Flexible Polymer Microgaps for Embedded Cooling in High-Power Applications (2023) (0)
- Passive Thermal Control of Electronic Equipment (1998) (0)
- Packaging Environmental Sensors for an Internet-of-Things Solution for Urban-Microclimate Studies (2019) (0)
- EFFECTS OF CLAMP LOCATION IN GAS TUNGSTEN ARC WELDING PROCESS (1994) (0)
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What Schools Are Affiliated With Yogendra Kumar Joshi?
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